Abstract: Embodiments of the present disclosure generally relate to optical devices, and more specifically, protective coatings for optical devices and methods for preparing protective coatings on optical devices and other devices. In one or more embodiments, a method for protecting a photoresist on a workpiece is provided and includes depositing a photoresist layer on a first surface of a substrate, and depositing a protective coating on the photoresist layer disposed on the first surface, wherein the protective coating contains a water-soluble polymeric material. Thereafter, the method includes exposing a second surface of the substrate to one or more fabrication processes, where the first surface is covered by the photoresist layer and the protective coating, and the second surface is uncovered. Thereafter, the method further includes removing the protective coating by at least partially dissolving the water-soluble polymeric material with a removal solution containing water or an aqueous solution.

Abstract: Exemplary methods of semiconductor processing may include providing a first precursor to a semiconductor processing chamber. A substrate may be disposed within a processing region of the semiconductor processing chamber. The first precursor may include one or more of niobium, tantalum, or titanium. The methods may include contacting the substrate with the first precursor. The contacting may form a layer of metal on the substrate. The methods may include providing a second precursor to a semiconductor processing chamber. The second precursor comprises oxygen. The methods may include contacting the layer of metal with the second precursor. The contacting may form a layer of metal oxide on the substrate. The layer of metal oxide may be one or more of niobium oxide, tantalum oxide, or titanium oxide.

Abstract: Exemplary methods of semiconductor processing may include providing a first precursor to a semiconductor processing chamber. A substrate may be disposed within a processing region of the semiconductor processing chamber. The first precursor may include a first metal. The methods may include contacting the substrate with the first precursor. The contacting may form a first portion of a metal oxide material on the substrate. The methods may include providing a second precursor to the semiconductor processing chamber. The second precursor may be an oxygen-containing precursor including an alcohol, an alkoxide, a hydroxide, an acetylacetonate, an acetate, a formate, a nitrate, a sulfate, a phosphate, a phosphide, a carbonate, an oxide, an oxynitride, a perchlorate, an oxyhalide, a peroxide, an oxalate, or a phenolate. The methods may include contacting the first portion of the metal oxide material with the second precursor. The contacting may form a metal oxide material.

Abstract: A method is described for providing a hydrophilic effect to a fluoropolymer, e.g. polytetrafluoroethylene (PTFE) material. The method comprises obtaining an at least partly hydrophobic fluoropolymer material, applying a plasma and/or ozone activation step and depositing an inorganic coating using an atomic layer deposition process. Plasma activation step and/or said atomic layer deposition process thereby comprises using process parameters determining a high interaction probability between one or more precursors for the atomic layer deposition process and the fluoropolymer material so as to obtain a coated fluoropolymer material having a contact angle with water below 30°.

Abstract: A method is described for providing a hydrophilic effect to a fluoropolymer, e.g. polytetrafluoroethylene (PTFE) material. The method comprises obtaining an at least partly hydrophobic fluoropolymer material, applying a plasma and/or ozone activation step and depositing an inorganic coating using an atomic layer deposition process. Plasma activation step and/or said atomic layer deposition process thereby comprises using process parameters determining a high interaction probability between one or more precursors for the atomic layer deposition process and the fluoropolymer material so as to obtain a coated fluoropolymer material having a contact angle with water below 30°.