Abstract: An antenna system for at least one of Elint and Sigint, configured to detect weak electro-magnetic signals, comprises an antenna and a feed manifold, which comprises a plurality of feeds located on a focal surface of the antenna. The antenna is configured to function as a two-dimensional focusing element, having spherical symmetry. The system is configured such that a planar wave-front associated with a electro-magnetic signal, that is impinging on the antenna, is focused by the antenna to a feed, situated at a distance from the antenna corresponding to a focal distance of the antenna along a propagation vector of the wave-front. The spatial field of view of the antenna system is based on a number of feeds and the spacing between feeds. This produces, for each feed, a respective high-gain beam, with direction along the line connecting the center of the spherical symmetry and the feed.

Abstract: An array antenna configured to be placed at a determined position above the ground surface. The array antenna is assembled by a plurality of unmanned aerial vehicles (UAVs), each UAV carrying one or more antenna elements of the array antenna. The plurality of UAVs configured to create a defined formation at the determined position above the ground and thereby align the one or more antenna elements carried by the UAVs to form the array antenna. The array antenna configured to receive electromagnetic signals reflected from a region of interest, or from one or more objects, within its line of sight.

Abstract: An array antenna configured to be placed at a determined position above the ground surface. The array antenna is assembled by a plurality of unmanned aerial vehicles (UAVs), each UAV carrying one or more antenna elements of the array antenna. The plurality of UAVs configured to create a defined formation at the determined position above the ground and thereby align the one or more antenna elements carried by the UAVs to form the array antenna. The array antenna configured to receive electromagnetic signals reflected from a region of interest, or from one or more objects, within its line of sight.

Abstract: A reflective antenna comprising a flexible reflective sheet extending between a central hub and a perimeter edge, and a reflective sheet support mechanism comprising one or more spiral ribs articulated to the reflector sheet at least at several locations along the perimeter edge of the reflective sheet; wherein at a collapsed, stowed position of the reflective antenna the one or more spiral ribs are coiled about a common center and the reflective sheet is folded at a compact configuration, and at an expanded, deployed position the one or more spiral ribs are radially expanded and the reflective sheet is stretched over the expanded one or more spiral ribs, imparting the reflective sheet a parabolic shape.

Abstract: A reflective antenna comprising a flexible reflective sheet extending between a central hub and a perimeter edge, and a reflective sheet support mechanism comprising one or more spiral ribs articulated to the reflector sheet at least at several locations along the perimeter edge of the reflective sheet; wherein at a collapsed, stowed position of the reflective antenna the one or more spiral ribs are coiled about a common center and the reflective sheet is folded at a compact configuration, and at an expanded, deployed position the one or more spiral ribs are radially expanded and the reflective sheet is stretched over the expanded one or more spiral ribs, imparting the reflective sheet a parabolic shape.

Abstract: A deployable antenna array is provided having at least one boresight axis, and including a first plurality of first antenna array elements and a second plurality of second antenna array elements separate from the first plurality of first antenna array elements, the antenna array being configured for being selectively deployable at least from a stowed configuration to a deployed configuration. A radar system including an antenna array, a telecommunication system including an antenna array, and a method for deploying an antenna array are also provided.

Abstract: A system for injecting and guiding millimeter-waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB. Optionally, the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity.

Abstract: A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity.

Abstract: A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads.

Abstract: A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.

Abstract: A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.

Abstract: A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.

Abstract: A deployable antenna array is provided having at least one boresight axis, and including a first plurality of first antenna array elements and a second plurality of second antenna array elements separate from the first plurality of first antenna array elements, the antenna array being configured for being selectively deployable at least from a stowed configuration to a deployed configuration. A radar system including an antenna array, a telecommunication system including an antenna array, and a method for deploying an antenna array are also provided.

