Patents by Inventor Amrit Panda

Amrit Panda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230307165
    Abstract: A micromagnetic device and method of forming the same. In one embodiment, the micromagnetic device includes a substrate, a seed layer over the substrate and a magnetic layer over the seed layer. The magnetic layer includes a magnetic alloy including iron, cobalt, boron and phosphorous, wherein a content of the cobalt is in a range of 1.0 to 8.0 atomic percent, a content of the boron is in a range of 0.5 to 10 atomic percent, a content of the phosphorus is in a range of 3.5 to 25 atomic percent, and a content of the iron is substantially a remaining proportion of the magnetic alloy.
    Type: Application
    Filed: May 4, 2021
    Publication date: September 28, 2023
    Applicant: EnaChip inc.
    Inventors: Trifon Liakopoulos, Amrit Panda
  • Patent number: 11614941
    Abstract: An apparatus for hardware acceleration for use in operating a computational network is configured for determining that a loop structure including one or more loops is to be executed by a first processor. Each of the one or more loops includes a set of operations. The loop structure may be configured as a nested loop, a cascaded or a combination of the two. A second processor may be configured to decouple overhead operations of the loop structure from compute operations of the loop structure. The apparatus accelerates processing of the loop structure by simultaneously processing the overhead operations using the second processor separately from processing the compute operations based on the configuration to operate the computational network.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: March 28, 2023
    Assignee: QUALCOMM Incorporated
    Inventors: Amrit Panda, Francisco Perez, Karamvir Chatha
  • Patent number: 11503718
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: November 15, 2022
    Assignee: Molex, LLC
    Inventors: Marko Spiegel, Victor Zaderej, Amrit Panda
  • Patent number: 11048509
    Abstract: Providing multi-element multi-vector (MEMV) register file access in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device includes a vector processor comprising multiple processing elements (PEs) communicatively coupled via a corresponding plurality of channels to a vector register file comprising a plurality of memory banks. The vector processor provides a direct memory access (DMA) controller that is configured to receive a plurality of vectors that each comprise a plurality of vector elements representing operands for processing a loop iteration. The DMA controller arranges the vectors in the vector register file such that, for each group of vectors to be accessed in parallel, vector elements for each vector are stored consecutively, but corresponding vector elements of consecutive vectors are stored in different memory banks of the vector register file.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: June 29, 2021
    Inventors: Hadi Parandeh Afshar, Amrit Panda, Eric Rotenberg, Gregory Michael Wright
  • Publication number: 20210144861
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Application
    Filed: January 20, 2021
    Publication date: May 13, 2021
    Applicant: Molex, LLC
    Inventors: Marko SPIEGEL, Victor ZADEREJ, Amrit PANDA
  • Patent number: 10905014
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: January 26, 2021
    Assignee: Molex, LLC
    Inventors: Marko Spiegel, Victor Zaderej, Amrit Panda
  • Patent number: 10871964
    Abstract: A method, a computer-readable medium, and an apparatus for a sparse neural network are provided. The apparatus may include a hardware accelerator. The apparatus may determine, for each pair of operands to be processed by a MAR unit, whether both operands of the pair are non-zero. The apparatus may prevent a pair of operands to be processed by the MAR unit from being loaded to a multiplier of the MAR unit when an operand of the pair of operands is zero. The apparatus may place the pair of operands into one of a plurality of queues when both operands of the pair of operands are non-zero.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: December 22, 2020
    Assignee: Qualcomm Incorporated
    Inventors: Yatish Girish Turakhia, Javid Jaffari, Amrit Panda, Karamvir Chatha
  • Patent number: 10846260
    Abstract: Providing reconfigurable fusion of processing elements (PEs) in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device provides a vector processor including a plurality of PEs and a decode/control circuit. The decode/control circuit receives an instruction block containing a vectorizable loop comprising a loop body. The decode/control circuit determines how many PEs of the plurality of PEs are required to execute the loop body, and reconfigures the plurality of PEs into one or more fused PEs, each including the determined number of PEs required to execute the loop body. The plurality of PEs, reconfigured into one or more fused PEs, then executes one or more loop iterations of the loop body. Some aspects further include a PE communications link interconnecting the plurality of PEs, to enable communications between PEs of a fused PE and communications of inter-iteration data dependencies between PEs without requiring vector register file access operations.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: November 24, 2020
    Assignee: Qualcomm Incorporated
    Inventors: Hadi Parandeh Afshar, Amrit Panda, Eric Rotenberg, Gregory Michael Wright
  • Publication number: 20200352032
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Application
    Filed: May 22, 2020
    Publication date: November 5, 2020
    Applicant: Molex, LLC
    Inventors: Marko SPIEGEL, Victor ZADEREJ, Amrit PANDA
  • Patent number: 10667407
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: May 26, 2020
    Assignee: Molex, LLC
    Inventors: Marko Spiegel, Victor Zaderej, Amrit Panda
  • Patent number: 10628162
    Abstract: Enabling parallel memory accesses by providing explicit affine instructions in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device implementing a block-based dataflow instruction set architecture (ISA) includes a decoder circuit configured to provide an affine instruction that specifies a base parameter indicating a base value B, a stride parameter indicating a stride interval value S, and a count parameter indicating a count value C. The decoder circuit of the vector-processor-based device decodes the affine instruction, and generates an output stream comprising one or more output values, wherein a count of the output values of the output stream equals the count value C. Using an index X where 0?X<C, each Xth output value in the output stream is generated as a sum of the base value B and a product of the stride interval value S and the index X.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: April 21, 2020
    Assignee: Qualcomm Incorporated
    Inventors: Amrit Panda, Eric Rotenberg, Hadi Parandeh Afshar, Gregory Michael Wright
  • Publication number: 20200022265
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Application
    Filed: September 24, 2019
    Publication date: January 16, 2020
    Applicant: Molex, LLC
    Inventors: Marko SPIEGEL, Victor ZADEREJ, Amrit PANDA
  • Publication number: 20200012618
    Abstract: Providing reconfigurable fusion of processing elements (PEs) in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device provides a vector processor including a plurality of PEs and a decode/control circuit. The decode/control circuit receives an instruction block containing a vectorizable loop comprising a loop body. The decode/control circuit determines how many PEs of the plurality of PEs are required to execute the loop body, and reconfigures the plurality of PEs into one or more fused PEs, each including the determined number of PEs required to execute the loop body. The plurality of PEs, reconfigured into one or more fused PEs, then executes one or more loop iterations of the loop body. Some aspects further include a PE communications link interconnecting the plurality of PEs, to enable communications between PEs of a fused PE and communications of inter-iteration data dependencies between PEs without requiring vector register file access operations.
