Abstract: The present disclosure generally relates to an electronic assembly. The electronic assembly may include a semiconductor package including a first surface, an opposing second surface, and a side wall. The electronic assembly may also include a printed circuit board coupled to the second surface of the semiconductor package. The electronic assembly may further include at least one passive component array including one or more passive components at least partially embedded in a mold layer, each passive component further including a first terminal and a second terminal, wherein the first terminal of the passive component may be coupled to the printed circuit board and the passive component array may be attached to the side wall of the semiconductor package.

Abstract: A method and apparatus for managing Internet Connection Sharing (ICS) in a primary mobile device are provided. The method includes establishing a device management session with a service provider; receiving an Internet connection-sharing criterion from the service provider; and checking the Internet connection-sharing criterion upon receiving an Internet connection sharing request from a peer mobile device.

Abstract: A method and apparatus for managing Internet Connection Sharing (ICS) in a primary mobile device are provided. The method includes establishing a device management session with a service provider; receiving an Internet connection-sharing criterion from the service provider; and checking the Internet connection-sharing criterion upon receiving an Internet connection sharing request from a peer mobile device.