Abstract: A multifunctional cleaning pen and a method for cleaning an object are disclosed. The cleaning pen includes a main body, a pen head assembly, an air supply assembly, and a control assembly. The pen head assembly can lift or adsorb a target object for examination onto a platform by a vacuum through the pen, avoiding physical contact with the object by hard tools. The air supply assembly is inside the main body and the control assembly is on a surface of the main body. When the object is in place, it can be cleaned by a jet of air forced out of the pen, and also by a vibrated alcohol wiper on the pen. By utilizing the multifunctional cleaning pen, a cleaning effect in relation to fragile and delicate materials such as camera, mobile phone speaker, and card tray, is improved.

Abstract: An exemplary camera module includes a lens holder, a lens module, an image sensor chip, at least three apart bonding pads, and a light transmittance element. The lens module is received in the lens holder. The lens module includes a barrel and at least one lens received in the barrel. The image sensor chip includes a photosensitive area configured for receiving light transmitted through the lens module. The image sensor chip is attached to an end of the lens holder facing away from the lens module. The bonding pads are arranged on the image sensor chip around the photosensitive area. The light transmittance element is fixed on the image sensor chip via the at least three bonding pads. The present invention also relates to a method for manufacturing the camera module.

Abstract: A method for assembling a camera module includes following steps: providing a circuit board having a connecting region; disposing a liquid anisotropic conductive adhesive on the connecting region of the circuit board; placing an image sensor module, on the connecting region of the circuit board; thermal press-bonding the image sensor module onto the circuit board to fix the image sensor module with the circuit board. Because the anisotropic conductive adhesive before being disposed on the circuit board is liquid and doesn't needs to be cut, flow-shop operations are easy to achieve, and costs are decreased.