Abstract: A stereotactic system for positioning a device relative to a spine includes a first frame with an attached first pedicle screw, a second frame with an attached second pedicle screw, and a platform for mounting the device. The lower parts of the frames are horizontally spaced apart, and attachable to the spine by the pedicle screws. The platform is attached to the upper parts of the frames and supported by the frames above the spine. The platform is slidably attached to the upper parts of the frames to adjust a longitudinal position of the platform relative to the frames. The platform is pivotally attached to the upper parts of the frame to adjust a horizontal distance between the lower parts of the frames, while maintaining a constant orientation of the platform.

Abstract: A stereotactic system for positioning a device relative to a spine includes a first frame with an attached first pedicle screw, a second frame with an attached second pedicle screw, and a platform for mounting the device. The lower parts of the frames are horizontally spaced apart, and attachable to the spine by the pedicle screws. The platform is attached to the upper parts of the frames and supported by the frames above the spine. The platform is slidably attached to the upper parts of the frames to adjust a longitudinal position of the platform relative to the frames. The platform is pivotally attached to the upper parts of the frame to adjust a horizontal distance between the lower parts of the frames, while maintaining a constant orientation of the platform.

Abstract: There is disclosed a method of heating a wafer for bonding, the method comprising adding a patterned susceptor close to a wafer interface, and applying microwave energy to the patterned susceptor. There is also disclosed an electrically conductive film, in direct contact with a relatively non-conductive substrate (preferably a thermoplastic) and made of individual electrically isolated elements (features) with a maximum dimension less than ¼ the wavelength used in the microwave, and minimum dimension greater than 100 um in the plane of the film. The film and substrate is selectively heated by resistive loss caused by dissipated energy from microwave radiation.