Patents by Inventor Amit ABRAHAM

Amit ABRAHAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder contacts for socket assemblies
    Patent number: 10321573
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: June 11, 2019
    Assignee: INTEL CORPORATION
    Inventors: Fay Hua, Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan C. McAllister, Ting Zhong
  • SOLDER CONTACTS FOR SOCKET ASSEMBLIES
    Publication number: 20180192519
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 27, 2017
    Publication date: July 5, 2018
    Inventors: Fay HUA, Hong XIE, Gregorio R. MURTAGIAN, Amit ABRAHAM, Alan C. MCALLISTER, Ting ZHONG
  • Solder contacts for socket assemblies
    Patent number: 9860988
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 20, 2014
    Date of Patent: January 2, 2018
    Assignee: Intel Corporation
    Inventors: Fay Hua, Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan C. Mcallister, Ting Zhong
  • SOLDER CONTACTS FOR SOCKET ASSEMBLIES
    Publication number: 20160338199
    Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: December 20, 2014
    Publication date: November 17, 2016
    Inventors: Fay HUA, Hong XIE, Gregorio R. MURTAGIAN, Amit ABRAHAM, Alan C. MCALLISTER, Ting ZHONG