Abstract: A system enabling interface between a millimeter-wave bare-die and a Printed Circuit Board (PCB). A cavity of depth X is formed in at least one lamina of a PCB. Three electrically conductive pads are printed on one of the laminas of the PCB, the pads optionally reach the edge of the cavity. A bare-die Integrated Circuit having a thickness of optionally X, or a heightened bare-die Integrated Circuit having a thickness of optionally X, output a millimeter-wave signal from three electrically conductive contacts arranged in a ground-signal-ground configuration on an upper side edge of the bare-die Integrated Circuit. The bare-die Integrated Circuit is placed inside the cavity, optionally such that the electrically conductive pads and the upper side edge containing the electrically conductive contacts are arranged side-by-side at substantially the same height. Three bonding wires or strips electrically connect each electrically conductive contact to one of the electrically conductive pads.

Abstract: A system for matching impedances of a bare-die Integrated Circuit and bonding wires. A bare-die Integrated Circuit is configured to output or input, at an impedance of Z3, a millimeter-wave signal from three electrically conductive contacts. Three electrically conductive pads, printed on one of the laminas of a Printed Circuit Board (PCB) are connected to the three electrically conductive contacts via three bonding wires respectively, the bonding wires have a characteristic impedance of Z1, wherein Z1>Z3. One of the electrically conductive pads extends to form a transmission line signal trace of length L, the transmission line signal trace having a first width resulting in characteristic impedance of Z2, wherein Z2>Z3. The transmission line signal trace widens to a second width, higher than the first width, after the length of L, decreasing the characteristic impedance of the transmission line signal trace to substantially Z3 after the length L and onwards.

Abstract: A method for constructing millimeter-wave laminate structures using Printed Circuit Board (PCB) processes includes the following steps: Creating a first pressed laminate structure comprising at least two laminas and a cavity, the cavity is shaped as an aperture of a waveguide, and goes perpendicularly through all laminas of the laminate structure. Plating the cavity with electrically conductive plating, using a PCB plating process. Pressing the first pressed laminate structure together with at least two additional laminas comprising a probe printed on one of the at least two additional laminas, into a PCB comprising the first pressed laminate structure and the additional laminas, such that the cavity is sealed only from one end by the additional laminas and the probe, and the probe is positioned above the cavity.

Abstract: A system for injecting and guiding millimeter-waves through a Printed Circuit Board (PCB) including at least two laminas belonging to a PCB, an electrically conductive plating applied on the insulating walls of a cavity formed perpendicularly through the laminas, and optionally a probe located above the cavity printed on a lamina belonging to the PCB. Optionally, the cavity guides millimeter-waves injected by the probe at one side of the cavity to the other side of the cavity.

Abstract: A system for directing electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB). The system includes a waveguide having an aperture and at least two laminas belonging to a PCB. A first electrically conductive surface printed on one of the laminas is located over the aperture such that the first electrically conductive surface covers at least most of the aperture. A plurality of Vertical Interconnect Access (VIA) holes, optionally filled or plated with an electrically conductive material, are electrically connecting the first electrically conductive surface to the waveguide, forming an electrically conductive cage over the aperture. Optionally, a probe printed on one of the laminas of the PCB is located inside the cage and over the aperture.

Abstract: A low-loss interface between a mm-wave integrated circuit and a waveguide comprises a surface having a contact location for said integrated circuit and a waveguide location for fixing a waveguide thereon; a transmission line extending along said surface from said contact location to the waveguide location and extending into the waveguide location as a waveguide feed; and a connection bump on a surface of the mm-wave integrated circuit. The mm-wave integrated circuit RFIC is connected to the surface at the contact location through the connection bump, such as to connect a signal output of the RFIC to the transmission line, thereby providing said low loss interface.

Abstract: A transceiver (20) for a millimeter wave signal, consisting of a PCB (140) having PCB microstrip lines (141) and PCB waveguide apertures (159), and one or more transmitter modules (22) and one or more receiver modules (24, 26, 28) mounted on the PCB. Each module has a single microstrip-waveguide transition (34, 48) and a microstrip-microstrip transition (47, 49). The microstrip-waveguide transition of each module couples to one of the PCB waveguide apertures via a PCB-module waveguide-waveguide transition (167). The microstrip-microstrip transition of each module couples to one of the PCB microstrip lines via a PCB-module microstrip-microstrip transition (165). The PCB-module transitions are low tolerance, facilitating implementation of the transceiver.