Patents by Inventor Amos Chen

Amos Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11914286
    Abstract: The present disclosure provides an apparatus for a lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a pellicle frame including a material selected from the group consisting of boron nitride (BN), boron carbide (BC), and a combination thereof, a mask, a first adhesive layer that secures the pellicle membrane to the pellicle frame, and a second adhesive layer that secures the pellicle frame to the mask.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Amo Chen, Yun-Yue Lin, Ta-Cheng Lien, Hsin-Chang Lee, Chih-Cheng Lin, Jeng-Horng Chen
  • Publication number: 20220229360
    Abstract: The present disclosure provides an apparatus for a lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a pellicle frame including a material selected from the group consisting of boron nitride (BN), boron carbide (BC), and a combination thereof, a mask, a first adhesive layer that secures the pellicle membrane to the pellicle frame, and a second adhesive layer that secures the pellicle frame to the mask.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 21, 2022
    Inventors: AMO CHEN, YUN-YUE LIN, TA-CHENG LIEN, HSIN-CHANG LEE, CHIH-CHENG LIN, JENG-HORNG CHEN
  • Patent number: 11294274
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a porous pellicle frame, a mask with a patterned surface, a first thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame, and a second thermal conductive adhesive layer that secures the porous pellicle frame to the mask.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: April 5, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Amo Chen, Yun-Yue Lin, Ta-Cheng Lien, Hsin-Chang Lee, Chih-Cheng Lin, Jeng-Horng Chen
  • Patent number: 11213023
    Abstract: A volatile material dispensing system (100) includes a base (104) and a refill (102) attached to the base (104). The refill (102) includes a substrate (108) having a volatile material thereon. The dispensing system (100) further includes a cover (106). In an inactive state, the refill (102) is compressed within the cover (106) and the cover (106) is attached to the base (104) and in an active state, the cover (106) is removed from the base and the refill (102) automatically expands such that the volatile material is released from the substrate (108) and into the ambient environment.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: January 4, 2022
    Assignee: S. C. Johnson & Son, Inc.
    Inventors: Hai Yan Cao, Amos Chen, Shumao Han, Joanna Jia, Salvador Munoz, Deliang Shi
  • Publication number: 20200150527
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane, a porous pellicle frame, a mask with a patterned surface, a first thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame, and a second thermal conductive adhesive layer that secures the porous pellicle frame to the mask.
    Type: Application
    Filed: January 13, 2020
    Publication date: May 14, 2020
    Inventors: AMO CHEN, YUN-YUE LIN, TA-CHENG LIEN, HSIN-CHANG LEE, CHIH-CHENG LIN, JENG-HORNG CHEN
  • Patent number: 10534256
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane with a thermal conductive surface; a porous pellicle frame; and a thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame. The porous pellicle frame includes a plurality of pore channels continuously extending from an exterior surface of the porous pellicle frame to an interior surface of the porous pellicle frame.
    Type: Grant
    Filed: August 24, 2017
    Date of Patent: January 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Amo Chen, Yun-Yue Lin, Ta-Cheng Lien, Hsin-Chang Lee, Chih-Cheng Lin, Jeng-Horng Chen
  • Publication number: 20170351170
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane with a thermal conductive surface; a porous pellicle frame; and a thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame. The porous pellicle frame includes a plurality of pore channels continuously extending from an exterior surface of the porous pellicle frame to an interior surface of the porous pellicle frame.
