Patents by Inventor Amit Datta

Amit Datta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170337196
    Abstract: An apparatus comprises a processor configured to receive first and second ratings of a first segment of a media content respectively from second and third users; assign first and second weights respectively to the first and second ratings according to relationship in a social network between the first and second users and between the first and third users respectively; adjust the first and second ratings using the first and second weights, respectively; combine the adjusted first and second ratings to form the customized rating data of the first segment for the first user; and deliver the customized rating data of the first segment to the first user; and a memory storing the customized rating data.
    Type: Application
    Filed: April 20, 2017
    Publication date: November 23, 2017
    Inventors: Naveen GOELA, Kent LYONS, Caroline HANSSON, Amit DATTA, Snigdha PANIGRAHI, Rashish TANDON, Wenling SHANG, Jean C. BOLOT
  • Patent number: 6755958
    Abstract: A cooper or copper alloy electrical contact member is treated by electroplating a barrier layer on a contact surface of the member, the barrier layer having a thickness ranging from about 0.00001 inch to about 0.0001 inch, and the barrier layer is selected from the group consisting of cobalt, cobalt-nickel alloys, cobalt-tungsten alloys, cobalt-nickel-tungsten alloys, and rhodium. An outer finish layer is coated over the barrier layer, and the finish layer is selected from the group consisting of tin, gold, palladium, platinum, silver, and alloys thereof, so that the electrical contact resistance of the treated contact member does not exceed about 10 milliohms at 100 grams contact force over a period of at least 1000 hours, and at a temperature of at least 150 degrees C.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: June 29, 2004
    Assignee: Handy & Harman
    Inventor: Amit Datta
  • Publication number: 20030035977
    Abstract: A metal contact for a copper alloy surface, comprising: electroplated barrier layer having a thickness ranging from about 0.00001 inch to about 0.
    Type: Application
    Filed: December 11, 2001
    Publication date: February 20, 2003
    Inventor: Amit Datta