Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

Abstract: Described herein is a miniaturized and ruggedized wafer level MEMS force sensor composed of a base and a cap. The sensor employs multiple flexible membranes, a mechanical overload stop, a retaining wall, and piezoresistive strain gauges.

Abstract: A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.

Abstract: Described herein are ruggedized wafer level MEMS force dies composed of a platform and a silicon sensor. The silicon sensor employs multiple flexible sensing elements containing Piezoresistive strain gages and wire bonds.

Abstract: A composite wafer level MEMS force dies including a spacer coupled to a sensor is described herein. The sensor includes at least one flexible sensing element, such as a beam or diaphragm, which have one or more sensor elements formed thereon. Bonding pads connected to the sensor elements are placed on the outer periphery of the sensor. The spacer, which protects the flexible sensing element and the wire bonding pads, is bonded to the sensor. For the beam version, the bond is implemented at the outer edges of the die. For the diaphragm version, the bond is implemented in the center of the die. An interior gap between the spacer and the sensor allows the flexible sensing element to deflect. The gap can also be used to limit the amount of deflection of the flexible sensing element in order to provide overload protection.

Abstract: Described herein are ruggedized wafer level MEMS force dies composed of a platform and a silicon sensor. The silicon sensor employs multiple flexible sensing elements containing Piezoresistive strain gages and wire bonds.

Abstract: The invention concerns a pressure sensing die to be mounted on a base, comprising: a diaphragm structure with a deflectable pressure sensing diaphragm whose deflection is representative of the pressure and sensing elements for detecting the deflection of the sensing diaphragm; a pedestal supporting the diaphragm structure; wherein the pedestal is a composite pedestal comprising top and bottom platforms connected by at least one small link having a mean cross-section smaller than the cross-section of the top platform, said small link isolating at least some of the stresses, produced by the mounting of the pressure sensing die on the base, from said deflectable pressure sensing diaphragm.

Abstract: The invention relates to a pressure sensing die to be mounted on a base, comprising: a sensing structure comprising: a diaphragm structure with a deflectable sensing diaphragm whose deflection is representative of the pressure and sensing elements for detecting the deflection of the sensing diaphragm, a pedestal supporting the diaphragm structure, a linking structure for isolating at least some of the stresses caused by the mounting of the sensing die on the base from said deflectable sensing diaphragm, the linking structure being linked on one side to a bottom surface of the pedestal and to be linked, on an opposite side, to a top surface of the base, wherein the linking structure comprises at least one linking element extending between the base and the pedestal and having a mean cross-section smaller than the said bottom surface and top surface so as to constitute a small link between the base and the pedestal. The invention further relates to a method of manufacturing such a sensing die.

Abstract: In oil-filled pressure sensors, the measured pressure is applied to a compliant isolation diaphragm, which causes the pressure of the internal oil to increase until it equals the external pressure. The pressure is sensed by a pressure sensing capsule, such as a MEMS piezoresistive pressure sensor. The invention incorporates an electromagnetic force generator, such as a coil and a magnetic core, within the pressure sensor in order to generate simulated pressure. When the coil is energized, the electromagnetic field creates a uniform distributed force, which moves the isolation diaphragm directly, or via an external flexure, in a manner to cause the pressure of the internal oil to increase, which is sensed by the pressure sensing capsule, which responds by producing an output signal proportional to the electromagnetic force. The simulated pressure is employed in order to perform sensor operation monitoring and self-calibration via measurement of the output signal.

Abstract: The invention concerns a pressure sensing die to be mounted on a base, comprising: a diaphragm structure with a deflectable pressure sensing diaphragm whose deflection is representative of the pressure and sensing elements for detecting the deflection of the sensing diaphragm; a pedestal supporting the diaphragm structure; wherein the pedestal is a composite pedestal comprising top and bottom platforms connected by at least one small link having a mean cross-section smaller than the cross-section of the top platform, said small link isolating at least some of the stresses, produced by the mounting of the pressure sensing die on the base, from said deflectable pressure sensing diaphragm.

