Patents by Inventor Amileth Dejan Cabrera

Amileth Dejan Cabrera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10297500
    Abstract: A method of dicing a bowed or warped semiconductor wafer includes cutting along the saw streets in a first direction on a first half of the wafer, where the first direction is parallel to the bowing, cutting along the saw streets in the first direction on a second half of the wafer opposite to the first half, and step-cutting along the saw streets in the second direction, such that all of the dies are separated from each other, and the sides of the die in the bowing direction are flat and the sides of the die perpendicular to the bowing direction are stepped.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: May 21, 2019
    Assignee: Nexperia B.V.
    Inventors: Crispulo Estira Lictao, Jr., Pitak Seantumpol, Siriluck Wongratanaporngoorn, Matthew Mondala Fernandez, Amileth Dejan Cabrera
  • Publication number: 20180174907
    Abstract: A method of dicing a bowed or warped semiconductor wafer includes cutting along the saw streets in a first direction on a first half of the wafer, where the first direction is parallel to the bowing, cutting along the saw streets in the first direction on a second half of the wafer opposite to the first half, and step-cutting along the saw streets in the second direction, such that all of the dies are separated from each other, and the sides of the die in the bowing direction are flat and the sides of the die perpendicular to the bowing direction are stepped.
    Type: Application
    Filed: December 15, 2016
    Publication date: June 21, 2018
    Inventors: Crispulo Estira Lictao, JR., Pitak Seantumpol, Siriluck Wongratanaporngoorn, Matthew Mondala Fernandez, Amileth Dejan Cabrera