Patents by Inventor An FU

An FU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector assembly
    Patent number: 11652311
    Abstract: A connector assembly includes a first connector and a second connector matable with the first connector. The first connector has a first housing and a pair of first conductive terminals disposed in the first housing each having a pair of first elastic terminals arranged symmetrically in a vertical direction. Each pair of first elastic terminals has a pair of front ends adapted to be brought into elastic and electrical contact with a pair of first wires inserted into the first connector. The second connector has a second housing and a pair of second conductive terminals disposed in the second housing each having a rear end adapted to be brought into elastic and electrical contact with a second wire inserted into the second connector. The pair of first elastic terminals each have a rear end adapted to clamp a front end of one of the second conductive terminals.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: May 16, 2023
    Assignee: Tyco Electronics (Shanghai) Co., Ltd.
    Inventors: Wei Zhang, Ming Shi, Xiaozhi Fu, Dingbing Fan, Shuzhi Wang, Hongtao Jiang
  • Contacts and method of manufacturing the same
    Patent number: 11653491
    Abstract: A method of manufacturing contacts is provided in the present invention, which include the steps of forming a plurality of mask bars on a substrate, forming a circular mask surrounding each mask bar, wherein the circular masks connect each other and define a plurality of opening patterns collectively with the mask bars, using the mask bars and the circular masks as etch masks to perform an etch process and to transfer the opening patterns and form a plurality recesses in the substrate, and filling up the recesses with metal to form contacts.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: May 16, 2023
    Assignees: UNITED MICROELECTRONICS CORP., Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Feng-Yi Chang, Fu-Che Lee
  • Method and apparatus for monitoring collection of physiological patient data
    Patent number: 11647904
    Abstract: A method and apparatus for monitoring collection of subject condition data is provided. The method includes receiving a value of a parameter of subject condition data and a value of a sample time, for each of a plurality of sample times. The method also includes storing the subject condition data in a data structure including a first field for holding data indicating a current sample time and a second field for holding data indicating the value of the parameter. The method also includes determining a time gap defined by a duration between the current sample time and a most recent sample time and determining whether the time gap exceeds a time gap threshold and causing an apparatus to perform remedial action. A method for presenting the subject condition data on a display is also provided.
    Type: Grant
    Filed: February 21, 2022
    Date of Patent: May 16, 2023
    Assignee: University of Maryland, Baltimore
    Inventors: Fu-Ming Hu, Lynn G. Stansbury, Colin F. Mackenzie, Thomas M. Scalea, Deborah M. Stein, Shiming Yang
  • Semiconductor device and method for making the same
    Patent number: 11652106
    Abstract: A semiconductor device includes a plurality of semiconductor fins, at least one gate stack, a refill isolation, and an air gap. Each of the semiconductor fins extends in an X direction. Two adjacent ones of the semiconductor fins are spaced apart from each other in a Y direction transverse to the X direction. The at least one gate stack has two stack sections spaced apart from each other in the Y direction. The stack sections are disposed over two adjacent ones of the semiconductor fins, respectively. The refill isolation and the air gap are disposed between the stack sections.
    Type: Grant
    Filed: May 6, 2021
    Date of Patent: May 16, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pei-Yu Chou, Yi-Ting Fu, Ting-Gang Chen, Tze-Liang Lee
  • Method for forming holes, metal product, and metal composite
    Patent number: 11649557
    Abstract: A method for forming holes to form holes in a surface of a metal part includes: putting the metal part into a first solution as an anode; applying a first voltage on the metal part to form the first holes in a surface of the metal part; and cleaning and drying the metal part with the first holes. The first solution comprises a first organic solvent, chloride, and a phosphoric acid compound. The disclosure also provides a metal product and a metal composite.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: May 16, 2023
    Assignee: Fulian Yuzhan Precision Technology Co., Ltd
    Inventors: Wen-Cheng Zhu, Bo-Ling Xu, Xiao-Qing Fu, Xiao-Jian Wang, Jian-Hui Peng
  • IN-SITU THERMAL ANNEALING OF ELECTRODE TO FORM SEED LAYER FOR IMPROVING FERAM PERFORMANCE
    Publication number: 20230143625
    Abstract: In some embodiments, the present disclosure relates to a method for forming an integrated circuit (IC), including forming a first electrode layer having a first metal over a substrate, performing a first atomic layer deposition (ALD) pulse that exposes the first electrode layer to oxygen atoms, exposing the first electrode layer to a first temperature, the first temperature causing the first electrode layer to react with the oxygen atoms to form a seed structure over the first electrode layer, and performing a series of ALD pulses at a second temperature to form a ferroelectric structure over the seed structure. The second temperature is less than the first temperature and the ferroelectric structure is configured to store a data state.
