Abstract: A display device is provided. The display device includes a display region and a non-display region adjacent to the display region, wherein the display region is non-rectangular and includes a plurality of first pixels and a plurality of second pixels, wherein the plurality of second pixels is disposed at the periphery of the display region and surrounds the plurality of first pixels, wherein when the plurality of first pixels and the plurality of second pixels are supplied with the same operating voltage, the plurality of second pixels has two or more brightness levels.

Abstract: An efficient heat-dissipating and all day lighting headlight includes an inner heat-dissipating base, an outer heat-dissipating base, a circuit assembly, a low-beam lamp assembly, a high-beam lamp assembly, a daytime lamp assembly and a headlight cover. The inner heat-dissipating base has two opposite surfaces with one of the surfaces thermally contacting the circuit assembly and the outer heat-dissipating base. The circuit assembly is mounted between the inner heat-dissipating base and the outer heat-dissipating base. The low-beam, high-beam and daytime lamp assemblies thermally contact the other surface of the inner heat-dissipating base. The low-beam and high-beam assemblies are electrically connected to the circuit assembly. The daytime, low-beam and high-beam lamp assemblies are further covered by the headlight cover capable of radiating heat out.

Abstract: A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component.

Abstract: A powder recycling machine includes a casing, a powder collector, a dust-sucking system and a dust-removing system. An accommodation space within the casing is divided into a first space and a second space by a partition plate. The powder collector is disposed within the first space for collecting excess powder from the first space. The dust-sucking system includes a connector, a cyclone separator and a first suction device. The connector, the cyclone separator, the first suction device and the powder collector are sequentially in communication with each other through plural transmission ducts. The dust-removing system includes a second suction device. The first space, the second suction device and the powder collector are sequentially in communication with each other through plural guiding ducts. After the excess powder suspended in the first space is introduced into the dust-removing system, the excess powder is transferred to the powder collector.

Abstract: A 360 degree camera system includes a support structure, a plurality of image capture devices, a plurality of lens systems, and an image processing system. The image capture devices are positioned such that their height is greater than their width. The image processing system includes a rotation module for remapping the pixel addresses of the image data to join the captured images along their long edges.

Abstract: A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component.

Abstract: A method of testing a device under test (DUT) connected between first and second DUT nodes includes generating a set of control signals, and in response to the set of control signals, disconnecting a first voltage node from a first DUT node, connecting a second voltage node to the first DUT node, periodically connecting and disconnecting a third voltage node to and from the second DUT node at a predetermined frequency, disconnecting a fourth voltage node from the second DUT node when the third voltage node is connected to the second DUT node, and connecting the fourth voltage node to the second DUT node when the third voltage node is disconnected from the second DUT node. A circuit that performs the method is also disclosed.

Abstract: A display panel is disclosed, having a display region and a non-display region out of the display region, wherein the display region comprises a central pixel region and a border pixel region disposed between the central pixel region and the non-display region, the display panel comprising: a first substrate; a second substrate; a display medium layer; a plurality of central pixel units located at the central pixel region and having a plurality of first electrodes disposed on the second substrate; and a plurality of border pixel units located at the border pixel region and having a plurality of second electrodes disposed on the second substrate; wherein outmost edges of a part of the adjacent border pixel units form a ladder-like shape, and a light output area of at least one of the border pixel units is smaller than that of at least one of the central pixel units.

Abstract: A semiconductor device comprises a guarded circuit. The semiconductor device also comprises a guard ring surrounding the guarded circuit. The semiconductor device further comprises a resonant circuit coupled with the guard ring. The resonant circuit comprises an input node coupled with the guard ring. The resonant circuit also comprises an inductor. The resonant circuit further comprises a capacitor coupled with the inductor. The resonant circuit additionally comprises a ground node configured to carry a ground voltage. The inductor and the capacitor are coupled between the input node and the ground node.

Abstract: A page-width printing platform comprises a plurality of inkjet head structures collaboratively defined as at least one page-width array printing unit. The inkjet head structures comprise respective inkjet chips disposed on the printing platform and arranged in plural rows and in a staggered form, so that a printing width of the inkjet chips is larger than or equal to a width of a printed pattern. Each of the inkjet chips comprises at least one liquid supply slot, wherein a plurality of liquid ejectors are located at one or two sides of the liquid supply slot along a long axis of the liquid supply slot. At least one monochromatic print liquid is introduced into the construction chamber from the plural inkjet head structures and printed on a construction material within the construction chamber, so that a rapid prototyping width-page printing operation is performed.

Abstract: A driving head includes a body having a connection portion with a polygonal recess, and a driving portion which extends integrally from the connection portion and has a driving section which has multiple engaging faces. The engaging faces are located at equal center angle to each other. A neck is connected between the connection portion and the driving portion. The driving portion is a tapered portion. A first angle is defined between the outer surface of the driving portion and the axis of the body. An object has a reception recess in which the driving section is inserted. The reception recess has a tapered angle. The first angle is smaller than or equal to the tapered angle. The driving portion is strong and is not easily deformed. The driving section is sufficiently engaged with the reception recess of the object.

