Patents by Inventor An-Chi Yeh

An-Chi Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ANTIBACTERIAL NANO-SILVER CONTAINED POLYMER ABSORBENT AND SANTITARY ARTICLES THEREOF
    Publication number: 20090247973
    Abstract: An antibacterial nano-silver contained polymer absorbent and sanitary articles thereof includes a polymer absorbent and an antibacterial material coated thereon that has a plurality of supporting elements adsorbed nano-silver. The antibacterial nano-silver contained polymer absorbent is adopted on sanitary articles to be in contact with secretion generating portions of users to directly absorb secretions of user's body or prevent microbe-contained external air from entering the user's body to provide disinfecting effect and a healthy condition for the user.
    Type: Application
    Filed: March 27, 2008
    Publication date: October 1, 2009
    Applicant: LIN HORN TECHNOLOGY CO., LTD.
    Inventors: An-Chi Yeh, Deng-Nan Horng, Chia-Feng Liang, Kuo-Hui Wu, Fu-Chu Yang
  • Epoxy/clay nanocomposite for making printed circuit boards
    Patent number: 6548159
    Abstract: An epoxy/clay nanocomposite suitable for use as matrix material for printed circuit boards is disclosed. The nanocomposite of the present invention comprises a layered clay material uniformly dispersed in an epoxy polymer matrix, wherein the clay material has been modified to an organoclay by ion exchange with (1) benzalkonium chloride and (2) dicyandiamide or tetraethylenepentamine. The epoxy/clay nanocomposites of the present invention have superior dimensional and thermal stability, and a lower hygroscopic property. The invention also includes the prepregs or circuit boards containing the epoxy/clay nanocomposite.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: April 15, 2003
    Assignees: Industrial Technology Research Institute, Nan Ya Plastics Corporation
    Inventors: Tsung-Yen Tsai, Sung-Jeng Jong, An-Chi Yeh, Joshua Chiang, Bor-Ren Fang
  • Epoxy/clay nanocomposite for making printed circuit boards
    Publication number: 20030039812
    Abstract: An epoxy/clay nanocomposite suitable for use as matrix material for printed circuit boards is disclosed. The nanocomposite of the present invention comprises a layered clay material uniformly dispersed in an epoxy polymer matrix, wherein the clay material has been modified to an organoclay by ion exchange with (1) benzalkonium chloride and (2) dicyandiamide or tetraethylenepentamine. The epoxy/clay nanocomposites of the present invention have superior dimensional and thermal stability, and a lower hygroscopic property. The invention also includes the prepregs or circuit boards containing the epoxy/clay nanocomposite.
    Type: Application
    Filed: November 13, 2001
    Publication date: February 27, 2003
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, NAN YA PLASTICS CORPORATION
    Inventors: Tsung-Yen Tsai, Sung-Jeng Jong, An-Chi Yeh, Joshua Chiang, Bor-Ren Fang