Abstract: Some novel features pertain to an inductor structure that includes a first inductor winding, a second inductor winding and a filler. The first inductor winding includes an electrically conductive material. The second inductor winding includes an electrically conductive material. The filler is laterally located between the first inductor winding and the second inductor winding. The filler is configured to provide structural coupling of the first and second inductor windings. In some implementations, the first inductor winding is laterally co-planar to the second inductor winding. In some implementations, the first inductor winding has a first spiral shape and the second inductor winding has a second spiral shape. In some implementations, the first inductor winding and the second inductor winding have an elongated circular shape. In some implementations, the filler is an epoxy.

Abstract: A circuit including: a three-level buck converter having: a plurality of input switches and an inductor configured to receive a voltage from the plurality of input switches, the plurality of input switches coupled with a first capacitor and configured to charge and discharge the first capacitor; a second capacitor at an output of the buck converter; and a switched capacitor at an input node of the inductor, wherein the switched capacitor is smaller than either the first capacitor or the second capacitor.

Abstract: A circuit including: a control system for a three-level buck converter, the three-level buck converter including multiple input switches, each of the input switches receiving one of a plurality of different pulse width modulated signals, the control system including: a first clock signal and a second clock signal, the second clock signal being a phase-shifted version of the first clock signal; ramp generating circuitry receiving the first and second clock signals and producing first and second ramp signals, respectively, from the first and second clock signals; a first comparing circuit receiving the first ramp signal and producing a first one of the pulse width modulated signals therefrom; and a second comparing circuit receiving the second ramp signal and producing a second one of the pulse width modulated signals therefrom.

Abstract: Operational mode changes in a system-on-a-chip (SoC) integrated circuit in a complex device such as a mobile phone cause spikes in current demand which can cause voltage droops that disrupt operation of the SoC. A hybrid parallel power supply connects a switching-mode power supply and a low-dropout voltage regulator in parallel to provide high efficiency and fast response times. Integration of the voltage regulator on the SoC reduces parasitic impedance be between the voltage regulator and the load to aid in reducing voltage droops. The switching-mode power supply and the low-dropout voltage regulator can regulate their outputs to slightly difference voltage levels. This can allow the switching-mode power supply to supply most of the SoC's current demands.

Abstract: A switch-mode power supply is provided that includes a comparator for producing a pulse-width modulated (PWM) controller clock signal for controlling a power switch in the switch-mode power supply. The switch-mode power supply is configured to superimpose a DC-free version of a ramp voltage with an error voltage to produce a combined voltage. The comparator compares the combined voltage to a reference voltage to produce the PWM controller clock signal.

Abstract: A switch-mode power supply is provided that includes a comparator for producing a pulse-width modulated (PWM) controller clock signal for controlling a power switch in the switch-mode power supply. The switch-mode power supply is configured to superimpose a DC-free version of a ramp voltage with an error voltage to produce a combined voltage. The comparator compares the combined voltage to a reference voltage to produce the PWM controller clock signal.

Abstract: A circuit including: a three-level buck converter having: a plurality of input switches and an inductor configured to receive a voltage from the plurality of input switches, the plurality of input switches coupled with a first capacitor and configured to charge and discharge the first capacitor; a second capacitor at an output of the buck converter; and a switched capacitor at an input node of the inductor, wherein the switched capacitor is smaller than either the first capacitor or the second capacitor.

Abstract: A circuit including: a three-level buck converter having: a plurality of input switches and an inductor configured to receive a voltage from the plurality of input switches, the plurality of input switches coupled with a first capacitor and configured to charge and discharge the first capacitor; a second capacitor at an output of the buck converter; and a switched capacitor at an input node of the inductor, wherein the switched capacitor is smaller than either the first capacitor or the second capacitor.

Abstract: Operational mode changes in a system-on-a-chip (SoC) integrated circuit in a complex device such as a mobile phone cause spikes in current demand which can cause voltage droops that disrupt operation of the SoC. A hybrid parallel power supply connects a switching-mode power supply and a low-dropout voltage regulator in parallel to provide high efficiency and fast response times. Integration of the voltage regulator on the SoC reduces parasitic impedance be between the voltage regulator and the load to aid in reducing voltage droops. The switching-mode power supply and the low-dropout voltage regulator can regulate their outputs to slightly difference voltage levels. This can allow the switching-mode power supply to supply most of the SoC's current demands.