    Type: Application
    Filed: August 24, 2017
    Publication date: December 7, 2017
    Inventors: AMO CHEN, YUN-YUE LIN, TA-CHENG LIEN, HSIN-CHANG LEE, CHIH-CHENG LIN, JENG-HORNG CHEN
  • Patent number: 9759997
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane with a thermal conductive surface; a porous pellicle frame; and a thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame. The porous pellicle frame includes a plurality of pore channels continuously extending from an exterior surface of the porous pellicle frame to an interior surface of the porous pellicle frame.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: September 12, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Amö Chen, Yun-Yue Lin, Ta-Cheng Lien, Hsin-Chang Lee, Chih-Cheng Lin, Jeng-Horng Chen
  • Publication number: 20170176850
    Abstract: The present disclosure provides an apparatus for a semiconductor lithography process in accordance with some embodiments. The apparatus includes a pellicle membrane with a thermal conductive surface; a porous pellicle frame; and a thermal conductive adhesive layer that secures the pellicle membrane to the porous pellicle frame. The porous pellicle frame includes a plurality of pore channels continuously extending from an exterior surface of the porous pellicle frame to an interior surface of the porous pellicle frame.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 22, 2017
    Inventors: Amö Chen, Yun-Yue Lin, Ta-Cheng Lien, Hsin-Chang Lee, Chih-Cheng Lin, JENG-HORNG CHEN
  • Patent number: 9498554
    Abstract: A dispensing device for release of an air treatment material includes a semi-permeable substrate having a mesh size between about 15 strands per cm to about 79 strands per cm and a support component for supporting the semi-permeable substrate. The dispensing device releases the air treatment material at a rate of at least about 0.05 mg/hr at about 25° C.
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: November 22, 2016
    Assignee: S.C. Johnson & Son, Inc.
    Inventors: Hai Yan Cao, Amos Chen, Shumao Han, Joanna Jia, Salvador S. Munoz, Deliang Shi
  • Publication number: 20150201604
    Abstract: A volatile material dispensing system (100) includes a base (104) and a refill (102) attached to the base (104). The refill (102) includes a substrate (108) having a volatile material thereon. The dispensing system (100) further includes a cover (106). In an inactive state, the refill (102) is compressed within the cover (106) and the cover (106) is attached to the base (104) and in an active state, the cover (106) is removed from the base and the refill (102) automatically expands such that the volatile material is released from the substrate (108) and into the ambient environment.
    Type: Application
    Filed: July 24, 2013
    Publication date: July 23, 2015
    Applicant: S.C. Johnson & Son, Inc.
    Inventors: Hai Yan Cao, Amos Chen, Shumao Han, Joanna Jia, Salvador Munoz, Deliang Shi
  • Publication number: 20140027530
    Abstract: A dispensing device for release of an air treatment material includes a semi-permeable substrate having a mesh size between about 15 strands per cm to about 79 strands per cm and a support component for supporting the semi-permeable substrate. The dispensing device releases the air treatment material at a rate of at least about 0.05 mg/hr at about 25° C.
    Type: Application
    Filed: July 24, 2012
    Publication date: January 30, 2014
    Inventors: Hai Yan Cao, Amos Chen, Shumao Han, Joanna Jia, Salvador S. Munoz, Deliang Shi
  • Publication number: 20040145140
    Abstract: A twist car includes a body having a hole defined therethrough. A revolving axle is rotatably mounted to a front portion of the body by extending a first end through the hole in the body. A steering wheel is mounted to the first end of the revolving axle and located over the body of the car. A front wheels set includes a balance block, two small wheels and two rolling members that is fixed to a first end of the revolving axle and located underside of the body of the twist car. Two rear wheels are defined underside of the rear portion of the body of the twist car.
    Type: Application
    Filed: January 29, 2003
    Publication date: July 29, 2004
    Inventor: Amos Chen
  • Patent number: D730505
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: May 26, 2015
    Assignee: S.C. Johnson & Son, Inc.
    Inventors: Hai Yan Cao, Amos Chen, Shumao Han, Joanna Jia, Salvador Munoz, Deliang Shi
  • Patent number: D733275
    Type: Grant
    Filed: July 24, 2012
    Date of Patent: June 30, 2015
    Assignee: S.C. Johnson & Son, Inc.
    Inventors: Hai Yan Cao, Amos Chen, Shumao Han, Joanna Jia, Salvador Munoz, Deliang Shi