    Type: Application
    Filed: January 6, 2022
    Publication date: May 11, 2023
    Inventors: Yen-Chieh Huang, Po-Ting Lin, Song-Fu Liao, Hai-Ching Chen, Chung-Te Lin
  • HANDCUFF RING WITH MECHANISM FOR ENHANCED LOCKING AND HANDCUFFS HAVING THE SAME
    Publication number: 20230142788
    Abstract: A handcuff ring with mechanism for enhanced locking includes a stationary strand and a movable strand. The stationary strand is provided therein with an engaging clement, a stop portion, and an elastic element that is located between, and can push respectively, the engaging element and the stop portion. At least one locking groove is formed on the front side and/or the rear side of the stationary strand, and a thin rod, when being inserted from outside into the locking groove, can press an end of the stop portion to displace the stop portion toward a keyhole, so that the abutting portions of the stop portion and the engaging element abut against each other. Accordingly, through the locking groove(s) located on the front side and/or the rear side of the handcuff ring, a user can conveniently push the stop portion by the thin rod to finish the enhanced locking process.
    Type: Application
    Filed: May 10, 2022
    Publication date: May 11, 2023
    Applicant: KANTAS PRODUCTS CO., LTD.
    Inventor: Yang-Fu CHENG
  • TECHNIQUE FOR ENABLING ON-DIE NOISE MEASUREMENT DURING ATE TESTING AND IST
    Publication number: 20230146920
    Abstract: Introduced herein is a technique that reliably measures on-die noise of logic in a chip. The introduced technique places a noise measurement system in partitions of the chip that are expected to cause the most noise. The introduced technique utilizes a continuous free-running clock that feeds functional frequency to the noise measurement circuit throughout the noise measurement scan test. This allows the noise measurement circuit to measure the voltage noise of the logic during a shift phase, which was not possible in the conventional noise measurement method. Also, by being able to measure the voltage noise during a shift phase and hence in both phases of the scan test, the introduced technique can perform a more comprehensive noise measurement not only during ATE testing but as part of IST in the field.
    Type: Application
    Filed: November 2, 2022
    Publication date: May 11, 2023
    Inventors: Bonita Bhaskaran, Nithin Valentine, Shantanu Sarangi, Mahmut Yilmaz, Suhas Satheesh, Charlie Hwang, Tezaswi Raja, Kevin Zhou, Sailendra Chadalavada, Kevin Ye, Seyed Nima Mozaffari Mojaveri, Kerwin Fu
  • SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20230146366
    Abstract: A device includes a substrate, a gate structure over the substrate, gate spacers on opposite sidewalls of the gate structure, source/drain structures over the substrate and on opposite sides of the gate structure, and a self-assemble monolayer (SAM) in contact with an inner sidewall of one of the gate spacer and in contact with a top surface of the gate structure.
    Type: Application
    Filed: January 11, 2023
    Publication date: May 11, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Wei SU, Fu-Ting YEN, Ting-Ting CHEN, Teng-Chun TSAI
  • CAMERA DEVICE
    Publication number: 20230142061
    Abstract: The present disclosure provides a camera device including a first frame, a second frame, a camera component, and a driving component. The first frame includes a first arc surface on an inner surface of the first frame and recessing inward to form a circular arc shape. The second frame is movably disposed in the first frame and includes a second arc surface on an outer surface of the second frame and protruding outward to form a circular arc shape. The camera component is fixedly disposed in the second frame. The driving component is disposed on the first frame and the second frame, and the driving component is configured to drive the second frame to rotate with the first direction, the second direction, and the third direction as the axes.
