Patents by Inventor Amy Ge

Amy Ge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for packaging a sensor unit
    Patent number: 8146247
    Abstract: A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step two is forming a first packaging structure to cover the two circuit areas, the emitter and the detector by a mold. Next step is cutting the first packaging structure to form cut groove between and around the emitter and the detector. Next step is forming a second packaging structure in the cut grooves by the same mold. At last, the panel of sensor units is diced and separated as individual sensor units. As above-mentioned, the second packaging structure is used for isolating the signals of the emitter and the detector.
    Type: Grant
    Filed: September 16, 2009
    Date of Patent: April 3, 2012
    Assignee: Lite-On Singapore Pte. Ltd.
    Inventors: Sin-Heng Lim, Amy Ge
  • SENSOR UNIT AND METHOD FOR PACKAGING THE SAME
    Publication number: 20110061340
    Abstract: A method for packaging the sensor units is shown below. First step is providing a substrate, and each sensor area on the substrate is partitioned into two individual circuit areas. An emitter and a detector are installed on the two circuit areas respectively. Step two is forming a first packaging structure to cover the two circuit areas, the emitter and the detector by a mold. Next step is cutting the first packaging structure to form cut groove between and around the emitter and the detector. Next step is forming a second packaging structure in the cut grooves by the same mold. At last, the panel of sensor units is diced and separated as individual sensor units. As above-mentioned, the second packaging structure is used for isolating the signals of the emitter and the detector.
    Type: Application
    Filed: September 16, 2009
    Publication date: March 17, 2011
    Applicant: LITE-ON SINGAPORE PTE LTD.
    Inventors: Sin-Heng LIM, Amy Ge