Abstract: A 360 degree camera system includes a support structure, a plurality of image capture devices, a plurality of lens systems, and an image processing system. The image capture devices are positioned such that their height is greater than their width. The image processing system includes a rotation module for remapping the pixel addresses of the image data to join the captured images along their long edges.

Abstract: Semiconductor devices having capacitor arrays. A semiconductor device is formed including a capacitor array formed in a plurality of cells in a two-dimensional grid. The capacitor array includes a plurality of operational capacitors formed in a first subset of the plurality of cells along a diagonal of the capacitor array. A first operational capacitor is formed in a cell at a first edge of the capacitor array and at a first edge of the diagonal of the capacitor array. The capacitor array also includes a plurality of dummy patterns formed about the plurality of operational capacitors in the capacitor array in a second subset of the plurality of cells to achieve symmetry in the grid about the diagonal. Each one of the plurality of operational capacitors is electrically coupled to another one of the plurality of operational capacitors.

Abstract: According to an exemplary embodiment, a semiconductor device is provided. The semiconductor device includes a first seal ring and a first circuit. The first circuit includes a first capacitor and a first inductor connected in series. The first circuit is connected between the first seal ring and a ground.

Abstract: Methods of forming semiconductor devices. The method includes forming a capacitor array comprising a plurality of cells in a two-dimensional grid. The step of forming includes forming a plurality of operational capacitors in a first subset of the plurality of cells along a diagonal of the array, the plurality of operational capacitors comprising a first operational capacitor formed in a cell at a first edge of the capacitor array and at a first edge of the diagonal of the capacitor array. The step of forming also includes forming a plurality of dummy patterns about the plurality of operational capacitors in the capacitor array in a second subset of the plurality of cells to achieve symmetry in the grid about the diagonal. The method also includes electrically coupling each one of the plurality of operational capacitors to another one of the plurality of operational capacitors.

Abstract: A clamping and cutting device for frozen material includes a clamping member and a cutting component. The clamping member includes a clamper for clamping frozen materials and a driving component for driving the clamper to open or close. The cutting component is connected to the clamper and includes two driven arms cooperating with the clamper to open and close with the clamper.

Abstract: An inkjet chip of printing module of a rapid prototyping apparatus and a control circuit thereof are disclosed. The inkjet chip has a length and a width to define a total area including an unwiring area and a wiring area. The unwiring area has at least three liquid supply slots in parallel with each other and respectively connected to one of the ink chambers of the modular ink cartridge. The wiring area has a control circuit. The control circuit includes a plurality of liquid ejectors. Each liquid ejector has a heating resistor, a driving transistor, and a nozzle. The control circuit is connected to receive a power signal, a printing data signal, a preheating data signal, a preheating control signal, a reverse preheating control signal, a heating control signal, and a reverse heating control signal and connected with the common connection node for controlling the liquid ejector.

Abstract: A printing module of a rapid prototyping apparatus is disclosed. The printing module includes a printing platform, a carrying seat and at least two modular ink cartridges. The printing platform has a frame and a driving shaft, and the driving shaft is installed on the frame. The carrying seat is penetrated and disposed on the driving shaft. The two modular ink cartridges are disposed on the carrying seat. Each modular ink cartridge has a case body and three ink chambers. The three ink chambers are divided within the case body for receiving different print liquids, respectively, and the case bodies of the at least two modular ink cartridges contain at least one print liquid the same with each other for performing the rapid prototyping printing process.

Abstract: A powder recycling system for a three-dimensional rapid prototyping apparatus is provided. The powder recycling system includes a sealed main body, a negative pressure generator, an air pressure generator, a lighting unit and a heater. When an excess powder removing process is performed to remove excess powder from a three-dimensional object, the excess powder is sieved by a screen mesh and collected by a powder collector. Consequently, the excess powder is recycled.

Abstract: An imaging method comprises acquiring an undersampled magnetic resonance partially parallel imaging (MR-PPI) dataset using a plurality of radio frequency receive coils and reconstructing the undersampled MR-PPI dataset to generate a reconstructed magnetic resonance (MR) image. The reconstructing includes: (i) using a generalized auto-calibrating partially parallel acquisition (GRAPPA) operator or direct convolution to fill in at least some missing data of the undersampled MR-PPI dataset so as to generate an enhanced dataset; and (ii) using an algorithm other than a GRAPPA operator and other than direct convolution to reconstruct the enhanced dataset or to reconstruct the undersampled MR-PPI dataset using the enhanced dataset as an initialization dataset for an iterative reconstruction algorithm. In some embodiments the MR-PPI dataset is a non-Cartesian dataset and a GRAPPA operator for wider radial bands (GROWL) is used in the operation (i).