Patents by Inventor Amishkumar Panchal

Amishkumar Panchal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Projection exposure apparatus for semiconductor lithography with increased thermal robustness
    Patent number: 10466598
    Abstract: A projection exposure apparatus for semiconductor lithography includes: a light source for generating optical used radiation by which structures arranged on a reticle can be imaged onto a wafer; a plurality of optical elements for guiding and manipulating the used radiation; and a plurality of position sensors for determining the position of at least some of the optical elements. At least some of the position sensors are arranged on a measurement structure that is at least partially decoupled mechanically and/or thermally from the further components of the projection exposure apparatus. The measurement structure has at least two mechanically decoupled substructures. The first substructure has a lower coefficient of thermal expansion than the second substructure. The second substructure has a greater stiffness than the first substructure.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: November 5, 2019
    Assignee: Carl Zeiss SMT GmbH
    Inventors: Alireza Akbarinia, Alexandre Kemp, Timo Laufer, Amishkumar Panchal
  • PROJECTION EXPOSURE APPARATUS FOR SEMICONDUCTOR LITHOGRAPHY WITH INCREASED THERMAL ROBUSTNESS
    Publication number: 20190219934
    Abstract: A projection exposure apparatus for semiconductor lithography includes: a light source for generating optical used radiation by which structures arranged on a reticle can be imaged onto a wafer; a plurality of optical elements for guiding and manipulating the used radiation; and a plurality of position sensors for determining the position of at least some of the optical elements. At least some of the position sensors are arranged on a measurement structure that is at least partially decoupled mechanically and/or thermally from the further components of the projection exposure apparatus. The measurement structure has at least two mechanically decoupled substructures. The first substructure has a lower coefficient of thermal expansion than the second substructure. The second substructure has a greater stiffness than the first substructure.
    Type: Application
    Filed: March 28, 2019
    Publication date: July 18, 2019
    Inventors: Alireza Akbarinia, Alexandre Kemp, Timo Laufer, Amishkumar Panchal