Abstract: Embodiments of the present disclosure provide a semiconductor structure and a method for manufacturing the same. The manufacturing method includes: providing a substrate and bit line structures on the substrate; forming a first isolation layer, the first isolation layer being located on side walls of the bit line structures and on the substrate; forming a second isolation layer, the second isolation layer covering the first isolation layer located on the side walls of the bit line structures, and exposing the first isolation layer located on the substrate; removing the first isolation layer exposed by the second isolation layer and part of the first isolation layer below the second isolation layer, so that remaining of the first isolation layer is recessed compared to the second isolation layer toward the side walls of the bit line structures to form a groove.

Abstract: Disclosed herein are related to a memory array including a set of memory cells and a set of switches to configure the set of memory cells. In one aspect, each switch is connected between a corresponding local line and a corresponding subset of memory cells. The local clines may be connected to a global line. Local lines may be metal rails, for example, local bit lines or local select lines. A global line may be a metal rail, for example, a global bit line or a global select line. A switch may be enabled or disabled to electrically couple a controller to a selected subset of memory cells through the global line. Accordingly, the set of memory cells can be configured through the global line rather than a number of metal rails to achieve area efficiency.

Abstract: A device may obtain, through wireless signaling from a network, a time-domain wireless-resource allocation (TWRA) pattern allocated to the device by the network and corresponding to a future time interval (TTI) for which the device has not yet decoded corresponding control information. This enables the device to conduct wireless communications during the TTI using resources allocated according to the obtained TWRA pattern, without first having to decode control information to identify the TWRA pattern. The device may obtain the TWRA pattern by obtaining an indication from the network that the TWRA pattern remains associated with future wireless communications of the device until indicated otherwise by the network, and/or by transmitting to the network an indication of preferred parameters associated with the future wireless communications and the TWRA pattern, and/or by transmitting to the network a request to have the network change from a different TWRA pattern to the TWRA pattern.

Abstract: A display substrate, includes a plurality of subpixels arranged in a matrix. Each subpixel is provided with a pixel driver circuit that includes a plurality of thin film transistors and a storage capacitor. The storage capacitor of a present subpixel among the plurality of subpixels and the storage capacitor of an adjacent subpixel adjacent to the current subpixel are disposed in a shared capacitance region of the present subpixel and the adjacent subpixel, and the storage capacitor of the present subpixel and the storage capacitor of the adjacent subpixel are stacked.

Abstract: Provided is a memory device including a substrate, a stack structure, a plurality of pads and an additional dielectric layer. The substrate has an array region and a staircase region. The stack structure is disposed on the substrate. The stack structure includes a plurality of dielectric layers and a plurality of conductive layers stacked alternately. The pads are disposed on the substrate in the staircase region. The pads are respectively connected to the conductive layers, so as to form a staircase structure. The additional dielectric layer is disposed on the stack structure to contact a topmost conductive layer of the conductive layers. A topmost pad of the pads includes a landing portion to contact a plug and an extension portion. The landing portion is laterally adjacent to the additional dielectric layer, and the extension portion extends over a top surface of the additional dielectric layer.

Abstract: An access point (AP) that supports the IEEE 802.11ba protocol may transmit a frame including a physical layer (PHY) preamble to one or more stations (STAs) over a channel. The PHY preamble may include a plurality of repeated modulated legacy signal (L-SIG) fields to spoof a recipient of the frame and protect a wake up signal (WUS) to be subsequently transmitted by the AP. The AP may transmit the WUS to at least a first STA of the one or more STAs, wherein the at least the first STA is a IEEE 802.11ba compliant STA.

Abstract: A method of video processing is described. The method includes: deriving, for a conversion between a current block of a video and a coded representation of the video, a prediction block for the current block that is determined according to a tool in which weights are used to determine a weighted sum of two initial prediction blocks used to determine the prediction block; and performing the conversion using the prediction block; wherein the deriving includes: applying the weights to two intermediate prediction samples that respectively belong to the two initial prediction blocks to derive a final prediction sample; and performing a right shift operation for the final prediction sample, wherein the right shift operation is pbSample>> (shift1+3)), wherein pbSample represents the final prediction sample, shift1 is set equal to Max(2, 14?bitDepth); and determining the prediction block based on the final prediction sample.

Abstract: A welding method for a new flexible and rollable silicon-based solar module includes the following steps: cutting a cell piece into a small piece cell string including N small piece cells without splitting; cutting a hard protective layer into N small pieces according to a size of a small piece cell; allowing the cut hard protective layer to be covered on and bonded to a glue-dispensed small piece cell string to form a small string cell piece; arranging the small string cell pieces into a small standard piece according to a required size distribution, and covering the small standard piece with an adhesive film; welding positive electrodes and negative electrodes of the small standard pieces in series simultaneously to form a 1P standard part; and arranging the 1P standard parts, and fixing the 1P standard parts by bonding the adhesive films to each other to form a 5P standard part.

