Abstract: An integrated circuit method processes parametric data for each integrated circuit die in a plurality of integrated circuit die to determine an expected data pattern, screens integrated circuit die by comparing a data pattern corresponding to a plurality of parametric data for the integrated circuit die to an expected data pattern and, responsive to the comparing, determining whether a difference between the data pattern corresponding to a plurality of parametric data for the predetermined integrated circuit die and the expected data pattern is beyond a tolerance.

Abstract: A method for failed die clustering is provided that includes extracting a data set of failed die on a wafer from a wafer map for the wafer, determining a density parameter for clustering the failed die, removing false failures from the data set of failed die to generate a reduced data set of failed die, locating clusters of failed die in the reduced data set by executing a density-based spatial clustering of applications with noise (DBSCAN) algorithm with the density parameter, and applying a guard band to each located cluster.

Abstract: An integrated circuit method processes parametric data for each integrated circuit die in a plurality of integrated circuit die to determine an expected data pattern, screens integrated circuit die by comparing a data pattern corresponding to a plurality of parametric data for the integrated circuit die to an expected data pattern and, responsive to the comparing, determining whether a difference between the data pattern corresponding to a plurality of parametric data for the predetermined integrated circuit die and the expected data pattern is beyond a tolerance.