Patents by Inventor Amor Zapanta

Amor Zapanta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9536756
    Abstract: One or more embodiments are directed to semiconductor packages that are assembled using a sacrificial material, that when removed, separates the assembled packages into individual packages. The sacrificial material may be removed by a blanket technique such that a mask, pattern, or alignment step is not needed. In one embodiment the sacrificial material is formed on the lead frame on a connecting bar of a lead frame between adjacent leads. After the molding step, the connecting bar is etched away exposing a surface of the sacrificial material. The sacrificial material is removed, thereby separating the assembled packages into individual packages.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: January 3, 2017
    Assignee: STMicroelectronics, Inc.
    Inventors: Jefferson Talledo, Amor Zapanta
  • Publication number: 20160379846
    Abstract: One or more embodiments are directed to semiconductor packages that are assembled using a sacrificial material, that when removed, separates the assembled packages into individual packages. The sacrificial material may be removed by a blanket technique such that a mask, pattern, or alignment step is not needed. In one embodiment the sacrificial material is formed on the lead frame on a connecting bar of a lead frame between adjacent leads. After the molding step, the connecting bar is etched away exposing a surface of the sacrificial material. The sacrificial material is removed, thereby separating the assembled packages into individual packages.
    Type: Application
    Filed: June 29, 2015
    Publication date: December 29, 2016
    Inventors: Jefferson Talledo, Amor Zapanta