Abstract: A device includes a pair of gate spacers on a substrate, and a gate structure on the substrate and between the gate spacers. The gate structure includes an interfacial layer, a metal oxide layer, a nitride-containing layer, a tungsten-containing layer, and a metal compound layer. The interfacial layer is over the substrate. The metal oxide layer is over the interfacial layer. The nitride-containing layer is over the metal oxide layer. The tungsten-containing layer is over the nitride-containing layer. The metal compound layer is over the tungsten-containing layer. The metal compound layer has a different material than a material of the tungsten-containing layer.

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the first surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

Abstract: A MEMS microphone includes a substrate. A dielectric layer is disposed on the substrate, having an opening and includes: indent region surrounding the opening; pillars extending from an indent surface at the indent region to the substrate; and an outer part surrounding the indent region and disposed on the substrate. A signal sensing space is created at the indent region between the pillars and between the pillars and the outer part. A first electrode layer is disposed on the indent surface of the dielectric layer. A second electrode layer is disposed on the substrate. A sensing diaphragm is held by the dielectric layer, including two elastic diaphragms supported by the dielectric layer; and a conductive plate between the first elastic diaphragm and the second elastic diaphragm. The conductive plate has a central part embedded in the holding structure and a peripheral part extending into the signal sensing space.

Abstract: The present disclosure provides a method for inhibiting proliferation and metastasis of cancer cells by using a naphthoquinone derivative.

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed from the first package body.

Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.

Abstract: A structure of micro-electro-mechanical-system (MEMS) microphone package includes a packaging substrate and an integrated circuit disposed on the packaging substrate. In addition, a MEMS microphone is disposed on the packaging substrate, wherein the MEMS microphone is electrically connected to the integrated circuit. A conductive adhesion layer is disposed on the packaging substrate, surrounding the integrated circuit and the MEMS microphone. A cap structure has a bottom part being adhered to the conductive adhesion layer. An underfill layer is disposed on the packaging substrate, covering an outer side of the conductive adhesion layer.

Abstract: System and method for EMI shielding for a CD-SEM are described. One embodiment is a scanning electron microscope (“SEM”) comprising an electron gun for producing an electron beam directed toward a sample; a secondary electron (“SE”) detector for detecting secondary electrons reflected from the sample in response to the electron beam; and a dual-layer shield disposed around and enclosing the SE detector. The shield comprises a magnetic shielding lamina layer and a metallic foil layer.

Abstract: An acoustic micro-device testing apparatus including an acoustic device, at least one device under test (DUT), and a bearing plate is disclosed. The acoustic device provides a testing acoustic source to a first side of the DUT through the main channel and to a second side of the DUT through the side channel. The bearing plate has a first surface and a second surface. The first surface has a chamber sunken into the bearing plate. The second surface has a bearing space sunken into the bearing plate and bearing the DUT. The bearing plate has a main channel connecting the chamber and the DUT and at least one side channel connecting the chamber and the bearing space directly or through the main channel. A cover unit covers the bearing plate so that the bearing space and the chamber form a confined space. The DUT is in the confined space.

Abstract: System and method for EMI shielding for a CD-SEM are described. One embodiment is a scanning electron microscope (“SEM”) comprising an electron gun for producing an electron beam directed toward a sample; a secondary electron (“SE”) detector for detecting secondary electrons reflected from the sample in response to the electron beam; and a dual-layer shield disposed around and enclosing the SE detector. The shield comprises a magnetic shielding lamina layer and a metallic foil layer.

Abstract: System and method for EMI shielding for a CD-SEM are described. One embodiment is a scanning electron microscope (“SEM”) comprising an electron gun for producing an electron beam directed toward a sample; a secondary electron (“SE”) detector for detecting secondary electrons reflected from the sample in response to the electron beam; and a dual-layer shield disposed around and enclosing the SE detector. The shield comprises a magnetic shielding lamina layer and a metallic foil layer.

Abstract: A MEMS structure includes a substrate, a structural dielectric layer, and a diaphragm. A structural dielectric layer is disposed over the substrate. The diaphragm is held by the structural dielectric layer at a peripheral end. The diaphragm includes multiple trench/ridge rings at a peripheral region surrounding a central region of the diaphragm. A corrugated structure is located at the central region of the diaphragm, surrounded by the trench/indent rings.

Abstract: System and method for EMI shielding for a CD-SEM are described. One embodiment is a scanning electron microscope (“SEM”) comprising an electron gun for producing an electron beam directed toward a sample; a secondary electron (“SE”) detector for detecting secondary electrons reflected from the sample in response to the electron beam; and a dual-layer shield disposed around and enclosing the SE detector. The shield comprises a magnetic shielding lamina layer and a metallic foil layer.

Abstract: A method of manufacturing a self-aligned stylus with high sphericity includes the steps of: forming a polymeric layer on a substrate; placing a sphere on the polymeric layer; softening the polymeric layer to make a portion of the sphere sink into the polymeric layer; forming a specific light absorbing layer on the polymeric layer; illuminating the sphere and the specific light absorbing layer with specific light such that the specific light is focused by the sphere to expose the polymeric layer to form an exposed portion and an unexposed portion; removing the specific light absorbing layer; and baking the polymeric layer and then removing the unexposed portion. A self-aligned stylus with high sphericity is also disclosed.

Abstract: A method and system for aligning robotic wafer transfer systems provides a wafer cassette having one or more wafer slots having portions covered with an electrically conductive material and a sensor that is in electrical communication with the electrically conductive material. When a wafer is loaded into a wafer cassette such as may be contained within a wafer transfer module such as a FOUP, an indication of position is delivered to the sensor which detects the alignment and indicates if the loaded wafer undesirably contacts either or both of the opposed grooves that form the wafer slot of the wafer cassette. An indication of the wafer's position may be provided from the sensor to a controller that delivers a signal for aligning the wafer transfer blade of the wafer transfer robot responsive to the signal indicative of position.

Abstract: An apparatus with a dynamic interface protocol and a method for a dynamic interface protocol are provided. The apparatus is capable of consolidating multiple interface protocols to a single output terminal to reduce the number of output pins and the complexity and the cost of the apparatus. The apparatus is characterized by providing an output via the output terminal of the apparatus in accordance with a data protocol in a data mode, and providing the output via the output terminal in accordance with a video protocol in a video mode.

Abstract: The present invention provides an adjustable hinged door closer, including a seat with the first and second cylinders, and a first and a second elastic linkage unit. A double-threaded regulator is incorporated onto the first connecting rod of the first elastic linkage unit, so as to change the compression of the spring and regulate the closing/restoring force of the door body. The double-threaded column of the double-threaded regulator has a double-thread that shifts to two thread pitches by just making one rotation, thus facilitating the fine-tuning easily. The elastic linkage unit and the regulator are structurally configured to be assembled externally, and then mated with the connecting seat of the door closer.