Abstract: A ceiling fan infrared detection and control system has a wall-mounted controller, a ceiling fan controller, and a motor. The wall-mounted controller has an infrared sensor that is arranged outwardly and horizontally. The wall-mounted controller is pivotally equipped with a lens outside the infrared sensor for detecting infrared rays of a human body within a detection range. The control unit can output a wireless signal to the ceiling fan controller to control the motor according to the infrared detection result. The ceiling fan infrared detection and control system uses the technical feature that the lens is rotatable relative to the wall-mounted controller, so that the detection range can be moved synchronously along with the lens. The detection range has directivity and the function of adjusting the detection position, which can avoid false detection of a pet below the height of the detection range.

Abstract: A position indicator indicates a position in a three-dimensional (3D) space. The position indicator includes an elongated casing; a position indicating part which is disposed at one end of the elongated casing and which, in operation, indicates the position; a grip part configured to be gripped with a palm of a user in a state in which the elongated casing is gripped between fingers of the user; and a tracker which, in operation, causes an external device to detect a tracker position of the tracker in the 3D space, wherein the tracker is disposed so as to be not covered by the user's hand when the user palm-grips the grip part. The tracker position of the tracker and a position of the position indicating part are in a specific positional relation.

Abstract: A semiconductor device includes a substrate having a first region and a second region of opposite conductivity types, an isolation feature over the substrate, a first fin protruding from the substrate in the first region, a first epitaxial feature over the first fin, a second fin protruding from the substrate in the second region, and a second epitaxial feature over the second fin. The isolation feature includes a first portion disposed on sidewalls of the first fin, a second portion disposed on sidewalls of the second fin, and a third portion located between the first fin and the second fin. The third portion has a thickness larger than the first portion and the second portion.

Abstract: An aerial vehicle includes a position sensor configured to obtain a present position of the aerial vehicle, a memory configured to store a preset position of the aerial vehicle, and a controller. The controller is configured to calculate, based on the present position and the preset position, safety energy information of the aerial vehicle; and control, based on the safety energy information and a present remaining energy amount of the aerial vehicle, the aerial vehicle to perform a safety protection command.

Abstract: Disclosed is a stress-resistant trace structure and a piezoelectric detection device made thereof. The stress-resistant trace structure includes a patterned trace layer and a porous anti-stress layer. The patterned trace layer has a non-linear pattern and is configured on the porous anti-stress layer. Specifically, the porous anti-stress layer has a plurality of through holes, and the through holes are vertically interlaced with the non-linear pattern.

Abstract: Disclosed is an aminopyrimidine compound as a CDK2/4/6 inhibitor, and specifically disclosed are the compound represented by formula (I) and a pharmaceutically acceptable salt thereof, and an application of the compound represented by formula (I) and the pharmaceutically acceptable salt thereof in the preparation of a medicament for treating solid tumor.

Abstract: Some embodiments relate to an integrated chip including a semiconductor substrate and a pixel array comprising a plurality of photodetectors in the semiconductor substrate. The pixel array further comprises a plurality of transistors on a frontside of the semiconductor substrate. A backside ground (BSGD) structure extends into a backside of the semiconductor substrate, opposite the frontside, and further surrounding the pixel array along a periphery of the pixel array. The BSGD structure has a first sloped sidewall extending from a bottom surface of the BSGD structure that is recessed into the semiconductor substrate.

Abstract: A user equipment (UE) (e.g., an enhanced machine type communication (EMTC) UE) may identify several narrowbands associated with eMTC protocol based on a system bandwidth of a New Radio (NR) carrier. A base station may transmit an indication of a set of valid narrowbands for eMTC (e.g., based on coexistence considerations between eMTC and NR) to the UE. The base station may further transmit a frequency hopping pattern to the UE (e.g., associated with narrowbands within the set of valid narrowbands), and transmit one or more downlink transmissions according to the frequency hopping pattern. Additionally or alternatively, a base station may identify a subcarrier offset and/or resource block offset between resources (e.g., a resource grid) used for eMTC protocol and resources used for NR. The base station may transmit a frequency alignment parameter to the UE, and the UE may align narrowbands for eMTC accordingly.

Abstract: Present disclosure provides a method including: forming a semiconductor stack having at least one SiGe layer; forming a plurality of fins from the semiconductor stack by a first etching operation, each of the plurality of fins comprising a first portion and a second portion over the first portion, the first portion being separated from the second portion by a SiGe portion; forming a poly gate stripe orthogonally over the plurality of fins; forming a recess on each of the plurality of fins abutting the poly gate; recessing the SiGe portion by a second etching operation through the recess; forming a first spacer and a second spacer to surround the SiGe portion; and removing the SiGe portion.

Abstract: A semiconductor structure includes a first semiconductor substrate, a first interconnect structure disposed below the first semiconductor substrate, a through substrate via (TSV) penetrating through the first semiconductor substrate and extending into the first interconnect structure, and a first bonding conductor disposed below the first interconnect structure and electrically coupled to the TSV through the first interconnect structure. The TSV includes a first surface in the first interconnect structure and a second surface opposite to the first surface, and the first bonding conductor includes a first bonding surface facing away the first interconnect structure. In a view, a boundary of the first bonding surface of the first bonding conductor overlaps a boundary of the first surface of the TSV.

