Abstract: A static random access memory (SRAM) system includes a plurality of SRAM storage cells, each of the plurality of SRAM storage cells coupled to a respective read bit line, and a dynamic keeper coupled to the read bit line. The dynamic keeper includes a first keeper to support a read operation at a first temperature range, and a second keeper to support the read operation at a second temperature range, and a temperature-sensitive control circuit to select the first keeper or the second keeper based on temperature.

Abstract: A memory array including a plurality of memory cells and a plurality of drivers is disclosed. The plurality of memory cells may be arranged in a plurality of rows and a plurality of columns. Memory cells corresponding to a row of the plurality of rows may be logically grouped into a plurality of memory array segments. The plurality of drivers may be coupled to corresponding first ends of corresponding memory array segments of the plurality of memory array segments. Second ends of the corresponding memory array segments may be coupled to second ends of corresponding adjacent memory array segments of the plurality of memory array segments. The second ends of the corresponding memory array segments and the second ends of corresponding adjacent memory array segments may be coupled to corresponding wordlines of a plurality of wordlines.

Abstract: A static random access memory (SRAM) system includes a plurality of SRAM storage cells, each of the plurality of SRAM storage cells coupled to a respective read bit line, and a dynamic keeper coupled to the read bit line. The dynamic keeper includes a first keeper to support a read operation at a first temperature range, and a second keeper to support the read operation at a second temperature range, and a temperature-sensitive control circuit to select the first keeper or the second keeper based on temperature.

Abstract: A memory array including a plurality of memory cells and a plurality of drivers is disclosed. The plurality of memory cells may be arranged in a plurality of rows and a plurality of columns. Memory cells corresponding to a row of the plurality of rows may be logically grouped into a plurality of memory array segments. The plurality of drivers may be coupled to corresponding first ends of corresponding memory array segments of the plurality of memory array segments. Second ends of the corresponding memory array segments may be coupled to second ends of corresponding adjacent memory array segments of the plurality of memory array segments. The second ends of the corresponding memory array segments and the second ends of corresponding adjacent memory array segments may be coupled to corresponding wordlines of a plurality of wordlines.

Abstract: An integrated circuit for storing data comprises a memory cell array comprising a plurality of bit cells (BC1, . . . , BCn) comprising a first and a second one of the bit cells (BC1, BC2) having a static random access memory architecture. The first and the second bit cells (BC1, BC2) are coupled to a common wordline (WL_TOP) and are arranged in different columns (C1, C2) of the memory cell array (100). During a write access to the first bit cell (BC1), the first bit cell (BC1) undergoes a write operation, whereas the second bit cell (BC2) is a half-selected bit cell which undergoes a pseudo read operation. The integrated circuit uses a two-phase write scheme to improve the write-ability in low operating voltage environment.

Abstract: Embodiments relate to preventing or mitigating excessive drop in the negative voltage level of a bitline of memory bitcells by controlling the delay of a trigger signal for initiating injection of negative charge into the bitline. A write assist circuit causes negative charge to drop gradually in response to receiving a data input indicating a negative value of the bitline. When supply voltage is high, the timed delay of trigger signal is reduced, thereby causing negative charge to be injected into the bitline while bitline voltage remains at a higher voltage level and before the bitline voltage drops close to ground voltage. Since the negative charge is injected while the bitline voltage level is relatively high, the bitline is prevented from being pulled down to an excessively negative voltage level even when the supply voltage is relatively high.

Abstract: An integrated circuit for storing data comprises a memory cell array comprising a plurality of bit cells (BC1, . . . , BCn) comprising a first and a second one of the bit cells (BC1, BC2) having a static random access memory architecture. The first and the second bit cells (BC1, BC2) are coupled to a common wordline (WL_TOP) and are arranged in different columns (C1, C2) of the memory cell array (100). During a write access to the first bit cell (BC1), the first bit cell (BC1) undergoes a write operation, whereas the second bit cell (BC2) is a half-selected bit cell which undergoes a pseudo read operation. The integrated circuit uses a two-phase write scheme to improve the write-ability in low operating voltage environment.

