Patents by Inventor AMO CHEN

AMO CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pellicle assembly and method for advanced lithography
    Patent number: 11914286
    Abstract: The present disclosure provides an apparatus for a lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a pellicle frame including a material selected from the group consisting of boron nitride (BN), boron carbide (BC), and a combination thereof, a mask, a first adhesive layer that secures the pellicle membrane to the pellicle frame, and a second adhesive layer that secures the pellicle frame to the mask.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Amo Chen, Yun-Yue Lin, Ta-Cheng Lien, Hsin-Chang Lee, Chih-Cheng Lin, Jeng-Horng Chen
  • Pellicle Assembly and Method for Advanced Lithography
    Publication number: 20220229360
    Abstract: The present disclosure provides an apparatus for a lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a pellicle frame including a material selected from the group consisting of boron nitride (BN), boron carbide (BC), and a combination thereof, a mask, a first adhesive layer that secures the pellicle membrane to the pellicle frame, and a second adhesive layer that secures the pellicle frame to the mask.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 21, 2022
    Inventors: AMO CHEN, YUN-YUE LIN, TA-CHENG LIEN, HSIN-CHANG LEE, CHIH-CHENG LIN, JENG-HORNG CHEN
  • Pellicle assembly and method for advanced lithography
    Patent number: 11294274
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a porous pellicle frame, a mask with a patterned surface, a first thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame, and a second thermal conductive adhesive layer that secures the porous pellicle frame to the mask.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: April 5, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Amo Chen, Yun-Yue Lin, Ta-Cheng Lien, Hsin-Chang Lee, Chih-Cheng Lin, Jeng-Horng Chen
  • Pellicle Assembly and Method for Advanced Lithography
    Publication number: 20200150527
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a porous pellicle frame, a mask with a patterned surface, a first thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame, and a second thermal conductive adhesive layer that secures the porous pellicle frame to the mask.
    Type: Application
    Filed: January 13, 2020
    Publication date: May 14, 2020
    Inventors: AMO CHEN, YUN-YUE LIN, TA-CHENG LIEN, HSIN-CHANG LEE, CHIH-CHENG LIN, JENG-HORNG CHEN
  • Pellicle assembly and method for advanced lithography
    Patent number: 10534256
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane with a thermal conductive surface; a porous pellicle frame; and a thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame. The porous pellicle frame includes a plurality of pore channels continuously extending from an exterior surface of the porous pellicle frame to an interior surface of the porous pellicle frame.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: January 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Amo Chen, Yun-Yue Lin, Ta-Cheng Lien, Hsin-Chang Lee, Chih-Cheng Lin, Jeng-Horng Chen
  • Pellicle Assembly and Method for Advanced Lithography
    Publication number: 20170351170
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane with a thermal conductive surface; a porous pellicle frame; and a thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame. The porous pellicle frame includes a plurality of pore channels continuously extending from an exterior surface of the porous pellicle frame to an interior surface of the porous pellicle frame.
    Type: Application
    Filed: August 24, 2017
    Publication date: December 7, 2017
    Inventors: AMO CHEN, YUN-YUE LIN, TA-CHENG LIEN, HSIN-CHANG LEE, CHIH-CHENG LIN, JENG-HORNG CHEN