Abstract: A circuit including: a three-level buck converter having: a plurality of input switches and an inductor configured to receive a voltage from the plurality of input switches, the plurality of input switches coupled with a first capacitor and configured to charge and discharge the first capacitor; a second capacitor at an output of the buck converter; and a switched capacitor at an input node of the inductor, wherein the switched capacitor is smaller than either the first capacitor or the second capacitor.

Abstract: A circuit including: a control system for a three-level buck converter, the three-level buck converter including multiple input switches, each of the input switches receiving one of a plurality of different pulse width modulated signals, the control system including: a first clock signal and a second clock signal, the second clock signal being a phase-shifted version of the first clock signal; ramp generating circuitry receiving the first and second clock signals and producing first and second ramp signals, respectively, from the first and second clock signals; a first comparing circuit receiving the first ramp signal and producing a first one of the pulse width modulated signals therefrom; and a second comparing circuit receiving the second ramp signal and producing a second one of the pulse width modulated signals therefrom.

Abstract: Some implementations provide a coupled inductor structure that includes a first discrete inductor configured to generate a magnetic field, a second discrete inductor, and a first ferromagnetic layer coupled to the first discrete inductor and the second discrete inductor. The first ferromagnetic layer is configured to concentrate the magnetic field generated by the first discrete inductor within the coupled inductor structure. In some implementations, the coupled inductor structure further includes a second ferromagnetic layer coupled to the first discrete inductor and the second discrete inductor. The second ferromagnetic layer is configured to concentrate the magnetic field generated by the first discrete inductor within the coupled inductor structure. In some implementations, the coupled inductor structure is a bifilar inductor structure. The first discrete inductor includes a first set of windings and the second discrete inductor includes a second set of windings.

Abstract: Some novel features pertain to an in-substrate inductor structure that includes a first inductor winding, a second inductor winding and a substrate. The first inductor winding includes an electrically conductive material. The second inductor winding includes an electrically conductive material. The substrate is laterally located between the first inductor winding and the second inductor winding. The substrate is configured to provide structural coupling of the first and second inductor windings. In some implementations, the first inductor winding is laterally co-planar to the second inductor winding. In some implementations, the first inductor winding has a first spiral shape and the second inductor winding has a second spiral shape. In some implementations, the first inductor winding and the second inductor winding have an elongated circular shape. In some implementations, the substrate is a silicon substrate.

Abstract: Some novel features pertain to an inductor structure that includes a first inductor winding, a second inductor winding and a filler. The first inductor winding includes an electrically conductive material. The second inductor winding includes an electrically conductive material. The filler is laterally located between the first inductor winding and the second inductor winding. The filler is configured to provide structural coupling of the first and second inductor windings. In some implementations, the first inductor winding is laterally co-planar to the second inductor winding. In some implementations, the first inductor winding has a first spiral shape and the second inductor winding has a second spiral shape. In some implementations, the first inductor winding and the second inductor winding have an elongated circular shape. In some implementations, the filler is an epoxy.

Abstract: An on-chip sensor measures dynamic power supply noise, such as voltage droop, on a semiconductor chip. In-situ logic is employed, which is sensitive to noise present on the power supply of functional logic of the chip. Exemplary functional logic includes a microprocessor, adder, and/or other functional logic of the chip. The in-situ logic performs some operation, and the amount of time required for performing that operation (i.e., the operational delay) is sensitive to noise present on the power supply. Thus, by evaluating the operational delay of the in-situ logic, the amount of noise present on the power supply can be measured.

Abstract: An on-chip sensor measures dynamic power supply noise, such as voltage droop, on a semiconductor chip. In-situ logic is employed, which is sensitive to noise present on the power supply of functional logic of the chip. Exemplary functional logic includes a microprocessor, adder, and/or other functional logic of the chip. The in-situ logic performs some operation, and the amount of time required for performing that operation (i.e., the operational delay) is sensitive to noise present on the power supply. Thus, by evaluating the operational delay of the in-situ logic, the amount of noise present on the power supply can be measured.

Abstract: An on-chip sensor measures dynamic power supply noise, such as voltage droop, on a semiconductor chip. In-situ logic is employed, which is sensitive to noise present on the power supply of functional logic of the chip. Exemplary functional logic includes a microprocessor, adder, and/or other functional logic of the chip. The in-situ logic performs some operation, and the amount of time required for performing that operation (i.e., the operational delay) is sensitive to noise present on the power supply. Thus, by evaluating the operational delay of the in-situ logic, the amount of noise present on the power supply can be measured.