Abstract: The invention relates to a pressure sensing die to be mounted on a base, comprising: a sensing structure comprising: a diaphragm structure with a deflectable sensing diaphragm whose deflection is representative of the pressure and sensing elements for detecting the deflection of the sensing diaphragm, a pedestal supporting the diaphragm structure, a linking structure for isolating at least some of the stresses caused by the mounting of the sensing die on the base from said deflectable sensing diaphragm, the linking structure being linked on one side to a bottom surface of the pedestal and to be linked, on an opposite side, to a top surface of the base, wherein the linking structure comprises at least one linking element extending between the base and the pedestal and having a mean cross-section smaller than the said bottom surface and top surface so as to constitute a small link between the base and the pedestal. The invention further relates to a method of manufacturing such a sensing die.

Abstract: A pressure sensor assembly comprised of a single and dual layer diaphragm with integrated force sensing flexure, such as a cantilever beam. Strain gages are positioned on the force sensing beam. The pressure forces the diaphragm to deflect. The deflection is constrained by the beam, which is compelled to bend. The bending induces strains in strain gages located on the beam. The strain gages are connected in a Wheatstone bridge configuration. When a voltage is applied to the bridge, the strain gages provide an electrical output signal proportional to the pressure. Composite diaphragm—beam pressure sensors convert pressure more efficiently and improve sensor performance.

Abstract: In oil-filled pressure sensors, the measured pressure is applied to a compliant isolation diaphragm, which causes the pressure of the internal oil to increase until it equals the external pressure. The pressure is sensed by a pressure sensing capsule, such as a MEMS piezoresistive pressure sensor. The invention incorporates an electromagnetic force generator, such as a coil and a magnetic core, within the pressure sensor in order to generate simulated pressure. When the coil is energized, the electromagnetic field creates a uniform distributed force, which moves the isolation diaphragm directly, or via an external flexure, in a manner to cause the pressure of the internal oil to increase, which is sensed by the pressure sensing capsule, which responds by producing an output signal proportional to the electromagnetic force. The simulated pressure is employed in order to perform sensor operation monitoring and self-calibration via measurement of the output signal.

Abstract: A pressure sensor assembly comprised of a single and dual layer diaphragm with integrated force sensing flexure, such as a cantilever beam. Strain gages are positioned on the force sensing beam. The pressure forces the diaphragm to deflect. The deflection is constrained by the beam, which is compelled to bend. The bending induces strains in strain gages located on the beam. The strain gages are connected in a Wheatstone bridge configuration. When a voltage is applied to the bridge, the strain gages provide an electrical output signal proportional to the pressure. Composite diaphragm—beam pressure sensors convert pressure more efficiently and improve sensor performance.

Abstract: A method for forming a non-contact position sensor having a predetermined stroke length comprises providing a pair of coil assemblies each comprising a primary and secondary coil of a predetermined size; providing a core member of varying magnetic density about its length; and inserting the core member within the coil assemblies, whereby axial movement of the core member relative to the coil assemblies causes a corresponding output signal from the coil assemblies indicative of the position of the core member.

Abstract: An electronic sensing circuit, which can be used in place of a linear variable differential transformer (LVDT) has four piezoresistor elements in a Wheatstone bridge configuration. A source voltage is applied across a first pair of bridge points, and the resulting junction voltages appearing at a second pair of bridge points are applied to a pair of inverting amplifiers in balanced configuration which provide first and second output voltages which change relative to each other depending upon the direction and amount of pressure applied to the piezoresistor elements in a manner similar to the output voltages provided by an LVDT.

Abstract: The inductors in a switched resonant circuit are alternately connected in make before break fashion to ensure that at least one inductor is always connected to the tank circuit. This avoids switching discontinuities caused by signal propagation delay. By connecting both coils together between individual coil reading cycles, transients are absorbed.

Abstract: Three series connected inverters (38, 40, 42) are attached to a tank circuit (18) which includes an inductance (12, 14) and a capacitance (16, 17). Negative (38) biases the inverters at the midpoint between the bistable low and high logic level states. Positive feedback from the second inverter (40) to the tank circuit induces oscillation in the tank circuit. The negative feedback is decoupled at the resonant frequency and the energy delivered to the tank circuit from the positive feedback maintains a low level oscillation in the tank circuit. Negative feedback around the three inverter digital circuit prevents lockup in the event of power loss or momentary short.