Patents by Inventor Amy Kai Woo

Amy Kai Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040043170
    Abstract: The invention regards a plastic comprising a level of detectable 8-Nonenal ranging from about 0 to about 400 ppt. Preferably, the plastic is substantially free of perceptible off flavor. Also, in one execution the plastic is used to form a package (e.g., a food and/or beverage bearing package). The package may be constructed of a monolayer of plastic material. Typically, about 20 to about 100% of the package comprises from about 0 to about 1900 ppt of 8-Nonenal. Preferably, the level of the 8-Nonenal of a stored food or beverage product stored in the package for 7 days at a temperature of 150° F. ranges from about 0 to about 400 ppt as measured in a grouping of representative packages with product therein.
    Type: Application
    Filed: June 24, 2003
    Publication date: March 4, 2004
    Applicant: The Procter & Gamble Company
    Inventors: Stephen Paul Zimmerman, Thomas Russell Morsch, Robert Alan Sanders, Peter Michael Searles, Amy Kai Woo, David Vincent Zyzak
  • Publication number: 20020018838
    Abstract: Uniformly shaped snack chips, preferably tortilla-type chips, having raised surface features and a method for preparing the same. The chips can be made from a dough composition comprising pre-cooked starch-based material and pregelatinized starch. Preferably, the snack chips have raised surface features comprising from about 12% to about 40% large surface features; from about 20% to about 40% medium surface features; and from about 25% to about 60% small surface features. In one embodiment, the average thickness of the snack chip is from about 1 mm to about 3 mm; the average thickness of raised surface features is from about 2.3 mm to about 3.2 mm; the maximum thickness of the chip is less than about 5.5 mm; and the coefficient of variation of the chip thickness is greater than about 15%.
    Type: Application
    Filed: May 24, 2001
    Publication date: February 14, 2002
    Inventors: Stephen Paul Zimmerman, Amy Kai Woo, Susan Louise Joa