Patents by Inventor Amitabh Puri
Amitabh Puri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240014056Abstract: Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.Type: ApplicationFiled: September 25, 2023Publication date: January 11, 2024Inventors: Douglas Brian Baumgarten, Russell Kaplan, Amitabh Puri, Paul B. Reuter
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Patent number: 11848220Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components, including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example, radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.Type: GrantFiled: February 19, 2021Date of Patent: December 19, 2023Assignee: Applied Materials, Inc.Inventors: Earl Hunter, Russell Duke, Amitabh Puri, Steven M. Reedy
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Patent number: 11810805Abstract: Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.Type: GrantFiled: July 9, 2020Date of Patent: November 7, 2023Assignee: Applied Materials, Inc.Inventors: Douglas Brian Baumgarten, Russell Kaplan, Amitabh Puri, Paul B. Reuter
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Publication number: 20220010427Abstract: Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.Type: ApplicationFiled: July 9, 2020Publication date: January 13, 2022Inventors: Douglas Brian Baumgarten, Russell Kaplan, Amitabh Puri, Paul B. Reuter
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Patent number: 11188926Abstract: Implementations described herein generally relate to improved part authentication. In one implementation, a method includes acquiring information related to a part. The information may include identification information of the part and a unique code. The method further includes determining, using a stored algorithm, whether the unique code comprises a result of applying the stored algorithm to the identification information. The method further includes, responsive to determining that the unique code comprises the result of applying the stored algorithm to the identification information, activating a feature of the part or a feature of process equipment associated with the part.Type: GrantFiled: May 14, 2019Date of Patent: November 30, 2021Assignee: Applied Materials, Inc.Inventors: Earl Hunter, David Ganon, Amitabh Puri, Gerard Crean
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Publication number: 20210175106Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components, including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example, radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.Type: ApplicationFiled: February 19, 2021Publication date: June 10, 2021Inventors: Earl HUNTER, Russell DUKE, Amitabh PURI, Steven M. REEDY
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Patent number: 10930535Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.Type: GrantFiled: November 13, 2017Date of Patent: February 23, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Earl Hunter, Russell Duke, Amitabh Puri, Steven M. Reedy
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Publication number: 20190370821Abstract: Implementations described herein generally relate to improved part authentication. In one implementation, a method includes acquiring information related to a part. The information may include identification information of the part and a unique code. The method further includes determining, using a stored algorithm, whether the unique code comprises a result of applying the stored algorithm to the identification information. The method further includes, responsive to determining that the unique code comprises the result of applying the stored algorithm to the identification information, activating a feature of the part or a feature of process equipment associated with the part.Type: ApplicationFiled: May 14, 2019Publication date: December 5, 2019Inventors: Earl HUNTER, David GANON, Amitabh PURI, Gerard CREAN
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Patent number: 10452111Abstract: Embodiments of the invention are directed toward systems and methods that execute legacy semiconductor applications using a non-legacy controller. In some embodiments a hardware abstraction layer and/or an emulator can be used to provide communication between a non-legacy operating system and legacy components including legacy applications. In some embodiments various methods and/or devices can be used to emulate and/or translate communications between legacy and non-legacy components.Type: GrantFiled: July 24, 2018Date of Patent: October 22, 2019Assignee: APPLIED MATERIALS, INC.Inventors: Ronald Vern Schauer, Mark Roger Covington, Suresh Kumaraswami, Amitabh Puri
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Publication number: 20190011967Abstract: Embodiments of the invention are directed toward systems and methods that execute legacy semiconductor applications using a non-legacy controller. In some embodiments a hardware abstraction layer and/or an emulator can be used to provide communication between a non-legacy operating system and legacy components including legacy applications. In some embodiments various methods and/or devices can be used to emulate and/or translate communications between legacy and non-legacy components.Type: ApplicationFiled: July 24, 2018Publication date: January 10, 2019Applicant: APPLIED MATERIALS, INC.Inventors: Ronald Vern Schauer, Mark Roger Covington, Suresh Kumaraswami, Amitabh Puri
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Patent number: 10037064Abstract: Embodiments of the invention are directed toward systems and methods that execute legacy semiconductor applications using a non-legacy controller. In some embodiments a hardware abstraction layer and/or an emulator can be used to provide communication between a non-legacy operating system and legacy components including legacy applications. In some embodiments various methods and/or devices can be used to emulate and/or translate communications between legacy and non-legacy components.Type: GrantFiled: June 27, 2016Date of Patent: July 31, 2018Assignee: APPLIED MATERIALS, INC.Inventors: Ronald Vern Schauer, Mark Roger Covington, Suresh Kumaraswami, Amitabh Puri