Abstract: Disclosed herein are a method and a device for remotely diagnosing vehicle faults, a vehicle and a computer storage medium. The method includes monitoring vehicle data uploaded by the vehicle in real time via a cloud platform, and determining whether to identify a preset fault abnormal signal identification from target data of the vehicle data. The method also includes, in response to the fault abnormal signal identification being identified from the target data, sending a fault diagnosis task to the vehicle according to the target data, and receiving diagnosis result data returned by the vehicle after the fault diagnosis task is executed locally by the vehicle. The method further includes generating a remote fault diagnosis result of the vehicle according to the vehicle data and the diagnosis result data.

Abstract: An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.

Abstract: A smart power tool includes: an output shaft, an electric motor, a housing, and an adjustment assembly. The adjustment assembly is used for adjusting a working mode and outputting a mode signal. The working mode includes a drill gear mode and a wood screw mode. In the drill gear mode, a working state of the smart power tool is determined according to a set of current variables and/or a set of feature quantities and a type of a drill bit and, when the smart power tool is in a drill-through state, the electric motor is controlled to stop rotating.

Abstract: Methods and structures includes providing a substrate, forming a prelayer over a substrate, forming a barrier layer over the prelayer, and forming a channel layer over the barrier layer. Forming the prelayer may include growing the prelayer at a graded temperature. Forming the barrier layer is such that the barrier layer may include GaAs or InGaAs. Forming the channel layer is such that the channel layer may include InAs or an Sb-based heterostructure. Thereby structures are formed.

Abstract: Disclosed are an air duct assembly and a cleaning device. The air duct assembly includes a dirt collecting box, a filter, a cyclone separator and a fan. The dirt collecting box is provided with a dirt collecting cavity and the dirt collecting box is also provided with a dirt inlet and an air outlet communicated with the dirt collecting cavity. The dirt collecting cavity is provided with an air guiding structure, the filter is arranged in the air outlet, the cyclone separator is connected with the air outlet, and the fan is connected with the cyclone separator. The fan drives an air flow to enter into the dirt collecting cavity from the dirt inlet, and enter the cyclone separator from the air outlet after being guided by the air guiding structure, and then enter the fan from the cyclone separator.

Abstract: A method for semiconductor fabrication includes providing a device structure having an isolation structure, a fin adjacent the isolation structure, gate structures over the fin and the isolation structure, one or more dielectric layers over the isolation structure and the fin and between the gate structures, a first contact hole over the fin, and a second contact hole over the isolation structure. The method further includes depositing a protection layer and treating it with a plasma so that the protection layer in the first contact hole and the protection layer in the second contact hole have different etch selectivity in an etching process; and etching the protection layer to etch through the protection layer on the bottom surface of the first contact hole without etching through the protection layer on the bottom surface of the second contact hole.

Abstract: A display device, including a display panel, a box, a connection frame and a vibration actuator provided on the display panel. The connection frame includes: a frame-shaped member including a first end face and a second end face arranged opposite to each other, the first end face being attached to a top face of the box, a plurality of protrusions being provided on the second end face, a surface of each protrusion away from the first end face forming a support face, and the display panel being fixed on the support face; and a connection member fixedly coupled to the frame-shaped member, and detachably coupled to the box via a fastener.

Abstract: This application discloses a soft-pack battery module, including at least two battery stack layers stacked in a thickness direction of battery cells, where each battery stack layer includes a battery cell and a connecting piece connected to a tab of the battery cell, the connecting piece includes a first section and a second section, the first section is connected to the tab, the second section is connected to the first section, the second section is arranged by a side of the first section, the second section extends toward a large surface of the battery cell and covers at least a part of the large surface of the battery cell, and an insulating material is provided on a side of the second section away from the large surface of the battery cell.

Abstract: The invention relates to prostate specific membrane antigen humanized antibodies (anti-PSMA) and anti-PSMA antibody drug conjugates. The invention also relates to methods and compositions for using anti-PSMA antibody drug conjugates in inhibiting, preventing or treating PSMA related diseases or cancers.

Abstract: Dynamic encryption and decryption method among lock control system modules comprise the following steps: step 1. filling hardware ID data, an unlocking communication protocol and a mask variable into an array according to a predefined variable space, and encrypting the array based on the mask variable to obtain an encrypted array; step 2. decrypting the encrypted array based on the mask variable to obtain a decrypted array, executing data division on the decrypted array according to the predefined variable space, matching the divided data with data recorded in advance one by one, and if the divided data are consistent with the data recorded in advance, executing related operations according to the decrypted unlocking communication protocol content; otherwise, executing no operation.