Abstract: A subharmonic switching power amplifier architecture includes a power amplifier core that includes at least one power amplifier that receives an input signal and is operable in a power back-off region. Characteristically, the at least one power amplifier is configured to be toggled at a carrier frequency (Fc) when the power level of the input signal is equal to or higher than a predetermined power level and at a subharmonic component of the carrier frequency when the power level of the input signal is less than the predetermined power level. Concurrent harmonic tuning and subharmonic tuning is implemented to enhance the efficiency at both peak power mode and power back-off mode. Characteristically, the power amplifier being configured to be operated by a voltage mode or current mode driver and in the current mode with zero-voltage-switching.

Abstract: An organic-inorganic composite electrolyte comprises a plurality of metal cations, a plurality of organic polymer groups, a plurality of negatively charged ion groups and a plurality of salt anions. At least part of the plurality of metal cations is combined with the plurality of organic polymer groups, the plurality of negatively charged ion groups and the plurality of salt anions via covalent bonds.

Abstract: A method and a device for controlling grid configuration of a flexible direct current electric power transmission system, and a computer-readable storage medium are provided. The active power reference value is modified based on the frequency deviation of the alternating current grid. The reactive power reference value is modified based on the voltage deviation of the alternating current grid. The outputted active power and the outputted reactive power are controlled based on the active power reference value and the reactive power reference value, respectively. The grid voltage is further configured and controlled through power control, so that the system is capable of self-synchronization, frequency regulation and voltage regulation. In addition, the virtual synchronous machine technology is introduced into control of the reactive power, so that the system can provide inertia support for the grid voltage amplitude.

Abstract: Systems, methods, and instrumentalities are disclosed for performing overlapped block motion compensation (OBMC). OBMC may be performed by considering sub-blocks within a coding block as an entire block if a motion field is uniform. OBMC may be performed on a coding block partitioned into multiple sub-blocks, using a block-based OBMC approach. The sub-blocks may be determined to have the same motion field, if the affine model associated with the block is translational. OBMC may be performed by subtracting OBMC from an original picture in the merge modes, using a block-based approach. A block coded in OBMC mode may be used in motion compensation, for example a fast merge pass of merge mode(s). The top band and the left band of the block may be subtracted from the input signal associated with the current block, and motion compensation may be performed on the block having the top and left bands subtracted.

Abstract: The present disclosure relates to a cooking utensil with air frying and pressure cooker functions. The cooking utensil includes a cooker body (1), an inner pot (2), a lid (4), and a heating plate (5); the cooker body (1) includes a middle housing (15) and an outer housing (23); the heating plate (5) is arranged above a bottom surface of the middle housing (15); the inner pot (2) is arranged in an inner cavity of the middle housing (15). When the air frying subassembly (3) is put into the cooker body, the fan subassembly works, and the centrifugal air turbine (12) draws air in the cavity of the middle housing (15) into the bottom surface of the middle housing (15) and exchanges heat with the heating plate (5) to cook food.

Abstract: Disclosed are a series of furan fused ring-substituted glutarimide compounds and an application thereof in preparation of a drug for treating related diseases. In particular, disclosed is a compound represented by formula (II) or a pharmaceutically acceptable salt thereof.

Abstract: An image editing method includes acquiring an initial image generation model and a feature image generation model, the initial image generation model having been trained based on a first training image set, the feature image generation model having been obtained by training the initial image generation model based on a second training image set. The method further includes acquiring a joint mask image based on image regions corresponding to the target attribute in the object images, and acquiring a second initial object image and a second feature object image output by corresponding target network layers. The method further includes fusing the second initial object image and the second feature object image based on the joint mask image to obtain a reference object image.

Abstract: An antenna structure includes a ground element, a feeding radiation element, a first radiation element, a second radiation element, a shorting radiation element, a third radiation element, and a fourth radiation element. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element and the first radiation element substantially extend in opposite directions. The feeding radiation element is further coupled through the shorting radiation element to the ground element. The third radiation element is coupled to the ground element. The third radiation element is adjacent to the first radiation element. The fourth radiation element is coupled to the ground element. The fourth radiation element is adjacent to the second radiation element.

Abstract: Disclosed is an adjustable retractable screen door including a retractable screen door, wherein a screen housing is sleeved with an end cap, the end cap includes a housing and a guide leg, the end cap is connected with a screen channel through the guide leg, and the screen channel is provided with an end cap connection channel and a handle slide channel. This mounting accessory is used for compatibly mounting the above-mentioned adjustable retractable screen door and includes an upper mounting adapter and a lower mounting adapter. The upper mounting adapter includes an upper mounting block and an adjustment block which cooperates with the upper mounting block and a connector, the upper mounting block includes a screw boss, an adjustment screw and a locator guide, and the adjustment block includes a threaded hole and a guide bump.

Abstract: An apparatus for wafer bonding includes a first bearing table configured to hold a first wafer provided with at least one first alignment mark; a second bearing table, opposite to the first bearing table, and configured to hold a second wafer provided with at least one second alignment mark; an alignment component, located on at least a side of the first or second bearing table, and configured to determine first and second position parameters of the first and second alignment marks, respectively, by using an optical beam; a mobile component, connected to the first and second bearing tables, and configured to adjust, according to the first an second position parameters, a relative position between the first and second wafers until a relative position between the first and second alignment marks satisfies a predetermined bonding condition; and a bonding component, connected to the first and second bearing tables, and configured to bond the first wafer to the second wafer.