Patents by Inventor AN-CHOU CHEN
AN-CHOU CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240134625Abstract: The present disclosure relates to utilizing a firmware configuration system to efficiently update a firmware profile configuration of computing devices (e.g., host devices in a datacenter). For example, the firmware configuration system facilitates updating the firmware profile configuration, such as for a Unified Extensible Firmware Interface (UEFI) profile and/or a Basic Input/Output System (BIOS), without needing to develop, deploy, and install a new BIOS. More specifically, the firmware configuration system updates (e.g., via a baseband management controller) firmware profile configurations by modifying a profile configuration table in flash memory (i.e., on an SPI flash-based chip) of a BIOS with a firmware profile configuration update patch and without affecting other parts of the BIOS.Type: ApplicationFiled: October 20, 2022Publication date: April 25, 2024Inventors: Daini XIE, Wen-Ho CHEN, Yuwen CHOU
-
Patent number: 11953942Abstract: A foldable electronic device having multiple screens is provided. The foldable electronic device includes a first screen, a worm rod, a moving member, at least one second screen, and at least one linking rod. The worm rod is rotatably disposed on the first screen. The moving member is coupled to the worm rod to move along the worm rod when the worm rod rotates. The second screen is movably disposed on the first screen. The linking rod is pivotally connected between the moving member and the second screen. When the moving part moves along the worm rod, the second screen is driven to move away from or closed to the worm rod by the linking rod, so that the second screen moves out of the first screen or is accommodated behind the first screen.Type: GrantFiled: February 18, 2021Date of Patent: April 9, 2024Assignee: Acer IncorporatedInventors: Hui-Ping Sun, Yen-Chou Chueh, Chun-Hung Wen, Chun-Hsien Chen
-
Publication number: 20240113187Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.Type: ApplicationFiled: January 5, 2023Publication date: April 4, 2024Inventors: Jhu-Min Song, Ying-Chou Chen, Yi-Kai Ciou, Chien-Chih Chou, Fei-Yun Chen, Yu-Chang Jong, Chi-Te Lin
-
Publication number: 20240111330Abstract: A foldable electronic device is provided, including a first body, a second body, a supporting member, a first hinge connecting the first body and the supporting member, a second hinge connecting the supporting member and the second body, and a gravity-type latch movably disposed in the supporting member. The first body and the supporting member are rotated relatively to be folded or unfolded via the first hinge, and the second body and the supporting member are rotated relatively to be folded or unfolded via the second hinge. In a transforming process of the first body folding to the supporting member and together unfolding relative to the second body, the gravity-type latch is latched onto the first body once the unfolding angle is less than a predetermined value, and the gravity-type latch is de-latched from the first body once the unfolding angle is equal to or greater than the predetermined value.Type: ApplicationFiled: May 4, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Jui-Yi Yu, Chun-Hsien Chen, Hui-Ping Sun, Chun-Hung Wen, Yen-Chou Chueh
-
Publication number: 20240111339Abstract: A cabling structure of a foldable electronic device includes a first body, a second body, a hinge module connecting the first body and the second body, a sliding member movably disposed in the second body, a flexible electrical connecting member connected to the first body, the second body, and the sliding member and being driven when the first body and the second body are rotated relatively, and a restoring module disposed in the second body and providing a force to the sliding member. The first body and the second body are rotated relatively to each other through the hinge module. When being rotated relatively to each other, the first body and the second body drive the flexible electrical connecting member and the sliding member. The restoring module restores the sliding member and the flexible electrical connecting member via the force.Type: ApplicationFiled: May 8, 2023Publication date: April 4, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen
-
Patent number: 11944970Abstract: A microfluidic detection unit comprises at least one fluid injection section, a fluid storage section and a detection section. Each fluid injection section defines a fluid outlet; the fluid storage section is in gas communication with the atmosphere and defines a fluid inlet; the detection section defines a first end in communication with the fluid outlet and a second end in communication with the fluid inlet. A height difference is defined between the fluid outlet and the fluid inlet along the direction of gravity. When a first fluid is injected from the at least one fluid injection section, the first fluid is driven by gravity to pass through the detection section and accumulate to form a droplet at the fluid inlet, such that a state of fluid pressure equilibrium of the first fluid is established.Type: GrantFiled: June 10, 2019Date of Patent: April 2, 2024Assignees: INSTANT NANOBIOSENSORS, INC., INSTANT NANOBIOSENSORS CO., LTD.Inventors: Yu-Chung Huang, Yi-Li Sun, Ting-Chou Chang, Jhy-Wen Wu, Nan-Kuang Yao, Lai-Kwan Chau, Shau-Chun Wang, Ying Ting Chen
-
Publication number: 20240105619Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.Type: ApplicationFiled: November 29, 2023Publication date: March 28, 2024Inventors: Fong-Yuan Chang, Noor Mohamed Ettuveettil, Po-Hsiang Huang, Sen-Bor Jan, Ming-Fa Chen, Chin-Chou Liu, Yi-Kan Cheng
-
Patent number: 11938105Abstract: In one aspect, the disclosure relates to methods and compositions for treatment of cancer cachexia. In a further aspect, the composition is a pharmaceutical composition comprising a class I/IIB HDAC inhibitor and an androgen. In a still further aspect, the method of treatment comprises administering a class I/IIB HDAC inhibitor and an androgen to a subject or patient who has been diagnosed as having cancer cachexia. In some aspects, the class I/IIB HDAC inhibitor is a compound known as AR-42.Type: GrantFiled: December 19, 2022Date of Patent: March 26, 2024Assignee: Ohio State Innovation FoundationInventors: Ching-Shih Chen, Christopher C. Coss, Samuel Kulp, Yu-Chou Tseng, Tanios Bekaii-Saab
