Patents by Inventor Ameet S. Bhansali

Ameet S. Bhansali has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding surface and bonding method
    Patent number: 6265300
    Abstract: A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
    Type: Grant
    Filed: November 18, 1993
    Date of Patent: July 24, 2001
    Assignee: Intel Corporation
    Inventors: Ameet S. Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen, Nicholas P. Mencinger, Ching C. Lee, Kevin Jeng
  • Method for coupling surface mounted capacitors to semiconductor packages
    Patent number: 5842626
    Abstract: A low cost method for mechanically and electrically coupling a surface mounted capacitor to a semiconductor package. In one embodiment a metal coating is deposited over the electrodes of a capacitor. Concurrently, or at some other time, solder paste is applied to the electrical contact pads of a semiconductor package. The connection between the capacitor and package is made by positioning the metal coated regions of the capacitor over the electrical contact pads of the package and running the unit through a reflow furnace where the solder paste is wetted onto the metal coating of the capacitor and onto the electrical contact pads of the package.
    Type: Grant
    Filed: October 24, 1997
    Date of Patent: December 1, 1998
    Assignee: Intel Corporation
    Inventors: Ameet S. Bhansali, Rama K. Shukla
  • Bonding pad structure having an interposed rigid layer
    Patent number: 5567981
    Abstract: A bonding pad structure for use with compliant dielectric materials and a method for wire bonding is described in which a rigid layer is formed between the bonding pad and the compliant dielectric layer. The rigid layer increases the stiffness of the bonding structure such that an effective bond may be achieved by conventional ultrasonic and thermosonic bonding methods.
    Type: Grant
    Filed: March 31, 1993
    Date of Patent: October 22, 1996
    Assignee: Intel Corporation
    Inventors: Ameet S. Bhansali, Gay M. Samuelson, Venkatesan Murali, Michael J. Gasparek, Shou H. Chen, Nicholas P. Mencinger, Ching C. Lee, Kevin Jeng