Patents by Inventor An-Chi Yeh

An-Chi Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8905765
    Abstract: An electrical connector for use with an electronic package, includes a base having two posts. A plurality of contacts is received in the base. A carrier defines a center opening to receive the electronic package and two holes corresponding to the posts. The holes of the carrier cooperate with the posts of the base to guide the carrier loading the electronic package mount to the base.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Cheng-Chi Yeh
  • Publication number: 20140355938
    Abstract: A retention module (100) for positioning conversion module (8) and a pair of fiber assemblies (7) matched with the conversion module (8) to transfer light signals, the conversion module (100) includes a plurality of pads (81) for contacting with an electrical connector (5) assembled on a substrate (80), the retention module (100) includes a seat (1) with a supporting portion (12) and a head portion (11), the supporting portion (12) includes a bottom wall (121) and a pair of sidewalls (120) to form a window (1203) for receiving the conversion module (8), the head portion (11) includes a top surface (110) higher than the bottom wall (121), a bottom surface (111) and a pair of recesses (1110) recessed from the bottom surface (111) for receiving the pair of fiber assemblies (7).
    Type: Application
    Filed: January 24, 2014
    Publication date: December 4, 2014
    Applicant: Hon Hai Precision Industry Co., Ltd.
    Inventor: CHENG-CHI YEH
  • Patent number: 8894422
    Abstract: An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.
    Type: Grant
    Filed: October 12, 2011
    Date of Patent: November 25, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Nan-Hung Lin, Andrew Cheng, Chih-Pi Cheng, Shuo-Hsiu Hsu, Ting-Yao Hung
  • Publication number: 20140342611
    Abstract: An electrical connector for electrically connecting an IC package to a substrate, includes an insulating housing (21), a stiffener (20) located on one side of the insulating housing (21) and a load plate (22) assembled to the stiffener (20) and being rotated between an opened position and a closed position, the stiffener (20) includes a first end (203) and an extending portion (208) extending upwardly and then horizontally in a direction far away from the insulating housing (21) from the first end (203), the extending portion (208) includes a receiving hole (209), the load plate (22) includes a body portion (220) and a hook (223) extending from on end of the body portion (220), the hook (223) is assembled to the receiving hole (209) and interlocks with the extending portion (208) to position the load plate (22) on the stiffener (20).
    Type: Application
    Filed: May 15, 2014
    Publication date: November 20, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-CHI YEH, CHIH-KAI YANG
  • Publication number: 20140339575
    Abstract: A circuit substrate includes a substrate, a first lead line, a second lead line, an insulating layer and a pad. The substrate has a pad region, a first non-pad region and a second non-pad region. The first lead line extends from the first non-pad region to the pad region. The second lead line extends from the second non-pad region to the pad region. The insulating layer is interposed between the first and second lead lines. The pads are on the pad region of the substrate and one of the pads is electrically connected to the first and second lead lines. A display panel including the circuit substrate is also provided.
    Type: Application
    Filed: February 18, 2014
    Publication date: November 20, 2014
    Applicant: AU Optronics Corporation
    Inventors: Ting-Wei CHUNG, Tsai-Chi YEH, Kuan-Ting CHEN, Ming-Huei LIN, Pei-Chi HSU
  • Patent number: 8888525
    Abstract: A contact includes a base portion having an upper end and a lower end opposite to the upper end, a first spring arm extending obliquely and upwardly from the upper end of the base portion, and a second spring arm extending obliquely and upwardly from the lower end of the base portion and towards the first spring arm, wherein the second spring arm locates under the first spring arm, a supporting portion is defined on a distal end of the second spring arm and slides along the first spring arm to support the first spring arm when the first spring arm is pressed down by an electronic component.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: November 18, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Ke-Hao Chen
  • Publication number: 20140327856
    Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding will extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.
