Patents by Inventor Amy Gault

Amy Gault has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fluidic dies with conductive members
    Patent number: 11279130
    Abstract: Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: March 22, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, David J Benson, Randy Hoffman, Amy Gault
  • FLUIDIC DIES WITH CONDUCTIVE MEMBERS
    Publication number: 20210229440
    Abstract: Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of aback surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.
    Type: Application
    Filed: April 29, 2019
    Publication date: July 29, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W CUMBIE, David J BENSON, Randy HOFFMAN, Amy GAULT
  • Conductive wire disposed in a layer
    Patent number: 10933634
    Abstract: A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: March 2, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony M Fuller, Terry McMahon, Donald W Schulte, Amy Gault
  • CONDUCTIVE WIRE DISPOSED IN A LAYER
    Publication number: 20190210366
    Abstract: A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.
    Type: Application
    Filed: August 3, 2016
    Publication date: July 11, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Anthony M Fuller, Terry McMahon, Donald W Schulte, Amy Gault
  • Removing segment of a metal conductor while forming printheads
    Patent number: 10166778
    Abstract: An example of a method of forming a printhead includes forming first and second resistors over a first dielectric, forming a first portion of a second dielectric over the first and second resistors and a second portion of the second dielectric over an exposed inclined surface of the first dielectric in a region between the first and second resistors, forming a metal conductor over the first and second portions of the second dielectric, and removing an inclined segment of the metal conductor from an inclined surface of the second portion of the second dielectric to expose the inclined surface of the second portion of the second dielectric.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: January 1, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Steve Rubart, Amy Gault, Sean P McClelland
  • REMOVING SEGMENT OF A METAL CONDUCTOR WHILE FORMING PRINTHEADS
    Publication number: 20180022098
    Abstract: An example of a method of forming a printhead includes forming first and second resistors over a first dielectric, forming a first portion of a second dielectric over the first and second resistors and a second portion of the second dielectric over an exposed inclined surface of the first dielectric in a region between the first and second resistors, forming a metal conductor over the first and second portions of the second dielectric, and removing an inclined segment of the metal conductor from an inclined surface of the second portion of the second dielectric to expose the inclined surface of the second portion of the second dielectric.
    Type: Application
    Filed: April 10, 2015
    Publication date: January 25, 2018
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Steve Rubart, Amy Gault, Sean P McClelland