Patents by Inventor Amit Amos Atias

Amit Amos Atias has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11296093
    Abstract: A method for distributing deep trench (DT) capacitance in an integrated circuit (IC) design is provided. The method includes forming a placement block that includes blockages defining openings in interstitial regions among the blockages, superimposing the placement block over the IC design and providing distributed DT capacitance to the IC design. The providing of the distributed DT capacitance includes adding DT capacitance cells through the openings to portions of the IC design where there are no reserved blocks.
    Type: Grant
    Filed: February 28, 2020
    Date of Patent: April 5, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Asaf Regev, Christopher Berry, Ofer Geva, Amit Amos Atias, Timothy A. Schell
  • Publication number: 20210272963
    Abstract: A method for distributing deep trench (DT) capacitance in an integrated circuit (IC) design is provided. The method includes forming a placement block that includes blockages defining openings in interstitial regions among the blockages, superimposing the placement block over the IC design and providing distributed DT capacitance to the IC design. The providing of the distributed DT capacitance includes adding DT capacitance cells through the openings to portions of the IC design where there are no reserved blocks.
    Type: Application
    Filed: February 28, 2020
    Publication date: September 2, 2021
    Inventors: ASAF REGEV, Christopher Berry, OFER GEVA, Amit Amos Atias, Timothy A. Schell