Abstract: Integrated circuit package testing devices having a substrate with a cavity, and a device connecting a latch to said substrate, wherein said latch provides an unobstructed path to a center of the cavity, and the method for making and using the devices.

Abstract: A socket for removably mounting an electronic device and which has utility for testing of the electronic device. The socket includes pinch-style support contacts which establish a reference seating plane for an IC package. The pinch-style support contacts each include a stationary contact arm, a movable contact arm, and a terminal portion. The stationary contact arm and the movable contact arm each include a contact surface configured to contact a terminal of the IC package. The stationary contact arm additionally includes an IC package support surface and extends beyond the height of the movable contact arm. A method of supporting and electrically connecting the socket and IC package is also disclosed.