Patents by Inventor Amol D. JADHAV

Amol D. JADHAV has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • NOVEL LGA ARCHITECTURE FOR IMPROVING RELIABILITY PERFORMANCE OF METAL DEFINED PADS
    Publication number: 20220199503
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, an electronic package comprises a package substrate with a die side and a land side. In an embodiment, a pad is on the land side. In an embodiment, a dielectric layer covers sidewalls of the pad, and a surface finish is over an exposed surface of the pad.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 23, 2022
    Inventors: Manish DUBEY, Guruprasad ARAKERE, Deepak KULKARNI, Sairam AGRAHARAM, Wei-Lun K. JEN, Numair AHMED, Kousik GANESAN, Amol D. JADHAV, Kyu-Oh LEE