-
Patent number: 11942543Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.Type: GrantFiled: June 29, 2022Date of Patent: March 26, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin, Wen-Chih Chiang, Chen-Chien Chang, Chih-Yuan Chan, Kuo-Ming Wu, Chun-Lin Tsai
-
Publication number: 20240098932Abstract: A foldable electronic device, including a first body, a second body, an air valve movably disposed in the first body, at least one triggering member, and a hinge connecting the first body and the second body, is provided. The first body has multiple openings respectively located at two opposite surfaces. The triggering member is movably disposed in the first body and has a part exposed outside the first body. The air valve and the triggering member are mutually on moving paths of each other. The first body and the second body are rotated to be folded or unfolded relative to each other by the hinge. A part of the triggering member is suitable for bearing a force such that the triggering member drives the air valve, so that the air valve opens or closes the openings.Type: ApplicationFiled: July 19, 2023Publication date: March 21, 2024Applicant: Acer IncorporatedInventors: Hui-Ping Sun, Jui-Yi Yu, Chun-Hung Wen, Yen-Chou Chueh, Yu-Ming Lin, Chun-Hsien Chen
-
Patent number: 11934223Abstract: A foldable electronic device, including a first body having a first shaft member, at least one second body having a second shaft member, and a latching member, is provided. The first shaft member and the second shaft member are coaxially pivoted together. The first shaft member has a recess. The second shaft member has a locking hole. The latching member is movably disposed in the recess and the locking hole, so that when the latching member leaves the locking hole, the first body and the second body are relatively pivoted through the first shaft member and the second shaft member, or when the latching member moves into the locking hole, the latching member interferes with the first shaft member and the second shaft member to block the first body and the second body from relatively pivoting.Type: GrantFiled: May 30, 2022Date of Patent: March 19, 2024Assignee: Acer IncorporatedInventors: Hui-Ping Sun, Chun-Hung Wen, Yen-Chou Chueh, Chun-Hsien Chen
-
Patent number: 11935894Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.Type: GrantFiled: November 4, 2022Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Fong-yuan Chang, Chun-Chen Chen, Po-Hsiang Huang, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao, Sheng-Hsiung Chen, Chin-Chou Liu
-
Publication number: 20240086590Abstract: An adaptive grid generating method includes obtaining a first three-dimensional grid of a target structure; importing the first three-dimensional grid into a computer-aided engineering software to obtain a first two-dimensional planar grid; importing the first two-dimensional planar grid into a grid cleaning software to obtain a second two-dimensional planar grid; and importing the second two-dimensional planar grid into the computer-aided engineering software to obtain a second three-dimensional grid.Type: ApplicationFiled: June 12, 2023Publication date: March 14, 2024Applicants: Inventec (Pudong) Technology Corp., Inventec CorporationInventors: Hsueh-Liang Chen, Chen-Chou Huang, I-Chang Wang, Tzung-Shian Hung
-
Patent number: 11927793Abstract: A double-sided display device includes a first panel, a second panel, a light guide plate and a light source. The second panel is arranged opposite to the first panel. The light guide plate is arranged between the first panel and the second panel, and includes a main body portion including a first surface and a second surface, a first pattern arranged on the first surface, and a second pattern arranged on the second surface. The light source is arranged adjacent to the light guide plate. The first pattern is different from the second pattern.Type: GrantFiled: February 28, 2023Date of Patent: March 12, 2024Assignee: INNOLUX CORPORATIONInventors: Yi-Hui Lee, Kuan-Chou Chen, Yung-Chih Cheng
-
Patent number: 11929767Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.Type: GrantFiled: August 16, 2022Date of Patent: March 12, 2024Assignee: MEDIATEK INC.Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
-
Patent number: 11927806Abstract: Disclosed is a system and method for communication using an efficient fiber-to-chip grating coupler with a high coupling efficiency.Type: GrantFiled: May 5, 2021Date of Patent: March 12, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Feng-Wei Kuo, Lan-Chou Cho, Huan-Neng Chen, Chewn-Pu Jou
-
Publication number: 20240074513Abstract: There is provided an aerosol provision device including at least one inlet through which air can enter the device; an outlet through which aerosol within the device can pass; at least one aerosol generating region arranged to generate an aerosol; at least one flow channel arranged to provide fluid communication between at least one inlet, the outlet and at least one aerosol generating region; a moveable component arranged to move between a number of predetermined positions including at least a first and a second position, wherein in the first position the moveable component at least partially blocks at least one flow channel and wherein in the second position the moveable component does not block airflow through at least one flow channel.Type: ApplicationFiled: September 6, 2022Publication date: March 7, 2024Inventors: Jared Aller, Matthew Hodgson, Ping Chou Chen
-
Patent number: D1023247Type: GrantFiled: June 1, 2021Date of Patent: April 16, 2024Assignee: BOTRISTA TECHNOLOGY, INC.Inventors: Jia-Hui Chen, Wu-Chou Kuo
-
Patent number: D1023248Type: GrantFiled: February 3, 2023Date of Patent: April 16, 2024Assignee: BOTRISTA TECHNOLOGY, INC.Inventors: Jia-Hui Chen, Wu-Chou Kuo
-
Patent number: D1023249Type: GrantFiled: February 3, 2023Date of Patent: April 16, 2024Assignee: BOTRISTA TECHNOLOGY, INC.Inventors: Jia-Hui Chen, Wu-Chou Kuo