Abstract: An electrochemical machining apparatus for forming turbine blades includes a main base, an upper seat and an electrode unit. The main base includes a working platform for allowing a turbine blade to be placed thereon. The working platform includes an upper step stage for resisting the turbine blade, and a lower step stage for keeping a predetermined working space from a portion of the turbine blade desired to be cut. The main base has a guiding channel for allowing an electrolyte to flow through the predetermined working space. The upper seat is configured to cover above the main base and to contact one side of the turbine blade to form an electrical connection. The electrode unit includes an anode electrode electrically connected to the upper seat and at least one cathode electrode disposed on the main base.

Abstract: An electrochemical machining apparatus with a clamping device and an electrode aligned in the same direction includes a platen, a lower seat, an anode electrode and a cathode electrode. The platen and the lower seat are located relatively for clamping. A working space is formed between the platen and the lower seat for allowing a workpiece to be placed therein. The anode electrode is disposed on the platen and is electrically connected to the workpiece. The cathode electrode is disposed inside the lower seat and is corresponding to the working space. An isolation layer is disposed between the cathode electrode and the lower seat to avoid an electrical connection. A working gap with a constant distance is preserved between the cathode electrode and the workpiece for allowing an electrolyte to flow therethrough and performing electrochemical machining.

Abstract: This disclosure provides, among other things, a composition comprising: comprising a fusion protein comprising: (a) a DNA polymerase; and (b) a heterologous sequence-specific DNA binding domain. A method for copying a DNA template, as well as a kit for performing the same, are also described.

Abstract: This disclosure provides, among other things, a composition comprising: a 5? exonuclease; a strand-displacing polymerase; and optionally a single strand DNA binding protein and/or a ligase. A method for polynucleotide assembly to form a synthon, as well as a kit for performing the same, are also described.

Abstract: A module structure of touch display panel is provided. The module structure comprises a backlight module, a liquid crystal panel, a touch layer, a first circuit board, a second circuit board, and a protection layer. The liquid crystal panel is disposed above the backlight module; the touch layer is disposed on the liquid crystal panel. The first circuit board is disposed on the liquid crystal panel, and is further disposed with a first side of the liquid crystal panel and a first side of the touch layer. The second circuit board is disposed on the liquid crystal panel, and is further disposed with a second side of the liquid crystal panel and a second side of the touch layer. Additionally, the protection layer is disposed above the touch layer, the first circuit board, and the second circuit board.

Abstract: This disclosure provides, among other things, a composition comprising: comprising a fusion protein comprising: (a) a DNA polymerase; and (b) a heterologous sequence-specific DNA binding domain. A method for copying a DNA template, as well as a kit for performing the same, are also described.

Abstract: An electronic device includes a main body, a slot formed on a side of the main body, and a tray unit received in the slot. The tray unit includes a cover, a supporting base, a shaft, and a waterproof member. The supporting base is configured to receive an external card. The shaft pivotally connects the cover with the supporting base, and the supporting base is rotatable with respect to the cover along the shaft. The waterproof member is disposed on the cover. When the tray unit is received in the slot, the waterproof member abuts the main body of the electronic device.

Abstract: A motor deceleration method for a motor driving system is provided. The motor driving system outputs a driving signal containing a voltage value, a current value and a frequency value for driving a motor. When a deceleration of the motor is launched, the descent speeds of the voltage value and the frequency value are controlled according to a preset deceleration time period. Then, a voltage compensation value is generated according to a result of comparing the current value with a preset current level, and the voltage value is increased according to the voltage compensation value, so that the current value is increased to the preset current level. According to a frequency compensation value, the current value is increased to and maintained at the preset current level. Finally, the rotating speed of the motor is gradually decreased to a preset speed.

Abstract: This disclosure provides, among other things, a composition comprising: a 5? exonuclease; a strand-displacing polymerase; and optionally a single strand DNA binding protein and/or a ligase. A method for polynucleotide assembly to form a synthon, as well as a kit for performing the same, are also described.

Abstract: An electronic device includes a main body, a slot formed on a side of the main body, and a tray unit received in the slot. The tray unit includes a cover, a supporting base, a shaft, and a waterproof member. The supporting base is configured to receive an external card. The shaft pivotally connects the cover with the supporting base, and the supporting base is rotatable with respect to the cover along the shaft. The waterproof member is disposed on the cover. When the tray unit is received in the slot, the waterproof member abuts the main body of the electronic device.

Abstract: A module structure of touch display panel is provided. The module structure comprises a backlight module, a liquid crystal panel, a touch layer, a first circuit board, a second circuit board, and a protection layer. The liquid crystal panel is disposed above the backlight module; the touch layer is disposed on the liquid crystal panel. The first circuit board is disposed on the liquid crystal panel, and is further disposed with a first side of the liquid crystal panel and a first side of the touch layer. The second circuit board is disposed on the liquid crystal panel, and is further disposed with a second side of the liquid crystal panel and a second side of the touch layer. Additionally, the protection layer is disposed above the touch layer, the first circuit board, and the second circuit board.

