Patents by Inventor An-Chi Tsai
An-Chi Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250148777Abstract: Imaging systems and techniques are described. In some examples, an imaging system generates a segmentation map of an image by processing image data associated with the image using a segmentation mapper. Different object types in the image are categorized into different regions in the segmentation map. The imaging system generates an augmented segmentation map by processing at least the segmentation map using a segmentation map error correction engine. The imaging system generates processed image data by processing the image using the augmented segmentation map.Type: ApplicationFiled: November 8, 2023Publication date: May 8, 2025Inventors: Chung-Chi TSAI, Hau HWANG
-
Patent number: 12293521Abstract: Methods, systems, and apparatuses for image segmentation are provided. For example, a computing device may obtain an image, and may apply a process to the image to generate input image feature data and input image segmentation data. Further, the computing device may obtain reference image feature data and reference image classification data for a plurality of reference images. The computing device may generate reference image segmentation data based on the reference image feature data, the reference image classification data, and the input image feature data. The computing device may further blend the input image segmentation data and the reference image segmentation data to generate blended image segmentation data. The computing device may store the blended image segmentation data within a data repository. In some examples, the computing device provides the blended image segmentation data for display.Type: GrantFiled: September 1, 2022Date of Patent: May 6, 2025Assignee: QUALCOMM IncorporatedInventors: Chung-Chi Tsai, Shubhankar Mangesh Borse, Meng-Lin Wu, Venkata Ravi Kiran Dayana, Fatih Murat Porikli, An Chen
-
Publication number: 20250135627Abstract: A tool holder rail and a tool holder including the same are provided, wherein the tool holder rail includes: an elongate main body extending in a longitudinal direction and including two mounting sides extending in the longitudinal direction, the two mounting sides being inclined to each other with an included angle therebetween; and two rail slots disposed on the two mounting sides, respectively, each of the two rail slots including two flanges extending in the longitudinal direction and toward each other, each of the two rail slots being configured for slidable engagement of a tool seat.Type: ApplicationFiled: October 27, 2023Publication date: May 1, 2025Inventor: CHI-TSAI CHANG
-
Publication number: 20250127107Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to improve the efficacy of fertilizer usage and absorption by soybeans. By selectively choosing specific weights of feathers and water, and treating the mixture to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then infused to the fertilized soil in which the soybean seeds are grown, as well as the plants after the seed start sprouting. Optionally, the KHP solution can be diluted by water, as disclosed in the specification, for applying to the soil around the soybean.Type: ApplicationFiled: January 9, 2024Publication date: April 24, 2025Applicant: CH Biotech R&D Co., Ltd.Inventors: Jenn Wen HUANG, Ching-Chi TSAI, Yu-Lun LIU
-
Patent number: 12266553Abstract: A method for annealing a wafer includes loading the wafer to a fork of a delivering robot in an annealing apparatus, wherein the wafer is in contact with a vibration-detecting sensor on the fork; rotating the fork between a heating plate and a cooling plate of the annealing apparatus; outputting, by the vibration-detecting sensor, a first signal in response to a motion of the fork of the delivering robot when the wafer is loaded on the fork; and providing, by a circuitry of the annealing apparatus, a response in response to the first signal.Type: GrantFiled: February 17, 2023Date of Patent: April 1, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yung-Chang Huang, Yu-Chi Tsai
-
Patent number: 12256537Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate, a channel region positioned in the substrate, first impurity regions positioned in the substrate and respectively positioned on two ends of the channel region, a gate dielectric layer positioned on the channel region, a gate bottom conductive layer positioned on the gate dielectric layer, composite contacts respectively positioned on the first impurity regions, programmable insulating layers respectively positioned on the composite contacts, a top conductive layer positioned on the programmable insulating layers and electrically coupled to the gate bottom conductive layer. One of the plurality of composite contacts includes a protection liner having a U-shaped profile and a metal core in the protection liner.Type: GrantFiled: March 18, 2022Date of Patent: March 18, 2025Assignee: NANYA TECHNOLOGY CORPORATIONInventor: Hung-Chi Tsai
-
Publication number: 20250081972Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to increase the grape plant's color changing (ripening) rate, flavor and sweetness. By selectively choosing specific weights of feathers and water, and treating the mixture, though one embodiment does not have water mixed in, to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the leaf surface of grape plants at different growth stages. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the leaf surface of the grape plants.Type: ApplicationFiled: December 20, 2023Publication date: March 13, 2025Applicant: CH Biotech R&D Co., Ltd.Inventors: Kai XIA, Ching-Chi TSAI, Meng-Ying LI, Yu-Lun LIU, Nai-Hua YE, Jie-Chao YOU
