Patents by Inventor Amir Esmaili

Amir Esmaili has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for RF isolation in a packaged integrated circuit
    Patent number: 10826195
    Abstract: Illustrative embodiments significantly improve RF isolation in a packaged integrated circuit by separating the pins/pads associated with multiple RF channels from one another and also from pins/pads associated with digital circuits. Specifically, in certain exemplary embodiments, the integrated circuit is configured with the pins/pad for the digital circuits on a first edge of the chip, the pins/pads for common RF signals on a second edge of the chip opposite the first edge, and the pins/pads for the individual RF channels on third and fourth edges of the chip. The pins/pads associated with each RF channel may include multiple pins/pads (an “RF group”) and may have a central RF pin/pad with a ground pin/pad on each side of the central RF pin/pad. One or more ground pins/pads may be placed between adjacent RF groups on a given edge of the chip.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: November 3, 2020
    Assignee: ANOKIWAVE, INC.
    Inventors: Kristian N. Madsen, Vipul Jain, Amir Esmaili, Chad Cookinham, Noyan Kinayman, Shamsun Nahar, David W. Corman, Nitin Jain
  • Apparatus and Method for RF Isolation in a Packaged Integrated Circuit
    Publication number: 20180287266
    Abstract: Illustrative embodiments significantly improve RF isolation in a packaged integrated circuit by separating the pins/pads associated with multiple RF channels from one another and also from pins/pads associated with digital circuits. Specifically, in certain exemplary embodiments, the integrated circuit is configured with the pins/pad for the digital circuits on a first edge of the chip, the pins/pads for common RF signals on a second edge of the chip opposite the first edge, and the pins/pads for the individual RF channels on third and fourth edges of the chip. The pins/pads associated with each RF channel may include multiple pins/pads (an “RF group”) and may have a central RF pin/pad with a ground pin/pad on each side of the central RF pin/pad. One or more ground pins/pads may be placed between adjacent RF groups on a given edge of the chip.
    Type: Application
    Filed: March 28, 2018
    Publication date: October 4, 2018
    Inventors: Kristian N. Madsen, Vipul Jain, Amir Esmaili, Chad Cookinham, Noyan Kinayman, Shamsun Nahar, David W. Corman, Nitin Jain
  • Method and apparatus for mitigating parasitic coupling in a packaged integrated circuit
    Patent number: 9455157
    Abstract: A packaged IC has a package with a die paddle, a signal lead, and a ground lead. The packaged IC also has a die, secured to the package, with a ground pad and a signal pad. The signal pad is electrically connected to the signal lead, and the ground pad is electrically connected to both the die paddle and the ground lead.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: September 27, 2016
    Assignee: Anokiwave, Inc.
    Inventors: Vipul Jain, Noyan Kinayman, Amir Esmaili, Guarav Menon, Nitin Jain