    Type: Application
    Filed: July 17, 2014
    Publication date: November 6, 2014
    Inventors: Ching-Fu Hsu, Tzu-Wei Lin, Lien-Te Kao, Chi-Yeh Lu, Ming-Hung Pan, Ming-Chen Lin, Min-Wei Lin, Ting-Feng Chen, Wan-Bing Xia, Kai-Cheng Yen, Meng Zhang
  • Publication number: 20140329404
    Abstract: A holding device for an electrical connector, includes a frame with an opening defined on a center thereof A first locking portion is disposed on the frame and extends into the opening. A second locking portion has a main body with an elastic arm. The main body defines a fixed end fixed to the frame and an active end rotating around the fixed end.
    Type: Application
    Filed: January 22, 2014
    Publication date: November 6, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-CHI YEH, CHIH-KAI YANG
  • Publication number: 20140328037
    Abstract: A carrier assembly (100) comprises an IC package (200) and a carrier (300) for positioning the IC package (200), the IC package (200) includes a body portion (22), a die portion (21) extending upwardly from the body portion (22) and a ear portion (232) extending from the die portion (21), the ear portion (232) and the body portion (22) defines a space (231), the carrier (300) includes a first side (310), a second side (312) opposite to the first side (310), a position portion (343) extending from the first side (310) and a fixing portion (331) extending from the second side (312) positioned in the space (231) of the IC package (200) to position the IC package (200) on the carrier (300).
    Type: Application
    Filed: January 22, 2014
    Publication date: November 6, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHENG-CHI YEH, CHIH-KAI YANG
  • Patent number: 8869417
    Abstract: The embodiments of the present invention provide a wide variety of integrated and compact templates of the parallel lines and multi-radius curves drawing for cloth stitching. The integrated templates provide the convenience for the drawing of those parallel curves, lines, and angles focused on the same central point. The integrated templates can be designed with a wide variety of shapes consisting of many sub-shapes with different distances from the central point or the common reference point, and be manufactured by the injection molded transparent plastic in the compact and solid one-body format without any mechanical connection.
    Type: Grant
    Filed: September 20, 2012
    Date of Patent: October 28, 2014
    Inventor: Fang Chi Yeh
  • Publication number: 20140295655
    Abstract: A semiconductor device and method for forming the same provide a through silicon via (TSV) surrounded by a dielectric liner. The TSV and dielectric liner are surrounded by a well region formed by thermal diffusion. The well region includes a dopant impurity type opposite the dopant impurity type of the substrate. The well region may be a double-diffused well with an inner portion formed of a first material and with a first concentration and an outer portion formed of a second material with a second concentration. The surrounding well region serves as an isolation well, reducing parasitic capacitance.
    Type: Application
    Filed: June 10, 2014
    Publication date: October 2, 2014
    Inventor: Chi-Yeh YU
  • Patent number: 8834191
    Abstract: An electrical connector for electrically connecting an IC package to a circuit board includes an insulating housing having a number of contacts received therein, a load plate covering the insulating housing and rotating between an open position and a closed position and a holder assembled on the load plate for retaining the IC package. The holder is sandwiched between the insulating housing and the load plate and capable of loading the IC package to the insulating housing when the load plate is rotated to a close position.
    Type: Grant
    Filed: September 26, 2012
    Date of Patent: September 16, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Fang-Jwu Liao
  • Patent number: 8786799
    Abstract: A liquid crystal display device includes a support frame having a bottom wall, and a main surrounding wall extending upwardly from and formed integrally as one piece with the bottom wall. The bottom wall and the surrounding wall cooperatively define a receiving space. The bottom wall includes a first support disposed in the receiving space. The main surrounding wall includes a second support disposed in the receiving space and spacedly above the first support. A backlight module is supported on the first support. A liquid crystal display panel is supported on the second support so that the liquid crystal display panel is positioned above the backlight module.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: July 22, 2014
    Assignee: Wistron Corporation
    Inventors: Ching-Fu Hsu, Tzu-Wei Lin, Lien-Te Kao, Chi-Yeh Lu, Ming-Hung Pan, Ming-Chen Lin, Min-Wei Lin, Ting-Feng Chen, Wan-Bing Xia, Kai-Cheng Yen, Meng Zhang
  • Patent number: 8781045
    Abstract: A communication apparatus having a first and second wireless communications modules is provided. The first wireless communications module includes a receiving unit receiving RF signals from an air interface, a signal processing module performing frequency down conversion on the RF signals to generate baseband signals according to a clock signal, and a processor processing the baseband signals. The processor further detects an ON/OFF status of the second wireless communications module to obtain a detection result and compensates for frequency drift of the clock signal according to the detection result.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: July 15, 2014
    Assignee: Mediatek Inc.
