Patents by Inventor Amip Shah
Amip Shah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8832012Abstract: Tree discovery systems and methods are disclosed. An example of a method is carried out by program code stored on non-transient computer-readable medium and executed by a processor. The method may include identifying in computer-readable medium a first node for a system under consideration, each node in the computer-readable medium representing a characteristic of a component. The method may include selecting at least a second node from the computer-readable medium for the first node. The method may include discovering in the computer-readable medium at least one system tree for the system under consideration based on the first node and the at least second node.Type: GrantFiled: October 26, 2011Date of Patent: September 9, 2014Assignee: Hewlett-Packard Development Company, L. P.Inventors: Naren Sundaravaradan, Debprakash Patnaik, Manish Marwah, Amip Shah, Naren Ramakrishnan
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Patent number: 8831785Abstract: A system for multi-stage control of humidity in fluid flow supplied to at least one information technology apparatus includes a sensor, a first stage apparatus configured to vary humidity levels in the fluid flow, and a second stage apparatus positioned downstream of the first stage apparatus along the fluid flow to further vary humidity levels in the fluid flow. The system also includes a controller configured to receive environmental condition information from the sensor, to determine whether the information indicates that the humidity level is outside of a predetermined range, and to manipulate an operation of at least one of the first stage apparatus and the second stage apparatus to vary the humidity level in the fluid flow in response to the information indicating that the humidity level is outside of the predetermined range.Type: GrantFiled: October 30, 2008Date of Patent: September 9, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Amip Shah, Cullen Bash
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Patent number: 8732706Abstract: In a method of generating governing metrics, a high-level goal to be met in a provisioned system is identified. In addition, a low-level governing policy designed to facilitate achievement of the high-level goal is selected and properties relating to the selected low-level governing policy are identified. The identified properties are formulated to define governing metrics relevant to the selected low-level governing policy and the formulated governing metrics are outputted. The formulated governing metrics are configured to be used in at least one of evaluating and controlling resource provisioning in the provisioned system.Type: GrantFiled: October 20, 2008Date of Patent: May 20, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Amip Shah, Ratnesh Sharma, Cullen Bash, Chandrakant Patel
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Patent number: 8626355Abstract: In a method for managing cooling provisioning in a three-dimensional package containing a plurality of stacked die with a cooling system having at least one active cooling mechanism, at least one of workload on and an environmental condition at or around one of the plurality of stacked die is identified. In addition, at least one of the active cooling mechanism and the one of the plurality of stacked die is controlled based upon at least one of the identified workload and environmental condition.Type: GrantFiled: April 1, 2008Date of Patent: January 7, 2014Assignee: Hewlett-Packard Development Company, L. P.Inventors: Amip Shah, Chandrakant Patel
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Patent number: 8560141Abstract: In a method for managing at least one three-dimensional package and a cooling system having at least one active cooling mechanism configured to cool the at least one three-dimensional package, at least one of workload on and an environmental condition on or around the at least one three-dimensional package is identified. In addition, at least one of an active cooling mechanism and a three-dimensional package is controlled based upon at least one of the identified workload and environmental condition.Type: GrantFiled: April 1, 2008Date of Patent: October 15, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: Amip Shah, Chandrakant Patel
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Patent number: 8498841Abstract: Methods and apparatus are provided for use with thermal electric cooling devices (TECDs). An apparatus is mapped so as to identify the heat dissipating entities and zones thereof. A first cooling plan is devised in accordance with the mapping, the cooling plan being dependant upon TECDs. At least one other cooling plan is devised that is distinct from the first cooling plan. The coefficient of performance (COP) for each of the cooling plans is calculated. One of the cooling plans is selected and implemented in accordance with a comparison of the COPs. Precision, zone-oriented cooling is provided, avoiding excessive material scale and wasted energy.Type: GrantFiled: April 21, 2010Date of Patent: July 30, 2013Assignee: Hewlett-Packard Development Company, L.P.Inventors: Amip Shah, Chandrakant Patel
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Publication number: 20120185421Abstract: Tree discovery systems and methods are disclosed. An example of a method is carried out by program code stored on non-transient computer-readable medium and executed by a processor. The method may include identifying in computer-readable medium a first node for a system under consideration, each node in the computer-readable medium representing a characteristic of a component. The method may include selecting at least a second node from the computer-readable medium for the first node. The method may include discovering in the computer-readable medium at least one system tree for the system under consideration based on the first node and the at least second node.Type: ApplicationFiled: October 26, 2011Publication date: July 19, 2012Inventors: Naren Sundaravaradan, Debprakash Patnaik, Manish Marwah, Amip Shah, Naren Ramakrishnan
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Patent number: 8212230Abstract: Embodiments include methods, apparatus, and systems with integrated circuits having phase change devices. One embodiment includes an integrated circuit die and a phase change die having a phase change material that changes phases when a temperature at the integrated circuit die exceeds a threshold for a predetermined amount of time.Type: GrantFiled: September 25, 2011Date of Patent: July 3, 2012Assignee: Hewlett-Packard Development Company, L.P.Inventors: Amip Shah, Chandrakant Patel, Ratnesh Sharma, Cullen Bash
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Publication number: 20120020150Abstract: Embodiments include methods, apparatus, and systems with integrated circuits having phase change devices. One embodiment includes an integrated circuit die and a phase change die having a phase change material that changes phases when a temperature at the integrated circuit die exceeds a threshold for a predetermined amount of time.Type: ApplicationFiled: September 25, 2011Publication date: January 26, 2012Inventors: Amip Shah, Chandrakant Patel, Ratnesh Sharma, Cullen Bash