Abstract: Embodiments relate to preventing or mitigating excessive drop in the negative voltage level of a bitline of memory bitcells by controlling the delay of a trigger signal for initiating injection of negative charge into the bitline. A write assist circuit causes negative charge to drop gradually in response to receiving a data input indicating a negative value of the bitline. When supply voltage is high, the timed delay of trigger signal is reduced, thereby causing negative charge to be injected into the bitline while bitline voltage remains at a higher voltage level and before the bitline voltage drops close to ground voltage. Since the negative charge is injected while the bitline voltage level is relatively high, the bitline is prevented from being pulled down to an excessively negative voltage level even when the supply voltage is relatively high.

Abstract: Wordline-driver biasing and column-based source-biasing circuitry facilitate reduced current leakage, for example, in SoC device SRAM circuits in a manner that is independent of the read/write/standby operating mode, and without an external trigger. Wordline-driver-biasing circuitry turns off (i.e., decouples from system power) wordline-drivers that are connected to unselected wordlines during read/write operations using one of a decoder-enable signal, which is generated in response to row address values, or based on the activation of a self-timing internal clock, which is generated by the memory circuit when it is activated (i.e., switched from standby to read/write mode). Alternatively, or in addition, source-biasing circuitry applies a relatively high source-biasing voltage to the source terminals of memory cells in unselected columns during read/write operations based on column address values (i.e., a low source voltage is applied only to the selected column being written to or read from).

Abstract: Wordline-driver biasing and column-based source-biasing circuitry facilitate reduced current leakage, for example, in SoC device SRAM circuits in a manner that is independent of the read/write/standby operating mode, and without an external trigger. Wordline-driver-biasing circuitry turns off (i.e., decouples from system power) wordline-drivers that are connected to unselected wordlines during read/write operations using one of a decoder-enable signal, which is generated in response to row address values, or based on the activation of a self-timing internal clock, which is generated by the memory circuit when it is activated (i.e., switched from standby to read/write mode). Alternatively, or in addition, source-biasing circuitry applies a relatively high source-biasing voltage to the source terminals of memory cells in unselected columns during read/write operations based on column address values (i.e., a low source voltage is applied only to the selected column being written to or read from).

Abstract: An integrated circuit for generating a negative bitline voltage comprises a bitline connectable to a memory cell and a multitude of capacitors arranged in groups thereof connected to the bitline. A step signal generator can generate a consecutive sequence of step signals to be applied to a group of capacitors. The circuit may be part of an integrated memory circuit device to drive the bitline to a negative voltage to implement a write assist scheme.

Abstract: An integrated circuit for generating a negative bitline voltage comprises a bitline connectable to a memory cell and a multitude of capacitors arranged in groups thereof connected to the bitline. A step signal generator can generate a consecutive sequence of step signals to be applied to a group of capacitors. The circuit may be part of an integrated memory circuit device to drive the bitline to a negative voltage to implement a write assist scheme.

Abstract: A method of manufacturing a read only memory cell includes connecting electrically a drain of the transistor to the bit line with a first conductor and a via. The method also includes generating a logic zero at a source of the transistor by electrically connecting the source of the transistor to a ground line with the first conductor. Further, the method includes, programming the read only memory cell to logic zero. A method of manufacturing a read only memory cell includes connecting electrically a drain of the transistor to the bit line with a first conductor and a via. The method also includes, connecting electrically a source of the transistor to the drain with the first conductor. Further, the method includes programming the read only memory cell to logic one.

Abstract: A Read only memory (ROM) with minimum leakage includes a ROM array including a first transistor, wherein a drain, a source, a gate, and a bulk of the first transistor is electrically connected to a logic zero in the idle state for ensuring zero junction and sub-threshold leakage current. The drain of the first transistor is electrically connected to a main bit line through a second transistor. The second transistor includes a gate, electrically connected to a first decoding circuit, a drain, electrically connected to the main bit line. A first reference bit line is electrically connected to a drain of a third transistor, wherein gate of the third transistor is electrically connected to a second decoding circuit for generating a stop read signal. A second reference bit line, electrically connected to the first decoding circuit through a first sensing unit for generating a stop pre-charge signal.

