Patents by Inventor Amna Mohammad

Amna Mohammad has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of feedback control of sub-atmospheric chemical vapor deposition processes
    Patent number: 7201936
    Abstract: A method of film deposition in a sub-atmospheric chemical vapor deposition (CVD) process includes (a) providing a model for sub-atmospheric CVD deposition of a film that identifies one or more film properties of the film and at least one deposition model variable that correlates with the one or more film properties; (b) depositing a film onto a wafer using a first deposition recipe comprising at least one deposition recipe parameter that corresponds to the at least one deposition variable; (c) measuring a film property of at least one of said one or more film properties for the deposited film of step (b); (d) calculating an updated deposition model based upon the measured film property of step (c) and the model of step (a); and (e) calculating an updated deposition recipe based upon the updated model of step (d) to maintain a target film property. The method can be used to provide feedback to a plurality of deposition chambers or to control a film property other than film thickness.
    Type: Grant
    Filed: June 18, 2002
    Date of Patent: April 10, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Alexander T. Schwarm, Arulkumar P. Shanmugasundram, Rong Pan, Manuel Hernandez, Amna Mohammad
  • Feedback control of sub-atmospheric chemical vapor deposition processes
    Publication number: 20030049376
    Abstract: A method of film deposition in a sub-atmospheric chemical vapor deposition (CVD) process includes (a) providing a model for sub-atmospheric CVD deposition of a film that identifies one or more film properties of the film and at least one deposition model variable that correlates with the one or more film properties; (b) depositing a film onto a wafer using a first deposition recipe comprising at least one deposition recipe parameter that corresponds to the at least one deposition variable; (c) measuring a film property of at least one of said one or more film properties for the deposited film of step (b); (d) calculating an updated deposition model based upon the measured film property of step (c) and the model of step (a); and (e) calculating an updated deposition recipe based upon the updated model of step (d) to maintain a target film property. The method can be used to provide feedback to a plurality of deposition chambers or to control a film property other than film thickness.
    Type: Application
    Filed: June 18, 2002
    Publication date: March 13, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Alexander T. Schwarm, Arulkumar P. Shanmugasundram, Rong Pan, Manuel Hernandez, Amna Mohammad