Abstract: A method and apparatus for carrier aggregation is disclosed. In one embodiment, a method performed by a first wireless communication node, comprising: receiving a downlink signal containing first information from a second wireless communication node, and based on at least a portion of the first information, determining first resource information to perform sidelink communication between the first wireless communication node and at least one third wireless communication node.

Abstract: Pharmaceutical compositions, kits and methods for treating tumors such as glioma and cancers such as leukemia with (R)-2-hydroxyglutarate (R-2HG) are provided, along with therapeutic regimens including treatment of a patient suffering from glioma or leukemia with a MYC-signaling inhibitor followed by or cotemporaneous with treatment with R-2HG, and optionally other chemotherapeutic agents.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a transistor, a conductive feature on the transistor, a dielectric layer over the conductive feature, and an electrical connection structure in the dielectric layer and on the conductive feature. The electrical connection structure includes a first grain of a first metal material and a first inhibition layer extending along a grain boundary of the first grain of the first metal material, the first inhibition layer is made of a second metal material, and the first metal material and the second metal material have different oxidation/reduction potentials.

Abstract: A cabinet for goods storage and access is provided, including: at least one fixed shelf configured to store goods; a moving member located on a side of the fixed shelf; a controller configured to control the moving member to move along the side of the fixed shelf to place goods in the fixed shelf or extract goods from the fixed shelf; a cabinet body surrounding the fixed shelf and the moving member, wherein a first slot is disposed on the cabinet body and adjacent to a moving track of the moving member, wherein the controller is configured to control the first slot to be opened or closed; and a volume recognizer disposed adjacent to the first slot to recognize a volume of goods entering the first slot.

Abstract: The present invention addresses the issue of secure and trusted Internet of Things (IoT) blockchain networks by adopting the emerging blockchain technologies. The present invention proposes a new hybrid blockchain technology to address the trusted IoT issues such as trustless communications and decentralized applications. Besides, the present invention also disclose that the pseudonymous authentication technique can use a puzzle-solving computation to enable trustless communications for the IoT and provide the capabilities of near real-time transactions.

Abstract: A display panel, a method of manufacturing the same, and a display device are provided. In the display panel, sub-pixel areas in a same row along a first direction are divided into a plurality of sub-pixel area groups independent from each other, and each sub-pixel area group includes at least two adjacent sub-pixel areas, a connection layer includes a connection pattern arranged in each sub-pixel area, and the connection pattern is coupled to the initialization signal line pattern in the sub-pixel area wherein the connection pattern is located, connection patterns located in a same sub-pixel area group are sequentially coupled along the first direction to form the connection portion; at least part of a first auxiliary signal line layer is located in an anode spacing area, and is insulated from an anode pattern, the connection pattern in each sub-pixel area group is coupled to the first auxiliary signal line layer.

Abstract: A method for manufacturing a structure for embedding and packaging multiple devices by layer includes preparing a polymer supporting frame, mounting a first device in a first device placement mouth frame to form a first packaging layer, forming a first circuit layer and a second circuit layer, forming a second conductive copper pillar layer and a second sacrificial copper pillar layer, forming a second insulating layer on the first circuit layer, and forming a third insulating layer on the second circuit layer, forming a second device placement mouth frame vertically overlapped with the first device placement mouth frame, mounting a second device and a third device in the second device placement mouth frame to form a second packaging layer, forming a third circuit layer on the second insulating layer. A terminal of the second device and a terminal of the third device are respectively communicated with the third circuit layer.

Abstract: In one example aspect, a method for integrated circuit (IC) fabrication comprises providing a device structure including a substrate, a source/drain (S/D) feature on the substrate, a gate stack on the substrate, a contact hole over the S/D feature; and a dummy feature over the S/D feature and between the gate stack and the contact hole. The method further comprises forming in the contact hole a contact plug that is electrically coupled to the S/D feature, and, after forming the contact plug, selectively removing the dummy feature to form an air gap that extends higher than a top surface of the gate stack. The method further comprises forming over the contact plug a seal layer that covers the air gap.