Abstract: Read only memory (ROM) with minimum leakage is provided. The ROM includes a read only memory array. The read only memory array includes a first transistor, wherein a drain, a source, a gate, and a bulk of the first transistor is electrically connected to a logic zero in the idle state for ensuring zero junction and sub-threshold leakage current. Another ROM includes a first transistor comprising a gate, electrically connected to a word line to provide a read signal, a drain, electrically connected to a main bit line through a second transistor. The second transistor includes a gate, electrically connected to a first decoding circuit, a drain, electrically connected to the main bit line. A first reference bit line is electrically connected to a drain of a third transistor, wherein gate of the third transistor is electrically connected to a second decoding circuit for generating a stop read signal.

Abstract: A compact, shared source line and bit line architecture for a diffusion programmable ROM. In one embodiment, a ROM circuit or instance includes a plurality of storage cells organized as an array of rows columns. A shared source line is associated with a first pair of adjacent columns, the shared source line being maintained at a predetermined level, wherein source terminals of storage cells in the adjacent columns are electrically coupled to the shared source line. A shared bit line is associated with a second pair of adjacent columns, the shared bit line being maintained at the predetermined level, wherein drain terminals of storage cells in the adjacent columns are electrically coupled to the shared bit line.

Abstract: A Read only memory (ROM) with minimum leakage includes a ROM array including a first transistor, wherein a drain, a source, a gate, and a bulk of the first transistor is electrically connected to a logic zero in the idle state for ensuring zero junction and sub-threshold leakage current. The drain of the first transistor is electrically connected to a main bit line through a second transistor. The second transistor includes a gate, electrically connected to a first decoding circuit, a drain, electrically connected to the main bit line. A first reference bit line is electrically connected to a drain of a third transistor, wherein gate of the third transistor is electrically connected to a second decoding circuit for generating a stop read signal. A second reference bit line, electrically connected to the first decoding circuit through a first sensing unit for generating a stop pre-charge signal.

Abstract: A compact, shared source line and bit line architecture for a diffusion programmable ROM. In one embodiment, a ROM circuit or instance includes a plurality of storage cells organized as an array of rows columns. A shared source line is associated with a first pair of adjacent columns, the shared source line being maintained at a predetermined level, wherein source terminals of storage cells in the adjacent columns are electrically coupled to the shared source line. A shared bit line is associated with a second pair of adjacent columns, the shared bit line being maintained at the predetermined level, wherein drain terminals of storage cells in the adjacent columns are electrically coupled to the shared bit line.

Abstract: A compact, shared source line and bit line architecture for a diffusion programmable ROM. In one embodiment, a ROM circuit or instance includes a plurality of storage cells organized as an array of rows columns. A shared source line is associated with a first pair of adjacent columns, the shared source line being maintained at a predetermined level, wherein source terminals of storage cells in the adjacent columns are electrically coupled to the shared source line. A shared bit line is associated with a second pair of adjacent columns, the shared bit line being maintained at the predetermined level, wherein drain terminals of storage cells in the adjacent columns are electrically coupled to the shared bit line.

Abstract: A compact, shared source line and bit line architecture for a diffusion programmable ROM. In one embodiment, a ROM circuit or instance includes a plurality of storage cells organized as an array of rows columns. A shared source line is associated with a first pair of adjacent columns, the shared source line being maintained at a predetermined level, wherein source terminals of storage cells in the adjacent columns are electrically coupled to the shared source line. A shared bit line is associated with a second pair of adjacent columns, the shared bit line being maintained at the predetermined level, wherein drain terminals of storage cells in the adjacent columns are electrically coupled to the shared bit line.