-
Publication number: 20250084134Abstract: Present invention uses a mixture of feathers and water, and, depending on specific embodiments of the ratio between feathers and water, subject the mixture to a high-temperature and high-pressure treatment process for a fixed amount of time, resulting in a keratin solution containing at least 253 peptides, with their molecular masses between 500 and 4,000 Daltons, and the concentration is in the range of 2.0×105˜4.5×105 ppm. The solution can then be further diluted by water for application to different plants, at specific growth stages, following additional steps or processes of application to increase crops yield.Type: ApplicationFiled: December 4, 2023Publication date: March 13, 2025Applicant: CH Biotech R&D Co., Ltd.Inventors: Kai XIA, Ching-Chi TSAI, Meng-Ying LI, Yu-Lun LIU, Nai-Hua YE
-
Publication number: 20250084010Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to increase the grape plant's production yield. By selectively choosing specific weights of feathers and water, and treating the mixture, though one embodiment does not have water mixed in, to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the leaf surface of grape plants at different growth stages. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the leaf surface of the grape plants.Type: ApplicationFiled: December 9, 2023Publication date: March 13, 2025Applicant: CH Biotech R&D Co., Ltd.Inventors: Kai XIA, Ching-Chi TSAI, Meng-Ying LI, Yu-Lun LIU, Nai-Hua YE
-
Publication number: 20250085336Abstract: The present disclosure provides a correction system and method for correcting a semiconductor circuit. The correction system includes a plurality of redundant circuit units, a plurality of switching circuit units and a control circuit. The redundant circuit units are coupled to the semiconductor circuit. The switching circuit units are coupled to the redundant circuit units and a plurality of basic circuit units of the semiconductor circuit. The control circuit is coupled to the semiconductor circuit and the switching circuit units, is configured to obtain a noise signal of the semiconductor circuit, is configured to determine whether the semiconductor circuit passes a noise test by recognizing a characteristic of the noise signal, and is configured to replace one of the basic circuit units with one of the redundant circuit units by controlling the switching circuit units when the semiconductor circuit does not pass the noise test.Type: ApplicationFiled: May 22, 2024Publication date: March 13, 2025Inventors: Li-Lung KAO, Chia-Chi TSAI, Pei-Chun LIAO, Kai-Yi HUANG, Sin Hua WU
-
Patent number: 12250806Abstract: The present disclosure relates to a semiconductor device including a semiconductor substrate, word lines, mask layers, spacers, a conductive plug, a conductive cap layer, and a dielectric layer. The word lines are disposed over the semiconductor substrate. The mask layers are disposed over the plurality of word line, respectively. The spacers are disposed over opposite sidewalls of the word lines and opposite sidewalls of the mask layers, respectively. The conductive plug is disposed between the word lines. The conductive cap layer is disposed over the conductive plug. The dielectric layer is disposed over the word lines and the spacers. Each of the spacers includes an inner spacer, an outer spacer, and an air gap. The inner spacer is in contact with the respective word line and the respective mask layer. The air gap is disposed between the inner spacer and the outer spacer.Type: GrantFiled: November 15, 2023Date of Patent: March 11, 2025Assignee: NANYA TECHNOLOGY CORPORATIONInventor: Hung-Chi Tsai
-
Publication number: 20250073103Abstract: An integrated automatic turning bed system is provided. The system integrates the system controller with subsystems such as an electric turning bed, a pressure-sensing mattress, and/or an electronic diaper machine, and achieves comprehensive care for incapacitated bedridden people through automation and intelligence. By utilizing subsystem sensing and system controller to control and ensure the stability, reliability, and control accuracy of the system, the safety and comfort of the bedridden people can be ensured and care services are improved, which also effectively reduces the burden on caregivers at the same time.Type: ApplicationFiled: December 20, 2023Publication date: March 6, 2025Inventors: Jinn-Biau SHEU, Kun-Chi TSAI, Fu-Kang LU, Hao-Jen KAO
-
Patent number: 12245423Abstract: The present disclosure relates to a semiconductor device including a semiconductor substrate, word lines, mask layers, spacers, a conductive plug, a conductive cap layer, and a dielectric layer. The word lines are disposed over the semiconductor substrate. The mask layers are disposed over the plurality of word line, respectively. The spacers are disposed over opposite sidewalls of the word lines and opposite sidewalls of the mask layers, respectively. The conductive plug is disposed between the word lines. The conductive cap layer is disposed over the conductive plug. The dielectric layer is disposed over the word lines and the spacers. Each of the spacers includes an inner spacer, an outer spacer, and an air gap. The inner spacer is in contact with the respective word line and the respective mask layer. The air gap is disposed between the inner spacer and the outer spacer.Type: GrantFiled: August 15, 2023Date of Patent: March 4, 2025Assignee: NANYA TECHNOLOGY CORPORATIONInventor: Hung-Chi Tsai
