Patents by Inventor An Duc Nguyen

An Duc Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11985459
    Abstract: A mounting system for mounting a loudspeaker to a substrate includes a mounting assembly having an elongated screw, a support member received on and movable along the screw, and a mounting arm rotatably connected to the support member and having a resting position and a working position. A guide housing receives the mounting assembly with the screw extending longitudinally therethrough and includes a wall structure with an open front side and a cap at a top portion of the wall structure. In the resting position, the support member is positioned along the screw at least partially received within the cap and the mounting arm is substantially contained within the wall structure. In the working position, the support member is positioned along the screw to be outside of the cap and the mounting arm is spring-biased away from the screw and extends outwardly through the front side of the wall structure.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: May 14, 2024
    Assignee: Harman International Industries, Incorporated
    Inventors: An Duc Nguyen, Christian Manuel Garcia, Larry Paul Brown, Chris N. Hagen
  • Patent number: 11564032
    Abstract: A speaker system is provided with a housing adapted to mount to a support. A driver is supported by the housing and arranged to project sound about a first axis extending at an offset angle relative to a longitudinal axis extending from the housing. A waveguide extends from the driver to define a cavity extending along the first axis. The waveguide includes a first segment formed at a first angle relative to the longitudinal axis, and a second segment formed at a second angle relative to the longitudinal axis, wherein the second segment is arranged opposite the first segment and the second angle is greater than the first angle to collectively provide an asymmetrical sound pattern in a first plane.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: January 24, 2023
    Assignee: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    Inventors: Christian Manuel Garcia, An Duc Nguyen, James Garrett
  • Publication number: 20220353607
    Abstract: A speaker system is provided with a housing adapted to mount to a support. A driver is supported by the housing and arranged to project sound about a first axis extending at an offset angle relative to a longitudinal axis extending from the housing. A waveguide extends from the driver to define a cavity extending along the first axis. The waveguide includes a first segment formed at a first angle relative to the longitudinal axis, and a second segment formed at a second angle relative to the longitudinal axis, wherein the second segment is arranged opposite the first segment and the second angle is greater than the first angle to collectively provide an asymmetrical sound pattern in a first plane.
    Type: Application
    Filed: April 30, 2021
    Publication date: November 3, 2022
    Applicant: Harman International Industries, Incorporated
    Inventors: Christian Manuel GARCIA, An Duc NGUYEN, James GARRETT
  • Publication number: 20220264205
    Abstract: A mounting system for mounting a loudspeaker to a substrate includes a mounting assembly having an elongated screw, a support member received on and movable along the screw, and a mounting arm rotatably connected to the support member and having a resting position and a working position. A guide housing receives the mounting assembly with the screw extending longitudinally therethrough and includes a wall structure with an open front side and a cap at a top portion of the wall structure. In the resting position, the support member is positioned along the screw at least partially received within the cap and the mounting arm is substantially contained within the wall structure. In the working position, the support member is positioned along the screw to be outside of the cap and the mounting arm is spring-biased away from the screw and extends outwardly through the front side of the wall structure.
    Type: Application
    Filed: July 29, 2020
    Publication date: August 18, 2022
    Applicant: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    Inventors: An Duc NGUYEN, Christian Manuel GARCIA, Larry Paul BROWN, Chris N. HAGEN
  • Patent number: 10433041
    Abstract: An outdoor loudspeaker that is weather resistant and includes environmental lighting is described. The lamp is mounted to a cap at the top of the loudspeaker. An audio driver is mounted below the lamp. A system outdoor loudspeakers is also described. The lighting circuitry and the audio circuitry is separate, e.g., separate conduits and wiring in the loudspeaker. The cap can include a light guide, e.g., a lens centrally mounted in the cap or an opaque cover to direct the light downwardly and outwardly. At least part of the loudspeaker can be mounted underground and, in the case of a sub-woofer, the entire chamber can be mounted below ground.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: October 1, 2019
    Assignee: Harman International Industries, Incorporated
    Inventors: James Garrett, Fred Tubis, An Duc Nguyen, Aaron L. Butters, Timothy Gladwin
  • Patent number: 10341763
    Abstract: A passive radiator assembly for a loudspeaker system comprising: a pair of passive radiators including a first and a second passive radiator; a frame having a first, a second and a third opening wherein the first and second opening are located on parallel sides of the frame, respectively, wherein the first and the second passive radiator are mounted into the first and second opening of the parallel sides of the frame, respectively, so as to oppose each other at a predetermined distance.