    Inventor: Chi-Yeh Lo
  • Patent number: 8766409
    Abstract: A semiconductor device and method for forming the same provide a through silicon via (TSV) surrounded by a dielectric liner. The TSV and dielectric liner are surrounded by a well region formed by thermal diffusion. The well region includes a dopant impurity type opposite the dopant impurity type of the substrate. The well region may be a double-diffused well with an inner portion formed of a first material and with a first concentration and an outer portion formed of a second material with a second concentration. The surrounding well region serves as an isolation well, reducing parasitic capacitance.
    Type: Grant
    Filed: June 24, 2011
    Date of Patent: July 1, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Chi-Yeh Yu
  • Patent number: 8740447
    Abstract: In a flat panel display having integral frame structure, features of a metal frame and a plastic support, which support, position, and fix each component, are incorporated as an integral frame structure, such that no additional structure component is needed for the flat panel display to assemble the backlight module and the panel module. The frame structure is assembled to the bottom cover via screw that can reduce defectiveness of repetitive processing. A concave section at the bottom of the frame structure can contain a control circuit board for the panel cell such that the control circuit board can be rerouted downward to the bottom of the frame structure. The space required at the light source side of the flat panel display can be reduced, hence leading to the flat panel display with thin frame at the light source side.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: June 3, 2014
    Assignee: Wistron Corporation
    Inventors: Lien-Te Kao, Chi-Yeh Lu, Ming-Hong Pan, Ting-Feng Chen, Ching-Fu Hsu, Tzu-Wei Lin
  • Publication number: 20140134880
    Abstract: An electrical connector for use with an electronic package, includes a base having two posts. A plurality of contacts is received in the base. A carrier defines a center opening to receive the electronic package and two holes corresponding to the posts. The holes of the carrier cooperate with the posts of the base to guide the carrier loading the electronic package mount to the base.
    Type: Application
    Filed: March 18, 2013
    Publication date: May 15, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: CHENG-CHI YEH
  • Publication number: 20140105321
    Abstract: The present invention relates to a transmission interface device capable of calibrating the transmission frequency automatically, which comprises a clock generating unit, a data transmission unit, and a control unit. The clock generating unit is used for generating an operating clock, which determines a transmission frequency. The data transmission unit is used for connecting to a host and transmitting a plurality of data to the host or receiving the plurality of data from the host according to the operating clock. When the host or the data transmission unit detects transmission errors in the plurality of data, the host or the data transmission unit generates an error handling. The control unit generates an adjusting signal according to the error handling and transmits the adjusting signal to the clock generating unit for adjusting the transmission frequency of the operating clock.
    Type: Application
    Filed: September 25, 2013
    Publication date: April 17, 2014
    Applicant: SITRONIX TECHNOLOGY CORP.
    Inventors: SHENG-HSUN LIN, CHENG-CHUNG YEH, CHUN-CHI YEH, CHIH-TE HUNG, WEI-CHIA SU
  • Patent number: D719099
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Ting-Yao Hung, Albert Harvey Terhune, IV
  • Patent number: D719100
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: December 9, 2014
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Cheng-Chi Yeh, Ting-Yao Hung, Albert Harvey Terhune, IV