-
Patent number: 12191403Abstract: A merged PiN Schottky (MPS) diode includes a substrate, a first epitaxial layer of a first conductivity type, doped regions of a second conductivity type, a second epitaxial layer of the first conductivity type, and a Schottky metal layer. The first epitaxial layer is disposed on the first surface of the substrate. The doped regions are disposed in a surface of the first epitaxial layer, wherein the doped regions consist of first portions and second portions, the first portions are electrically floating, and the second portions are electrically connected to a top metal. The second epitaxial layer is disposed on the surface of the first epitaxial layer, wherein trenches are formed in the second epitaxial layer to expose the second portions of the doped regions. The Schottky metal layer is conformally deposited on the second epitaxial layer and the exposed second portions of the doped regions.Type: GrantFiled: March 28, 2024Date of Patent: January 7, 2025Assignee: LEAP Semiconductor Corp.Inventors: Wei-Fan Chen, Kuo-Chi Tsai
-
Patent number: 12191557Abstract: An electronic device includes a metal back cover and an antenna module. The metal back cover includes a slot. The antenna module is located in the metal back cover. The antenna module includes a first radiator, second radiator, third radiator, fourth radiator, and fifth radiator. The first radiator has a feeding end. The second radiator connected to the first radiator has a contact portion which is connected to the metal back cover. The third radiator is connected to the second radiator and is located beside the first radiator. The third radiator has a first grounding terminal. The fourth radiator is connected to the second radiator and has a second grounding terminal. The fifth radiator is connected to the third radiator and the fourth radiator. Distances between the feeding end and the slot, the first grounding terminal and the slot, and the second grounding terminal and the slot all range from 3.5 mm to 10 mm.Type: GrantFiled: August 12, 2022Date of Patent: January 7, 2025Assignee: PEGATRON CORPORATIONInventors: Chien-Yi Wu, Hau Yuen Tan, Chao-Hsu Wu, Chen-Kuang Wang, Chih-Fu Chang, Tsung-Chi Tsai, Shih-Keng Huang, Tse-Hsuan Wang, Sheng-Chin Hsu
-
Patent number: 12178817Abstract: The present invention relates to a novel type of PPAR? modulator having a pyrimido[5,4-d]pyrimidine main structure. The PPAR? modulator can enhance the expression and nuclear translocation of PPAR? in cells. The present invention also relates to a pharmaceutical composition comprising the PPAR? modulator of the invention encapsulated in a pharmaceutically acceptable cell-penetrating drug delivery system so that it can be directly delivered into cells. The present invention thus provides a method of preventing or treating PPAR?-related disorders or conditions comprising administering to a subject in need thereof a therapeutically effective amount of the PPAR? modulator of the invention or the pharmaceutical composition of the invention.Type: GrantFiled: January 27, 2016Date of Patent: December 31, 2024Assignee: REALINN LIFE SCIENCE LIMITEDInventors: Jen Cheng Lin, Chun-Chieh Lin, Hsu-Tung Lee, Yu-Ming Fan, Jui-Chi Tsai, Ying-Chi Du
-
Publication number: 20240427018Abstract: Systems and techniques are described herein for determining changes in distance. For instance, an apparatus for determining changes in distance is provided. The apparatus may include an electromagnetic (EM)-radiation emitter configured to emit EM radiation toward an environment; a detector configured to receive reflected EM radiation from the environment; phase-calculation circuitry configured to calculate a phase-difference value indicative of a difference between a phase of the emitted EM radiation and a phase of the reflected EM radiation; and differencing circuitry configured to trigger an event responsive to a difference between a current phase-difference value and a prior phase-difference value exceeding a threshold.Type: ApplicationFiled: June 23, 2023Publication date: December 26, 2024Inventors: Meng-Lin WU, Shusil DANGI, Kai HE, Chung-Chi TSAI
-
Patent number: 12172262Abstract: Systems and methods are provided for predicting irregular motions of one or more mechanical components of a semiconductor processing apparatus. A mechanical motion irregular prediction system includes one or more motion sensors that sense motion-related parameters associated with at least one mechanical component of a semiconductor processing apparatus. The one or more motion sensors output sensing signals based on the sensed motion-related parameters. Defect prediction circuitry predicts an irregular motion of the at least one mechanical component based on the sensing signals.Type: GrantFiled: June 21, 2023Date of Patent: December 24, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chunhung Chen, Yu Chi Tsai, Chin Wei Chuang, Bo-An Chen, Sheng-Chen Wang, Chen-Hua Tsai
-
Patent number: D1060470Type: GrantFiled: March 21, 2024Date of Patent: February 4, 2025Assignee: Amazon Technologies, Inc.Inventors: Wen-Yo Lu, Yen-Chi Tsai, James Siminoff, Mikhail Donskoi, Matthew J. England, Oleksii Krasnoshchok, Christopher Loew, Oleksii Shekolian, Maksym Yemelin
-
Patent number: D1068902Type: GrantFiled: December 22, 2022Date of Patent: April 1, 2025Assignee: AMAZON TECHNOLOGIES, INC.Inventors: Wen-Yo Lu, Oleksii Shekolian, Matthew J. England, James Siminoff, Yen-Chi Tsai