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Publication number: 20180158707Abstract: Embodiments provided herein provide for methods and apparatus for detecting, authenticating, and tracking processing components including consumable components or non-consumable components used on substrate processing systems for electronic device manufacturing, such as semiconductor chip manufacturing. The semiconductor processing systems and/or its processing components herein include a remote communication device, such as a wireless communication apparatus, for example radio frequency identification (RFID) devices or other devices embedded in, disposed in, disposed on, located on, or otherwise coupled to one or more processing components or processing component assemblies and/or integrated within the semiconductor processing system itself. The processing component may include a single component (part) or an assembly of components (parts) that are used within the semiconductor processing tool.Type: ApplicationFiled: November 13, 2017Publication date: June 7, 2018Inventors: Earl HUNTER, Russell DUKE, Amitabh PURI, Steven M. REEDY
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Publication number: 20160306403Abstract: Embodiments of the invention are directed toward systems and methods that execute legacy semiconductor applications using a non-legacy controller. In some embodiments a hardware abstraction layer and/or an emulator can be used to provide communication between a non-legacy operating system and legacy components including legacy applications. In some embodiments various methods and/or devices can be used to emulate and/or translate communications between legacy and non-legacy components.Type: ApplicationFiled: June 27, 2016Publication date: October 20, 2016Inventors: Ronald Vern Schauer, Mark Roger Covington, Suresh Kumaraswami, Amitabh Puri
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Patent number: 9383739Abstract: Embodiments of the invention are directed toward systems and methods that execute legacy semiconductor applications using a non-legacy controller. In some embodiments a hardware abstraction layer and/or an emulator can be used to provide communication between a non-legacy operating system and legacy components including legacy applications. In some embodiments various methods and/or devices can be used to emulate and/or translate communications between legacy and non-legacy components.Type: GrantFiled: February 20, 2013Date of Patent: July 5, 2016Assignee: APPLIED MATERIALS, INC.Inventors: Ronald Vern Schauer, Mark Roger Covington, Suresh Kumaraswami, Amitabh Puri
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Patent number: 9147592Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.Type: GrantFiled: August 7, 2013Date of Patent: September 29, 2015Assignee: Applied Materials, Inc.Inventors: Eric A. Englhardt, Steve Szudarski, Andrew Scott Cornelius, Amitabh Puri, Michael Robert Rice, Jeffrey C. Hudgens, Steven V. Sansoni, Robert Irwin Decottignies, Dean C. Hruzek, Peter Irwin, Nir Merry
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Publication number: 20140152103Abstract: Embodiments of the invention are directed toward systems and methods that execute legacy semiconductor applications using a non-legacy controller. In some embodiments a hardware abstraction layer and/or an emulator can be used to provide communication between a non-legacy operating system and legacy components including legacy applications. In some embodiments various methods and/or devices can be used to emulate and/or translate communications between legacy and non-legacy components.Type: ApplicationFiled: February 20, 2013Publication date: June 5, 2014Applicant: APPLIED MATERIALS, INC.Inventors: Ronald Vern Schauer, Mark Roger Covington, Suresh Kumaraswami, Amitabh Puri
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Publication number: 20140044503Abstract: In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.Type: ApplicationFiled: August 7, 2013Publication date: February 13, 2014Inventors: Eric A. Englhardt, Steve Szudarski, Andrew Scott Cornelius, Amitabh Puri, Michael Robert Rice, Jeffrey C. Hudgens, Steven V. Sansoni, Robert Irwin Decottignies, Dean C. Hruzek, Peter Irwin, Nir Merry
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Patent number: 8204617Abstract: Systems, tools, and methods are provided in which a first signal is transmitted from a tool to a Fab indicating that all substrates to be processed have been removed from a specific carrier and that the specific carrier may be temporarily unloaded from a loadport of the tool. A second signal is transmitted from the tool to the Fab indicating that the specific carrier may be returned to the tool. While the carrier is unloaded from the tool, other carriers may be loaded on the vacated loadport. Numerous other features and aspects of the invention are disclosed.Type: GrantFiled: August 14, 2007Date of Patent: June 19, 2012Assignee: Applied Materials, Inc.Inventors: Michael Teferra, Amitabh Puri, Eric Englhardt
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Patent number: 8024065Abstract: In one aspect, a method is provided for electronic device manufacturing. The method includes receiving a request to transfer a carrier to or from a first substrate loading station of an electronic device manufacturing facility, and assigning one of a plurality of carrier supports to carry out the transfer based on a spacing on either side of the assigned carrier being greater than an acceptable spacing. Numerous other aspects are provided.Type: GrantFiled: October 2, 2008Date of Patent: September 20, 2011Assignee: Applied Materials, Inc.Inventors: Todd J. Brill, Michael Teferra, Amitabh Puri, Daniel R. Jessop, Glade L. Warner, David C. Duffin
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Patent number: 7720557Abstract: Systems, tools, and methods are provided in which a first signal is transmitted from a tool to a Fab indicating that all substrates to be processed have been removed from a specific carrier and that the specific carrier may be temporarily unloaded from a loadport of the tool. A second signal is transmitted from the tool to the Fab indicating that the specific carrier may be returned to the tool. While the carrier is unloaded from the tool, other carriers may be loaded on the vacated loadport. Numerous other features and aspects of the invention are disclosed.Type: GrantFiled: January 27, 2006Date of Patent: May 18, 2010Assignee: Applied Materials, Inc.Inventors: Michael Teferra, Amitabh Puri, Eric Englhardt