Patents by Inventor Amey Anant APTE

Amey Anant APTE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS ON BOTH SIDES OF THE DIE
    Publication number: 20230317653
    Abstract: Embodiments herein relate to systems, apparatuses, techniques or processes for hybrid bonding a die to a substrate. In embodiments, the die may be a chiplet that is bonded to an interconnect. In embodiments, the die may be a plurality of dies, where the plurality of dies are hybrid bonded to a substrate, to each other, or a combination of both. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 5, 2023
    Inventors: Hongxia FENG, Xiaoxuan SUN, Amey Anant APTE, Dingying David XU, Sairam AGRAHARAM, Gang DUAN, Ashay DANI