Abstract: A powder coating apparatus which can form a thin film in which freely selected elements are combined without an impurity being mixed and satisfies that a composition of the obtained thin film is uniform. The powder coating apparatus according to the present invention is a powder coating apparatus including a barrel, exhaust device for evacuating an inside of the barrel, and a sputtering device installed inside the barrel, the barrel having a main axis C directed in a horizontal direction and rotating around the main axis, the sputtering device forming a coating film on a surface of powder put in the barrel, in which the sputtering device has one fixing portion for one target to mount two or more targets, and respective targets are disposed in parallel to each other at the same level position with respect to a direction of the main axis when the target is mounted on the fixing portion.

Abstract: Method of producing a target having a small average crystal grain size of gold or platinum and having a uniform crystal grain size in an in-plane direction of a target surface and a thickness direction of the target in order to further stabilize film deposition characteristics during sputtering.

Abstract: A powder coating apparatus which can form a thin film in which freely selected elements are combined without an impurity being mixed and satisfies that a composition of the obtained thin film is uniform. The powder coating apparatus according to the present invention is a powder coating apparatus including a barrel, exhaust device for evacuating an inside of the barrel, and a sputtering device installed inside the barrel, the barrel having a main axis C directed in a horizontal direction and rotating around the main axis, the sputtering device forming a coating film on a surface of powder put in the barrel, in which the sputtering device has one fixing portion for one target to mount two or more targets, and respective targets are disposed in parallel to each other at the same level position with respect to a direction of the main axis when the target is mounted on the fixing portion.

Abstract: Method of producing a target having a small average crystal grain size of gold or platinum and having a uniform crystal grain size in an in-plane direction of a target surface and a thickness direction of the target in order to further stabilize film deposition characteristics during sputtering.