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Patent number: 8053748Abstract: Embodiments include methods, apparatus, and systems with integrated circuits having phase change devices. One embodiment includes an integrated circuit die and a phase change die having a phase change material that changes phases when a temperature at the integrated circuit die exceeds a threshold for a predetermined amount of time.Type: GrantFiled: October 20, 2008Date of Patent: November 8, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Amip Shah, Chandrakant Patel, Ratnesh Sharma, Cullen Bash
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Publication number: 20110264433Abstract: Methods and apparatus are provided for use with thermal electric cooling devices (TECDs). An apparatus is mapped so as to identify the heat dissipating entities and zones thereof. A first cooling plan is devised in accordance with the mapping, the cooling plan being dependant upon TECDs. At least one other cooling plan is devised that is distinct from the first cooling plan. The coefficient of performance (COP) for each of the cooling plans is calculated. One of the cooling plans is selected and implemented in accordance with a comparison of the COPs. Precision, zone-oriented cooling is provided, avoiding excessive material scale and wasted energy.Type: ApplicationFiled: April 21, 2010Publication date: October 27, 2011Inventors: Amip Shah, Chandrakant Patel
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Publication number: 20110264277Abstract: A system for multi-stage control of humidity in fluid flow supplied to at least one information technology apparatus includes a sensor, a first stage apparatus configured to vary humidity levels in the fluid flow, and a second stage apparatus positioned downstream of the first stage apparatus along the fluid flow to further vary humidity levels in the fluid flow. The system also includes a controller configured to receive environmental condition information from the sensor, to determine whether the information indicates that the humidity level is outside of a predetermined range, and to manipulate an operation of at least one of the first stage apparatus and the second stage apparatus to vary the humidity level in the fluid flow in response to the information indicating that the humidity level is outside of the predetermined range.Type: ApplicationFiled: October 30, 2008Publication date: October 27, 2011Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.Inventors: Amip Shah, Cullen Bash
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Publication number: 20110029153Abstract: In a method for managing cooling provisioning in a three-dimensional package containing a plurality of stacked die with a cooling system having at least one active cooling mechanism, at least one of workload on and an environmental condition at or around one of the plurality of stacked die is identified. In addition, at least one of the active cooling mechanism and the one of the plurality of stacked die is controlled based upon at least one of the identified workload and environmental condition.Type: ApplicationFiled: April 1, 2008Publication date: February 3, 2011Inventors: Amip Shah, Chandrakant Patel
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Publication number: 20110029154Abstract: In a method for managing at least one three-dimensional package and a cooling system having at least one active cooling mechanism configured to cool the at least one three-dimensional package, at least one of workload on and an environmental condition on or around the at least one three-dimensional package is identified. In addition, at least one of an active cooling mechanism and a three-dimensional package is controlled based upon at least one of the identified workload and environmental condition.Type: ApplicationFiled: April 1, 2008Publication date: February 3, 2011Inventors: Amip Shah, Chandrakant Patel
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Publication number: 20100305923Abstract: In a method of synthesizing components to design a system meeting an exergy loss target value, one or more candidate sets of components are synthesized and an exergy loss value for each of the one or more candidate sets of components are calculated. A determination as to whether at least one of the candidate set of components meets the exergy loss target value is made and at least one candidate set of components determined to meet the exergy loss target value is identified as the set of components for use in the design of the system.Type: ApplicationFiled: November 27, 2007Publication date: December 2, 2010Inventors: Amip Shah, Ratnesh Kumar Sharma, Chih C. Shih, Cullen E. Bash, Chandrakant Patel, Abdlmonem Beitelal
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Publication number: 20090159866Abstract: Embodiments include methods, apparatus, and systems with integrated circuits having phase change devices. One embodiment includes an integrated circuit die and a phase change die having a phase change material that changes phases when a temperature at the integrated circuit die exceeds a threshold for a predetermined amount of time.Type: ApplicationFiled: October 20, 2008Publication date: June 25, 2009Inventors: Amip Shah, Chandrakant Patel, Ratnesh Sharma, Cullen Bash
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Publication number: 20090138888Abstract: In a method of generating governing metrics, a high-level goal to be met in a provisioned system is identified. In addition, a low-level governing policy designed to facilitate achievement of the high-level goal is selected and properties relating to the selected low-level governing policy are identified. The identified properties are formulated to define governing metrics relevant to the selected low-level governing policy and the formulated governing metrics are outputted. The formulated governing metrics are configured to be used in at least one of evaluating and controlling resource provisioning in the provisioned system.Type: ApplicationFiled: October 20, 2008Publication date: May 28, 2009Inventors: Amip Shah, Ratnesh Sharma, Cullen Bash, Chandrakant Patel
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Publication number: 20090138112Abstract: In a method of designing an apparatus formed of at least one component to substantially minimize exergy destruction, at least one of one or more candidate materials and one or more candidate processes are identified. The one or more candidate materials are capable of being used in forming the at least one component and the one or more candidate processes are associated with either or both of the one or more candidate materials and the at least one component. Exergy destruction values of at least one of the one or more candidate materials and the one or more candidate processes are determined. In addition, at least one of the one or more candidate materials and the one or more candidate processes having the substantially lowest exergy destruction values are selected for the apparatus design.Type: ApplicationFiled: October 20, 2008Publication date: May 28, 2009Inventors: Amip Shah, Chandrakant Patel, Ratnesh Sharma, Cullen Bash, Abdlmonem Beitelmal