    Type: Application
    Filed: November 3, 2022
    Publication date: May 11, 2023
    Applicant: LANTO ELECTRONIC LIMITED
    Inventors: Tao-Chun CHEN, Fu-Yuan WU, Yu-Cheng LIN
  • SUBSTITUTED STRAIGHT CHAIN SPIRO DERIVATIVES
    Publication number: 20230142285
    Abstract: The present invention relates to pharmaceutical agents useful for therapy and/or prophylaxis in a mammal, pharmaceutical composition comprising such compounds, and their use as menin/MLL protein/protein interaction inhibitors, useful for treating diseases such as cancer, including but not limited to leukemia, myelodysplastic syndrome (MDS), and myeloproliferative neoplasms (MPN); and diabetes.
    Type: Application
    Filed: December 17, 2020
    Publication date: May 11, 2023
    Inventors: Wei CAI, Xuedong DAI, Oliver Alexis Georges QUEROLLE, Johannes Wilhelmus John F. THURING, Yingtao LIU, Lianzhu LIU, Yanping XU, Liqiang FU, Ming LI, Lichao FANG, Xianguin DENG, Qiwu ZHAO, Kangying LI, Alicia Tee Fuay NG, Nicolas Freddy J. DARVILLE, Edward CLEATOR, Gregor Thomas URBANIETZ, William Marc MATON, Vineet PANDA
  • METHOD FOR ESTABLISHING EPICUTANEOUSLY SENSITIZED FOOD ALLERGY ANIMAL MODEL
    Publication number: 20230141616
    Abstract: A method for establishing an epicutaneously sensitized food allergy animal model and belongs to the technical field of medical evaluation and detection. The method includes an allergen sensitization stage and an allergen challenge stage, wherein an MC903 ethanol solution containing OVA is smeared on the skin of experimental animals in the allergen sensitization stage, and the OVA dissolved in a buffer solution is used for an oral challenge in the allergen challenge stage.
    Type: Application
    Filed: November 29, 2022
    Publication date: May 11, 2023
    Applicant: Zhejiang Gongshang University
    Inventors: Linglin Fu, Qiaozhi Zhang, Jinru Zhou, Gang Yu, Chong Wang
  • HIGH-SPEED CONNECTOR
    Publication number: 20230144251
    Abstract: A high-speed connector includes an insulating housing, a first terminal assembly received in the insulating housing, a second terminal assembly received in the insulating housing, a third terminal assembly received in the insulating housing, and a fourth terminal assembly received in the insulating housing. The second terminal assembly is opposite to the first terminal assembly along an up-down direction. The third terminal assembly is disposed between the first terminal assembly and the second terminal assembly. The fourth terminal assembly is corresponding to the third terminal assembly. The fourth terminal assembly is disposed between the second terminal assembly and the third terminal assembly.
    Type: Application
    Filed: August 24, 2022
    Publication date: May 11, 2023
    Inventors: YUN-CHIEN LEE, YI-CHING HSU, PEI-YI LIN, YU-HUNG SU, SHENG-YUAN HUANG, CHUN-FU LIN
  • SYSTEM AND METHOD FOR OMNIDIRECTIONAL ADAPTIVE LOUDSPEAKER
    Publication number: 20230145713
    Abstract: In at least one embodiment, a system for providing an adaptive loudspeaker assembly is provided. A loudspeaker array transmits an audio output signal in an omnidirectional sound mode in a room having a plurality of walls. A microphone array is coupled to the loudspeaker array to capture the audio output signal in the room. At least one controller is programmed to receive the captured audio output signal and to determine that at least one first wall of the plurality of walls is closest to the loudspeaker array based on the captured audio output signal. The at least one controller is further programmed to change a sound mode of the loudspeaker array from transmitting the audio output signal in the omnidirectional mode into a beamforming sound mode to transmit the audio output signal away from the at least one first wall of the plurality walls.
    Type: Application
    Filed: November 9, 2021
    Publication date: May 11, 2023
    Inventors: Shao-Fu SHIH, James ZHENG
  • STAND DEVICE WITH INPUTS
    Publication number: 20230141332
    Abstract: In some examples, the disclosure describes a device that includes a stand enclosure that includes a first end to interact with a work surface and a second end to be coupled to a display device, a plurality of input ports coupled to the stand enclosure, and a connection interface coupled to the second end of the stand enclosure to allow communication between the display device and the plurality of inputs when the connection interface is coupled to the display device.