Abstract: A method to produce high electron mobility transistors with Boron implanted isolation comprises the following steps: on a substrate forming in sequence a nucleation layer, a buffer layer, a barrier layer and a cap layer; coating a photoresist layer on the cap layer; photomasking and by exposure eliminating the photoresist layer of at least one isolation region; executing plural times an ion implantation process including: adjusting an incident angle of a Boron ion beam with respect to the substrate, and implanting the Boron ion beam into the cap layer, the barrier layer, the buffer layer, the nucleation layer and the substrate within the at least one isolation region so as to form an isolation structure while rotating the substrate by a rotation angle; eliminating the rest of the photoresist layer by exposure; and forming a source, a drain and a gate on the cap layer.

Abstract: A motor deceleration method for a motor driving system is provided. The motor driving system outputs a driving signal containing a voltage value, a current value and a frequency value for driving a motor. When a deceleration of the motor is launched, the descent speeds of the voltage value and the frequency value are controlled according to a preset deceleration time period. Then, a voltage compensation value is generated according to a result of comparing the current value with a preset current level, and the voltage value is increased according to the voltage compensation value, so that the current value is increased to the preset current level. According to a frequency compensation value, the current value is increased to and maintained at the preset current level. Finally, the rotating speed of the motor is gradually decreased to a preset speed.

Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.

Abstract: A current compensation module, a charging apparatus, and a charging apparatus controlling method are disclosed. The current compensation module is used for controlling an outputted charging current in order to charge a battery module. The current compensation module includes a transition unit, a proportional controlling unit, and an integral controlling unit. The transition unit allows an internal signal of the current compensation module increasing from a first voltage. When the internal signal attains to a second voltage, the proportional controlling unit will output a proportional controlling signal to adjust the charging current. When the charging current attains to a rated output current, the integral controlling unit incorporates with the proportional controlling unit to output a proportional-integral controlling signal in order to control and adjust the charging current for the battery module, and to suppress the output overshoot current of the charging apparatus.

Abstract: A wafer holding structure for wafer backside processing, in which the wafer comprises a SiC substrate and a semiconductor device layer. The SiC substrate has a back surface and a front surface, and the semiconductor device layer has a first surface and a second surface. The semiconductor device layer is disposed on the SiC substrate with its first surface in contact with the front surface of the SiC substrate. The wafer holding structure comprises a wafer carrier and an adhesive coating. The wafer carrier is made of n-type conductive SiC, and has a thermal expansion coefficient that is well matched to the SiC substrate. The wafer carrier is mounted to the second surface of the semiconductor device layer and the adhesive coating is coated between the wafer carrier and the second surface of the semiconductor device layer.

Abstract: The present invention provides measuring apparatus and method for three-dimensional profilometry of an object, wherein a random-speckle beam and a structured fringe beam are projected onto the object and reflected therefrom for forming deformed random-speckle beam and structured fringe beams that are separately acquired by an image acquiring device thereby obtaining a random-speckle image utilized to determine an absolute phase information of each position on the surface of the object, and a structured fringe image utilized to determine a relative phase information for each position of the surface of the object. Each absolute phase information and each relative phase information corresponding to each position are converted into an absolute depth and a relative depth, respectively. Finally, the depth information of each position on the surface of the object is calculated by combining the corresponding absolute depth and the relative depth whereby the surface profile of the object can be established.

Abstract: A wafer edge protector is used in an inductively coupled plasma reactive ion etching instrument for the manufacturing of GaN semiconductor devices and circuits. The wafer edge protector comprises a ring clamp, which has a first inner diameter and a second inner diameter, and the ring clamp covers the edges of a wafer and a wafer carrier to clamp the wafer and the wafer carrier and to prevent damage on the edges of the wafer and the wafer carrier during the etching process.

Abstract: A rotation assembly includes a sleeve, a catch and an elastic member, the sleeve comprises a central longitudinal axis, a ring wall, a first through hole and a constraining slot having a planar surface. The central longitudinal axis is surrounded by the ring wall, and the first through hole and the constraining slot are formed at the ring wall. The elastic member comprises a free end and a limiting end, the free end is engaged with the catch, and the limiting end is limited by the constraining slot to prevent the elastic member from separating from the sleeve while the rotation assembly is impact by an external force.

Abstract: A packaging substrate is provided, including a substrate body having a plurality of conductive pads, an insulating protective layer formed on the substrate body for the conductive pads to be exposed therefrom, and a plurality of conductive pillars disposed on the conductive pads. Each of the conductive pillars has a bottom end and a top end narrower than the bottom end, thereby forming a cone-shaped structure that does not have a wing structure. Therefore, the distance between contact points is reduced and the demands for fine-pitch and multi-joints are satisfied.