Abstract: A titanium precursor is used to selectively form a titanium silicide (TiSix) layer in a semiconductor device. A plasma-based deposition operation is performed in which the titanium precursor is provided into an opening, and a reactant gas and a plasma are used to cause silicon to diffuse to a top surface of a transistor structure. The diffusion of silicon results in the formation of a silicon-rich surface of the transistor structure, which increases the selectivity of the titanium silicide formation relative to other materials of the semiconductor device. The titanium precursor reacts with the silicon-rich surface to form the titanium silicide layer. The selective titanium silicide layer formation results in the formation of a titanium silicon nitride (TiSixNy) on the sidewalls in the opening, which enables a conductive structure such as a metal source/drain contact to be formed in the opening without the addition of another barrier layer.

Abstract: Energy storage devices, battery cells, and batteries of the present technology may include a first battery cell. The first battery cell may include an anode current collector, and an anode active material disposed on the anode current collector. The first battery cell may include a cathode current collector and a cathode active material disposed on the cathode current collector. The current collectors may be polymeric materials. The batteries may include a first conductive band electrically coupled with the first battery cell. The first conductive band may be seated on the second surface of one of the anode current collector or the cathode current collector. The first conductive band may extend about a perimeter of the one of the anode current collector or the cathode current collector. The batteries may include a cell module including a first flexible extension electrically coupled with the first conductive band.

Abstract: Embodiments of the present disclosure generally relate to methods and systems for cleaning a surface of a substrate. In an embodiment, a method of processing a substrate is provided. The method includes introducing a substrate to a processing volume of a processing chamber by positioning the substrate on a substrate support. The method further includes flowing a first process gas into the processing volume, the first process gas comprising HF, flowing a second process gas into the processing volume, the second process gas comprising pyridine, pyrrole, aniline, or a combination thereof, and exposing the substrate to the first process gas and the second process gas to remove oxide from the substrate under oxide removal conditions. In another embodiment, a system is provided that includes a processing chamber to process a substrate, and a controller to cause a processing method to be performed in the processing chamber.

Abstract: A communication device associated with a physical access point (AP) receives a physical layer (PHY) data unit having a PHY preamble, which includes a basic service set (BSS) color identifier. The communication device performs a clear channel assessment (CCA) procedure to determine whether the communication device can perform a spatial reuse transmission during reception of the PHY data unit, including: determining whether the BSS color identifier is a color value corresponding to all of multiple virtual APs implemented by the physical AP, and selectively determining whether the communication device can perform the spatial reuse transmission during reception of the PHY data unit as a function of the determination of whether the BSS color identifier is the color value corresponding to all of the multiple virtual APs implemented by the physical AP.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary method comprises forming a first stack structure and a second stack structure in a first area over a substrate, wherein each of the stack structures includes semiconductor layers separated and stacked up; depositing a first interfacial layer around each of the semiconductor layers of the stack structures; depositing a gate dielectric layer around the first interfacial layer; forming a dipole oxide layer around the gate dielectric layer; removing the dipole oxide layer around the gate dielectric layer of the second stack structure; performing an annealing process to form a dipole gate dielectric layer for the first stack structure and a non-dipole gate dielectric layer for the second stack structure; and depositing a first gate electrode around the dipole gate dielectric layer of the first stack structure and the non-dipole gate dielectric layer of the second stack structure.

Abstract: A system receives an authentication request from a requestor system for a token to access one or more computing resources associated with a computing resource service provider. The system analyzes information included with the authentication request and, based on the information included with the authentication request, selects an authentication provider from a plurality of authentication providers without additional input from the requestor system. The requestor system is redirected to the selected authentication provider such that the token is provided in response to the authentication request. The requestor system then presents the token to obtain an identity assertion that can be used to access the one or more computing resources.

Abstract: Implementations of a method of designing a module semiconductor product may include receiving a selection of a module type, one or more die, a placement of one or more wires, clips, or pins; and generating, using a processor, a module configuration file. The method may include generating a module bonding diagram using a build diagram system module; selecting one or more SPICE models corresponding with the die; and generating a product SPICE model and a three dimensional model for the module semiconductor product. The method may include generating one or more datasheet characteristics of the module semiconductor product with at least the product SPICE model and the product simulation module, generating a product datasheet for the module semiconductor product using the datasheet formation module, and providing access to at least the module bonding diagram, the product SPICE model, the three dimensional model, and the product datasheet to the user.

Abstract: Disclosed are a display module and a display device. The display module includes a rear shell and an intermediate frame, and a display screen, an ultra-thin protective cover plate, and a protective film. The rear shell has a back plate and a first folded edge bent and extending from the edge of the back plate to the side of the display screen. The intermediate frame is located in a region enclosed by the back plate and the first folded edge. The ultra-thin protective cover plate has a first surface away from the side of the display screen, and a side surface located on the edge. The protective film includes a first part attached to the first surface of the ultra-thin protective cover plate, and a second part coating the side surface of the ultra-thin protective cover plate.