Abstract: An integrated circuit (IC) structure includes a semiconductor substrate, a bottom electrode routing, a capacitor structure, a top electrode routing. The bottom electrode routing is over the semiconductor substrate. The capacitor structure is over the bottom electrode routing. The capacitor structure includes a bottom metal layer, a middle metal layer above the bottom metal layer, and a top metal layer above the middle metal layer. When viewed in a plan view, the top metal layer has opposite straight edges extending along a first direction and opposite square wave-shaped edges connecting the opposite straight edges, the square wave-shaped edges each comprise alternating first and second segments extending along a second direction perpendicular to the first direction, and third segments each connecting adjacent two of the first and second segments, wherein the third segments extend along the first direction.

Abstract: A printed circuit board includes a reference plane embedded in a substrate and adjacent to the top surface of the substrate. The printed circuit board also includes a first signal net and a second signal net being in close proximity to each other and disposed within a specific region on the top surface of the substrate. An outermost insulating layer on the top surface of the substrate covers the substrate, the first signal net and the second signal net, and includes an opening to expose a portion of the second signal net. A conductive layer is disposed in the opening and on the outermost insulating layer corresponding to the specific region, such that the conductive layer overlaps with the first signal net. A fifth signal net is embedded in the substrate and between the reference plane and the outermost insulating layer.

Abstract: Various implementations described herein are related to a method for accessing a bitcell in an array of bitcells with a wordline and a bitline. The method may perform a precharge operation on the bitline that precharges the bitline after a read cycle and before a write cycle. Also, the method may extend precharge time of the precharge operation between the read cycle and the write cycle, e.g., by modulating a wordline signal on the wordline with early cut-off of the wordline signal on the wordline during the read cycle.

Abstract: An electrical connector includes an insulative housing defining a mating surface and a mating slot recessed from the mating surface and extending in a longitudinal direction, plural conductive terminals arranged on the insulative housing, and a pair of reinforcing members. The insulative housing comprises two side walls extending along the longitudinal direction and two end walls connecting with the side walls. The conductive terminal comprises a contact portion protruding into the mating slot and a soldering portion extending out of the insulative housing. Each of the end walls defines a groove penetrating the mating surface and communicating with the mating slot and an exterior in the longitudinal direction. Each reinforcing member comprises an end wall portion and a fixing portion retained in the insulative housing. The end wall portion is accommodated in a corresponding groove to complete a corresponding end wall of the insulative housing.

Abstract: The present invention provides an improved percutaneous dilation tracheostomy device. The device is configured to include all of the required components to perform a percutaneous tracheotomy. The device includes a retractable needle and an extendable j-wire rather than having separate components as in typical percutaneous tracheostomy devices. The device includes a dilator section to expand the diameter of a patient's stoma. The device is further configured to allow an operator to perform a bubble test to alert the user that the tube is in the trachea. In addition, the device is generally more compact than typical emergency tracheostomy devices.

Abstract: A semiconductor device includes a gate structure on a substrate, an offset spacer adjacent to the gate structure, a main spacer around the offset spacer, a source/drain region adjacent to two sides of the main spacer, a contact etch stop layer (CESL) adjacent to the main spacer, and an interlayer dielectric (ILD) layer around the CESL. Preferably, a dielectric constant of the offset spacer is higher than a dielectric constant of the main spacer.

Abstract: The present disclosure relates to inhibited waxy starches and methods for using them. One aspect of the disclosure is an inhibited waxy starch based on maize, wheat, or tapioca having an amylopectin content in the range of 90-100%; and a sedimentation volume in the range of 10-50 mL/g; in which the amylopectin fraction of the inhibited waxy starch based on maize, wheat, or tapioca has no more than 48.5% medium-length branches having a chain length from 13-24 (measured by a valley-to-valley method as described herein), and the starch is not pregelatinized. Methods of using the starch materials in food products are also described.

Abstract: A system for cosmetic inspection of a test object is disclosed that includes a movable platform for receiving a test object. The movable platform is capable of positioning the test object within a dome. A plurality of cameras arranged oriented to capture different views of a plurality of surfaces of the test object. A plurality lights arranged are outside the dome, the plurality of lights selectively enabled or disabled according to which of the plurality of surfaces of the test object is to be captured.

Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.