Abstract: An electrical contact pin is intended for pressing into a hole which is provided in a circuit carrier board and has a circumferential wall with a metallized surface. The contact pin consists mainly of copper or of a copper alloy and is surrounded by a layer which includes tin at least in a part region which is to be pressed into the hole. The layer, which includes tin, forms the surface of the contact pin and includes substantially only tin and tin oxide, wherein the tin oxide is formed by way of electrolytic oxidation and the concentration thereof is greatest on the surface of the layer.

Abstract: Systems and methods are provided to facilitate a distribution of information via one or more dynamically loadable components. According to one embodiment, one or more items of information are collected (e.g., from one or more information sources). The collected information is then evaluated via a dynamically loadable aggregation rule associated with a user. Based on this evaluation, it may be arranged for the user to receive notification information. According to some embodiments, it is also arranged for the user receive priority information (e.g., via a wireless device).

Abstract: Systems and methods are provided to facilitate a distribution of information via one or more dynamically loadable components. According to one embodiment, one or more items of information are collected (e.g., from one or more information sources). The collected information is then evaluated via a dynamically loadable aggregation rule associated with a user. Based on this evaluation, it may be arranged for the user to receive notification information. According to some embodiments, it is also arranged for the user receive priority information (e.g., via a wireless device).