Abstract: One example discloses a wireless Access Point (AP) device, configured to operate within a wireless local area network (WLAN), including: a controller configured to generate a reserve slot time trigger frame and a request to transmit trigger frame; wherein the controller is configured to be coupled to an antenna; wherein the antenna is configured to transmit the trigger frames over a physical media to a set of user station devices (STAs) and exchange traffic with the set of STAs over the physical media; wherein the reserve slot time trigger frame is configured to reserve a slot time on the physical media; and wherein the request to transmit trigger frame is configured to command a first STA from the set of STAs to transmit data buffered in the first STA to the AP device.

Abstract: In an embodiment, a method includes forming a first fin and a second fin within an insulation material over a substrate, the first fin and the second fin includes different materials, the insulation material being interposed between the first fin and the second fin, the first fin having a first width and the second fin having a second width; forming a first capping layer over the first fin; and forming a second capping layer over the second fin, the first capping layer having a first thickness, the second capping layer having a second thickness different from the first thickness.

Abstract: A flexible organic light-emitting diode (OLED) substrate includes a flexible substrate, an inorganic barrier layer, an OLED device, and an adhesive-filling layer. The inorganic barrier layer is disposed on the flexible substrate. The OLED device is disposed on the inorganic barrier layer. The adhesive-filling layer covers the OLED device and the inorganic barrier layer. The flexible substrate further comprises a base substrate, a bending portion, and a covering portion. A thin film transistor layer is disposed on the base substrate, and the bending portion is connected to the base substrate and the covering portion. The covering portion covers the adhesive-filling layer and is stacked above the base substrate.

Abstract: The present application provides an antibody, such as a monoclonal antibody (mAb), or an antigen binding fragment thereof, that specifically recognizes PD-L1. Also provided are pharmaceutical compositions, or methods of making and using the antibody or antigen binding fragment thereof.

Abstract: A package for a computer peripheral device includes a box having a bottom surface and sidewalls that define a cavity. A peripheral insert is positionable within the cavity. The insert includes a back portion coupled with a rear sidewall of the box. A base portion extends at an angle from a bottom edge of the back surface. A rear section and a front section of the base portion are pivotally coupled. The back portion and rear section define a tab. The insert is movable between stowed and access configurations by applying a force on the tab. In the stowed configuration, the base portion is seated against the bottom surface and the back portion is substantially parallel to the rear sidewall. In the access configuration, the rear and front sections are tented and the back portion of the insert is pulled away from and angled relative to the rear sidewall.

Abstract: An electronic device is provided. The electronic device includes a first part, a second part, a connection part disposed and coupled to the first part and the second part such that the first part and the second part are rotatable, a first antenna module disposed in the first part and includes an antenna array, a second antenna module disposed in the second part and includes an antenna array, a processor disposed in the first part, an IFIC disposed in the first part and electrically connected to the first antenna module and the processor, a second IFIC disposed in the second part and electrically connected to the second antenna module and the processor and an FPCB disposed over the first part, the connection part, and the second part, and is configured to transfer a digital signal or a baseband I/Q signal between the processor and the second IFIC.

Abstract: A method including receiving an indication for a digital alert associated with a specific action for a user account of a user; generating and outputting a first message comprising a web page link; receiving an indication of a request to access the web page link by the user device; responsive to receiving the indication of the request to access the web page link, accessing, based on the indication for a digital alert, user-specific information associated with the user account from the at least one third-party device; and generating, based on the indication for a digital alert and the user-specific information, a customized user interaction-specific web page comprising the user-specific information associated with the user account and at least one user input field.

Abstract: A fastening device is applied for being installed at an article and includes a base, a coupling member and a reel member. The base is located at the article and includes a bottom cover and a rotating plate, the bottom cover includes a bore, and the rotating plate is movably coupled to the bottom cover. The coupling member inserts an installing hole of the article and the bore, the coupling member is coupled to the rotating plate, and the reel member is coupled to a lace and disposed at the base. The rotating plate is rotated to move the coupling member in the bore, thereby narrowing a gap between the base and the article.

Abstract: A medical device may include an introducer sheath, having a distal and a proximal end and a lumen extending from the distal end to the proximal end. The introducer sheath may also include a tab formed at the distal end and extending distal to the lumen, and a frangible portion extending between the distal end and the proximal end.

Abstract: A semiconductor structure includes a wafer circuit structure, at least one first semiconductor die, at least one first supporting structure, and an encapsulant. The at least one first semiconductor die is disposed over and electrically connected to the wafer circuit structure in a device region of the semiconductor structure. The at least one first supporting structure is disposed over the wafer circuit structure in a peripheral region of the semiconductor structure. The encapsulant is disposed over the wafer circuit structure and encapsulates the at least one first semiconductor die and the at least one first supporting structure, where a thickness of the encapsulant at an edge of the semiconductor structure is less than a thickness of the encapsulant within the device region of the semiconductor structure.

Abstract: A wireless charging device includes a casing, a wireless charging module, an air guide and a fan assembly. The casing has an interior space and an opening communicating with the interior space. The wireless charging module is disposed in the interior space. The wireless charging module has a through hole. The air guide is located in the interior space and penetrates through the through hole and the opening. The air guide and an inner surface of the opening are spaced apart from each other so as to form an inlet slot, the air guide has an inlet, a channel and an outlet, and the inlet communicates with the interior space through the channel, the outlet and the inlet slot. The fan assembly is disposed on the casing and drives air to pass through the inlet, the channel, the outlet and the inlet slot and enter into the interior space.