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: July 2, 2019
    Assignee: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    Inventors: Shengbo Li, An Duc Nguyen
  • Patent number: 10136201
    Abstract: A speaker assembly is provided with a housing, at least one transducer supported by the housing, and a controller. The controller is adapted to receive a first audio signal from a first audio source and a second audio signal from a second audio source. The controller is programmed to prioritize the first audio signal and the second audio signal based on a location of the housing relative to a charging station, and to provide the highest priority audio signal to the at least one transducer.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: November 20, 2018
    Assignee: Harman International Industries, Incorporated
    Inventors: Mark Fisher, An Duc Nguyen
  • Publication number: 20180077486
    Abstract: A passive radiator assembly for a loudspeaker system comprising: a pair of passive radiators including a first and a second passive radiator; a frame having a first, a second and a third opening wherein the first and second opening are located on parallel sides of the frame, respectively, wherein the first and the second passive radiator are mounted into the first and second opening of the parallel sides of the frame, respectively, so as to oppose each other at a predetermined distance.
    Type: Application
    Filed: April 2, 2015
    Publication date: March 15, 2018
    Applicant: HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
    Inventors: Shengbo LI, An Duc NGUYEN
  • Publication number: 20170311062
    Abstract: An outdoor loudspeaker that is weather resistant and includes environmental lighting is described. The lamp is mounted to a cap at the top of the loudspeaker. An audio driver is mounted below the lamp. A system outdoor loudspeakers is also described. The lighting circuitry and the audio circuitry is separate, e.g., separate conduits and wiring in the loudspeaker. The cap can include a light guide, e.g., a lens centrally mounted in the cap or an opaque cover to direct the light downwardly and outwardly. At least part of the loudspeaker can be mounted underground and, in the case of a sub-woofer, the entire chamber can be mounted below ground.
    Type: Application
    Filed: April 24, 2017
    Publication date: October 26, 2017
    Inventors: James GARRETT, Fred TUBIS, An Duc NGUYEN, Aaron L. BUTTERS, Timothy GLADWIN
  • Publication number: 20170127204
    Abstract: A speaker assembly is provided with a housing, at least one transducer supported by the housing, and a controller. The controller is adapted to receive a first audio signal from a first audio source and a second audio signal from a second audio source. The controller is programmed to prioritize the first audio signal and the second audio signal based on a location of the housing relative to a charging station, and to provide the highest priority audio signal to the at least one transducer.
    Type: Application
    Filed: October 27, 2016
    Publication date: May 4, 2017
    Inventors: Mark FISHER, An Duc NGUYEN
  • Patent number: 7450729
    Abstract: One embodiment of a low-profile transducer includes a at least one fin perpendicularly mounted on a planar diaphragm, with a voice coil mounted onto the fin. The voice coil may reside in a strong uniform magnetic field. The locations at which the diaphragm is connected to a frame may be coplanar with a center of mass of the diaphragm. The three-dimensional structure of diaphragm and fins may be formed using origami techniques.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: November 11, 2008
    Assignee: Harman International Industries, Incorporated
    Inventors: An Duc Nguyen, Charles M. Sprinkle
  • Patent number: 7412065
    Abstract: One embodiment of a low-profile transducer includes a at least one fin perpendicularly mounted on a planar diaphragm, with a voice coil mounted onto the fin. The voice coil may reside in a strong uniform magnetic field. The locations at which the diaphragm is connected to a frame may be coplanar with a center of mass of the diaphragm. The three-dimensional structure of diaphragm and fins may be formed using origami techniques.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: August 12, 2008
    Assignee: Harman International Industries, Incorporated
    Inventors: An Duc Nguyen, Charles M. Sprinkle
  • Patent number: 7333620
    Abstract: One embodiment of a low-profile transducer includes a at least one fin perpendicularly mounted on a planar diaphragm, with a voice coil mounted onto the fin. The voice coil may reside in a strong uniform magnetic field. The locations at which the diaphragm is connected to a frame may be coplanar with a center of mass of the diaphragm. The three-dimensional structure of diaphragm and fins may be formed using origami techniques.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: February 19, 2008
    Assignee: Harman International Industries, Incorporated
    Inventors: An Duc Nguyen, Charles M. Sprinkle
  • Patent number: D800696
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: October 24, 2017
    Assignee: Harman International Industries, Incorporated
    Inventors: Fred Tubis, An Duc Nguyen
  • Patent number: D924846
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: July 13, 2021
    Assignee: Harman International Industries, Incorporated
    Inventors: Larry Paul Brown, Chris N. Hagen, James Garrett, An Duc Nguyen
  • Patent number: D989042
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: June 13, 2023
    Assignee: Harman International Industries, Incorporated
    Inventors: Christian Manuel Garcia, An Duc Nguyen
  • Patent number: D1018501
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: March 19, 2024
    Assignee: Harman International Industries, Incorporated
    Inventors: An Duc Nguyen, Christian Manuel Garcia, Chris N. Hagen