Abstract: Exemplary embodiments are disclosed of solar mitigation solutions for electronic equipment, such as electronic control modules (ECMs) or electronic control units (ECUs) (e.g., automotive telematics control unit (TCU), TCU antenna module, etc.), antennas, antenna arrays, vehicular antenna assemblies, radomes, cellular towers, other electronic equipment that is exposed to solar radiation and suffers from the external energy impact, etc.

Abstract: A micromagnetic device and method of forming the same. In one embodiment, the micromagnetic device includes a seed layer formed over a substrate, and a patterned insulating layer and a patterned protective layer formed over the seed layer providing a first exposed section of the seed layer. The micromagnetic device also includes a first electroplated layer segment electroplated over the first exposed section of the seed layer and laterally over sections of the patterned insulating layer and the patterned protective layer.

Abstract: A micromagnetic device and method of forming the same. In one embodiment, the micromagnetic device includes a substrate, a seed layer over the substrate and a magnetic layer over the seed layer. The magnetic layer includes a magnetic alloy including iron, cobalt, boron and phosphorous, wherein a content of the cobalt is in a range of 1.0 to 8.0 atomic percent, a content of the boron is in a range of 0.5 to 10 atomic percent, a content of the phosphorus is in a range of 3.5 to 25 atomic percent, and a content of the iron is substantially a remaining proportion of the magnetic alloy.

Abstract: An apparatus for hardware acceleration for use in operating a computational network is configured for determining that a loop structure including one or more loops is to be executed by a first processor. Each of the one or more loops includes a set of operations. The loop structure may be configured as a nested loop, a cascaded or a combination of the two. A second processor may be configured to decouple overhead operations of the loop structure from compute operations of the loop structure. The apparatus accelerates processing of the loop structure by simultaneously processing the overhead operations using the second processor separately from processing the compute operations based on the configuration to operate the computational network.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: Providing multi-element multi-vector (MEMV) register file access in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device includes a vector processor comprising multiple processing elements (PEs) communicatively coupled via a corresponding plurality of channels to a vector register file comprising a plurality of memory banks. The vector processor provides a direct memory access (DMA) controller that is configured to receive a plurality of vectors that each comprise a plurality of vector elements representing operands for processing a loop iteration. The DMA controller arranges the vectors in the vector register file such that, for each group of vectors to be accessed in parallel, vector elements for each vector are stored consecutively, but corresponding vector elements of consecutive vectors are stored in different memory banks of the vector register file.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: A method, a computer-readable medium, and an apparatus for a sparse neural network are provided. The apparatus may include a hardware accelerator. The apparatus may determine, for each pair of operands to be processed by a MAR unit, whether both operands of the pair are non-zero. The apparatus may prevent a pair of operands to be processed by the MAR unit from being loaded to a multiplier of the MAR unit when an operand of the pair of operands is zero. The apparatus may place the pair of operands into one of a plurality of queues when both operands of the pair of operands are non-zero.

Abstract: Providing reconfigurable fusion of processing elements (PEs) in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device provides a vector processor including a plurality of PEs and a decode/control circuit. The decode/control circuit receives an instruction block containing a vectorizable loop comprising a loop body. The decode/control circuit determines how many PEs of the plurality of PEs are required to execute the loop body, and reconfigures the plurality of PEs into one or more fused PEs, each including the determined number of PEs required to execute the loop body. The plurality of PEs, reconfigured into one or more fused PEs, then executes one or more loop iterations of the loop body. Some aspects further include a PE communications link interconnecting the plurality of PEs, to enable communications between PEs of a fused PE and communications of inter-iteration data dependencies between PEs without requiring vector register file access operations.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: Enabling parallel memory accesses by providing explicit affine instructions in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device implementing a block-based dataflow instruction set architecture (ISA) includes a decoder circuit configured to provide an affine instruction that specifies a base parameter indicating a base value B, a stride parameter indicating a stride interval value S, and a count parameter indicating a count value C. The decoder circuit of the vector-processor-based device decodes the affine instruction, and generates an output stream comprising one or more output values, wherein a count of the output values of the output stream equals the count value C. Using an index X where 0?X<C, each Xth output value in the output stream is generated as a sum of the base value B and a product of the stride interval value S and the index X.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: Providing reconfigurable fusion of processing elements (PEs) in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device provides a vector processor including a plurality of PEs and a decode/control circuit. The decode/control circuit receives an instruction block containing a vectorizable loop comprising a loop body. The decode/control circuit determines how many PEs of the plurality of PEs are required to execute the loop body, and reconfigures the plurality of PEs into one or more fused PEs, each including the determined number of PEs required to execute the loop body. The plurality of PEs, reconfigured into one or more fused PEs, then executes one or more loop iterations of the loop body. Some aspects further include a PE communications link interconnecting the plurality of PEs, to enable communications between PEs of a fused PE and communications of inter-iteration data dependencies between PEs without requiring vector register file access operations.

Abstract: Enabling parallel memory accesses by providing explicit affine instructions in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device implementing a block-based dataflow instruction set architecture (ISA) includes a decoder circuit configured to provide an affine instruction that specifies a base parameter indicating a base value B, a stride parameter indicating a stride interval value S, and a count parameter indicating a count value C. The decoder circuit of the vector-processor-based device decodes the affine instruction, and generates an output stream comprising one or more output values, wherein a count of the output values of the output stream equals the count value C. Using an index X where 0?X<C, each Xth output value in the output stream is generated as a sum of the base value B and a product of the stride interval value S and the index X.

Abstract: Providing multi-element multi-vector (MEMV) register file access in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device includes a vector processor comprising multiple processing elements (PEs) communicatively coupled via a corresponding plurality of channels to a vector register file comprising a plurality of memory banks. The vector processor provides a direct memory access (DMA) controller that is configured to receive a plurality of vectors that each comprise a plurality of vector elements representing operands for processing a loop iteration. The DMA controller arranges the vectors in the vector register file such that, for each group of vectors to be accessed in parallel, vector elements for each vector are stored consecutively, but corresponding vector elements of consecutive vectors are stored in different memory banks of the vector register file.

Abstract: An apparatus for hardware acceleration for use in operating a computational network is configured for determining that a loop structure including one or more loops is to be executed by a first processor. Each of the one or more loops includes a set of operations. The loop structure may be configured as a nested loop, a cascaded or a combination of the two. A second processor may be configured to decouple overhead operations of the loop structure from compute operations of the loop structure. The apparatus accelerates processing of the loop structure by simultaneously processing the overhead operations using the second processor separately from processing the compute operations based on the configuration to operate the computational network.

Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

Abstract: A method, a computer-readable medium, and an apparatus for a sparse neural network are provided. The apparatus may include a hardware accelerator. The apparatus may determine, for each pair of operands to be processed by a MAR unit, whether both operands of the pair are non-zero. The apparatus may prevent a pair of operands to be processed by the MAR unit from being loaded to a multiplier of the MAR unit when an operand of the pair of operands is zero. The apparatus may place the pair of operands into one of a plurality of queues when both operands of the pair of operands are non-zero.