    Type: Application
    Filed: July 5, 2018
    Publication date: January 9, 2020
    Inventors: Hadi Parandeh Afshar, Amrit Panda, Eric Rotenberg, Gregory Michael Wright
  • Publication number: 20190384606
    Abstract: Enabling parallel memory accesses by providing explicit affine instructions in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device implementing a block-based dataflow instruction set architecture (ISA) includes a decoder circuit configured to provide an affine instruction that specifies a base parameter indicating a base value B, a stride parameter indicating a stride interval value S, and a count parameter indicating a count value C. The decoder circuit of the vector-processor-based device decodes the affine instruction, and generates an output stream comprising one or more output values, wherein a count of the output values of the output stream equals the count value C. Using an index X where 0?X<C, each Xth output value in the output stream is generated as a sum of the base value B and a product of the stride interval value S and the index X.
    Type: Application
    Filed: June 19, 2018
    Publication date: December 19, 2019
    Inventors: Amrit Panda, Eric Rotenberg, Hadi Parandeh Afshar, Gregory Michael Wright
  • Publication number: 20190369994
    Abstract: Providing multi-element multi-vector (MEMV) register file access in vector-processor-based devices is disclosed. In this regard, a vector-processor-based device includes a vector processor comprising multiple processing elements (PEs) communicatively coupled via a corresponding plurality of channels to a vector register file comprising a plurality of memory banks. The vector processor provides a direct memory access (DMA) controller that is configured to receive a plurality of vectors that each comprise a plurality of vector elements representing operands for processing a loop iteration. The DMA controller arranges the vectors in the vector register file such that, for each group of vectors to be accessed in parallel, vector elements for each vector are stored consecutively, but corresponding vector elements of consecutive vectors are stored in different memory banks of the vector register file.
    Type: Application
    Filed: June 5, 2018
    Publication date: December 5, 2019
    Inventors: Hadi Parandeh Afshar, Amrit Panda, Eric Rotenberg, Gregory Michael Wright
  • Publication number: 20190303156
    Abstract: An apparatus for hardware acceleration for use in operating a computational network is configured for determining that a loop structure including one or more loops is to be executed by a first processor. Each of the one or more loops includes a set of operations. The loop structure may be configured as a nested loop, a cascaded or a combination of the two. A second processor may be configured to decouple overhead operations of the loop structure from compute operations of the loop structure. The apparatus accelerates processing of the loop structure by simultaneously processing the overhead operations using the second processor separately from processing the compute operations based on the configuration to operate the computational network.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 3, 2019
    Inventors: Amrit PANDA, Francisco PEREZ, Karamvir CHATHA
  • Patent number: 10433428
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: October 1, 2019
    Assignee: Molex, LLC
    Inventors: Marko Spiegel, Victor Zaderej, Amrit Panda
  • Publication number: 20180189056
    Abstract: A method, a computer-readable medium, and an apparatus for a sparse neural network are provided. The apparatus may include a hardware accelerator. The apparatus may determine, for each pair of operands to be processed by a MAR unit, whether both operands of the pair are non-zero. The apparatus may prevent a pair of operands to be processed by the MAR unit from being loaded to a multiplier of the MAR unit when an operand of the pair of operands is zero. The apparatus may place the pair of operands into one of a plurality of queues when both operands of the pair of operands are non-zero.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 5, 2018
    Inventors: Yatish Girish TURAKHIA, Javid JAFFARI, Amrit PANDA, Karamvir CHATHA
  • Publication number: 20180184526
    Abstract: Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68a, 68b) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.
    Type: Application
    Filed: June 28, 2016
    Publication date: June 28, 2018
    Applicant: Molex, LLC
    Inventors: Marko SPIEGEL, Victor ZADEREJ, Amrit PANDA
  • Publication number: 20180164866
    Abstract: A method, a computer-readable medium, and an apparatus for reducing power consumption of a neural network are provided. The apparatus may retrieve, from a tag storage, at least one tag value of a first tag value for a weight in the neural network or a second tag value for an activation in the neural network. The first tag value may indicate whether the weight is zero and the second tag value may indicate whether the activation is zero. The weight and the activation are to be loaded to a multiplier of a multiplier-accumulator unit as a pair of operands. The apparatus may determine whether the at least one tag value indicates a zero value. The apparatus may disable loading the weight and the activation to the multiplier when the at least one tag value indicates a zero value. The apparatus may disable updating of zero-value activations.
    Type: Application
    Filed: December 13, 2016
    Publication date: June 14, 2018
    Inventors: Yatish Girish TURAKHIA, Javid JAFFARI, Amrit PANDA, Karamvir CHATHA