Abstract: Seed sensors that surround the conventional mounting location on existing seed tubes. The seed sensors sense seeds using electromagnetic fields, including RF and microwave fields. In one embodiment, a first seed sensor has a coaxial Fabry-Perot resonant cavity which is formed between two coaxial portions of a conduit that surround the seed tube. Another seed sensor uses a capacitive design. In one embodiment, the driving signals are applied 180 degrees out of phase. The detected phase shift between the reference and reflected signals provides reliable seed counting. Electronics extract the signal from the sensing field.

Abstract: Seed sensors that surround the conventional mounting location on existing seed tubes. The seed sensors sense seeds using electromagnetic fields, including RF and microwave fields. In one embodiment, a first seed sensor has a coaxial Fabry-Perot resonant cavity which is formed between two coaxial portions of a conduit that surround the seed tube. Another seed sensor uses a capacitive design. In one embodiment, the driving signals are applied 180 degrees out of phase. The detected phase shift between the reference and reflected signals provides reliable seed counting. Electronics extract the signal from the sensing field.

Abstract: An apparatus includes a non-metallic interlayer between a magnetic data storage layer and a heat sink layer, wherein interface thermal resistance between the interlayer and the heat sink layer is capable of reducing heat flow between the heat sink layer and the magnetic data storage layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include thermal resistor layer positioned between the interlayer and the heat sink layer.

Abstract: An apparatus includes a non-metallic interlayer between a magnetic data storage layer and a heat sink layer, wherein interface thermal resistance between the interlayer and the heat sink layer is capable of reducing heat flow between the heat sink layer and the magnetic data storage layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include thermal resistor layer positioned between the interlayer and the heat sink layer.

Abstract: An apparatus includes a non-metallic interlayer between a magnetic data storage layer and a heat sink layer, wherein interface thermal resistance between the interlayer and the heat sink layer is capable of reducing heat flow between the heat sink layer and the magnetic data storage layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include thermal resistor layer positioned between the interlayer and the heat sink layer.

Abstract: An apparatus includes a non-metallic interlayer between a magnetic data storage layer and a heat sink layer, wherein interface thermal resistance between the interlayer and the heat sink layer is capable of reducing heat flow between the heat sink layer and the magnetic data storage layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include thermal resistor layer positioned between the interlayer and the heat sink layer.

Abstract: An apparatus includes a magnetic layer, a heat sink layer, and a thermal resistor layer between the magnetic layer and the heat sink layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include an interlayer positioned between the magnetic layer and the thermal resistor layer.

Abstract: An apparatus includes a magnetic layer, a heat sink layer, and a thermal resistor layer between the magnetic layer and the heat sink layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include an interlayer positioned between the magnetic layer and the thermal resistor layer.

Abstract: An apparatus includes a magnetic layer, a heat sink layer, and a thermal resistor layer between the magnetic layer and the heat sink layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include an interlayer positioned between the magnetic layer and the thermal resistor layer.

Abstract: An apparatus includes a magnetic layer, a heat sink layer, and a thermal resistor layer between the magnetic layer and the heat sink layer. The apparatus may be configured as a thin film structure arranged for data storage. The apparatus may also include an interlayer positioned between the magnetic layer and the thermal resistor layer.

Abstract: A device for writing data to a recording medium and a method for fabricating the device is presented. According to one embodiment, the device includes an electrical conductor having a cross-track portion, wherein the cross-track portion includes first and second opposing surfaces, and wherein the cross-track portion defines an aperture extending from the first surface to the second surface. The device also includes a dielectric portion disposed in the aperture such that the dielectric portion defines a ridge waveguide having a lowest-order mode cut-off frequency that is less than the frequency of incident optical energy used to heat the recording medium.