    Type: Application
    Filed: November 5, 2021
    Publication date: May 11, 2023
    Inventors: Wei Zhao, Bang-Zhong Xu, Guo-Kai Li, Chun Fu Chen
  • RECONFIGURABLE HEADSET THAT TRANSITIONS BETWEEN VIRTUAL REALITY, AUGMENTED REALITY, AND ACTUAL REALITY
    Publication number: 20230143799
    Abstract: A method for switching a configuration of an enhanced reality headset is provided. The method includes identifying a scenario to switch a configuration of an enhanced reality headset between a virtual reality configuration, an augmented reality configuration, and a direct reality configuration, wherein the virtual reality configuration and the augmented reality configuration include a computer generated image, and the direct reality configuration and the augmented reality configuration include a real-time image of an environment of a user of the enhanced reality headset. The method includes providing a notification to a user of the enhanced reality headset including an intent to switch the configuration of the enhanced reality headset, and switching the configuration of the enhanced reality headset according to the scenario.
    Type: Application
    Filed: December 1, 2022
    Publication date: May 11, 2023
    Inventors: Rachel Cross, Tiffany Madruga, Allison Fu, Meaghan Fitzgerald
  • METHOD FOR PREFABRICATING AIR HOLE DEFECT BY MEANS OF CONTROLLED SLM PROCESS
    Publication number: 20230141551
    Abstract: A method for prefabricating pore defects by controlling a SLM process, including performing laser scanning on a specified metal melt layer (LY) according to a first scan path (P1) and a second scan path. The first scan path (P1) and the second scan path (P2) have a path overlap zone (A0), the path overlap zone (A0) has a predetermined width, and laser energy input superimposed in the path overlap zone (A0) is controlled to reach a predetermined energy value, whereby keyholes are formed at a plurality of positions in a lengthwise direction of the path overlap zone (A0), the specified metal melt layer (LY) is taken as a defect layer, and the keyholes in the path overlap zone (A0) is taken as pore defects.
    Type: Application
    Filed: December 21, 2020
    Publication date: May 11, 2023
    Applicants: AECC SHANGHAI COMMERCIAL AIRCRAFT ENGINE MANUFACTURING CO., LTD., AECC COMMERCIAL AIRCRAFT ENGINE CO., LTD.
    Inventors: Liming LEI, Yali LI, Yanli HE, Xiaohui CHEN, Jun FU
  • DATA PROCESSING METHOD OF DRIVING CIRCUIT AND DRIVING CIRCUIT
    Publication number: 20230145294
    Abstract: A data processing method of a driving circuit and a driving circuit are provided. Wherein, the data processing method of the driving circuit can include obtaining a timing parameter, performing data processing based on the timing parameter and obtaining a first processing result, decoding the first processing result according to a preset reference voltage and obtaining a second processing result, and amplifying the second processing result, and outputting an amplified second processing result.
    Type: Application
    Filed: June 3, 2020
    Publication date: May 11, 2023
    Applicant: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
    Inventors: Jianguo FU, Taijiun HWANG, Pengfei LIANG, Bo YANG
  • LED CONTROL CIRCUIT AND LED ILLUMINATION SYSTEM
    Publication number: 20230144258
    Abstract: An LED control circuit, comprising: an isolated DC-DC circuit having a first current loop and a voltage loop, said circuit being used for outputting a stable direct current voltage; and a buck circuit having a control unit; wherein the control unit is used for controlling the buck circuit to output constant current, so as to supply power to an LED load, and also used for controlling the buck circuit to not operate when the direct current voltage is less than a preset voltage, and controlling the buck circuit to operate when the direct current voltage is greater than or equal to the preset voltage.
    Type: Application
    Filed: July 7, 2021
    Publication date: May 11, 2023
    Applicant: INVENTRONICS (HANGZHOU), INC.
    Inventors: Ping FU, Delai JIANG
  • NETWORK SLICE CONNECTION MANAGEMENT METHOD, TERMINAL, AND COMPUTER-READABLE STORAGE MEDIUM
    Publication number: 20230143835
    Abstract: Provided are a method for managing network slice connection, a terminal and a computer-readable storage medium. The method for managing network slice connection includes: obtaining connection request information transmitted by a terminal application in a case where the terminal application initiates a network slice connection request; performing an authentication process on the terminal application initiating the network slice connection request; and in response to the terminal application passing the authentication process, enabling the terminal application to connect to a network slice according to the connection request information.
    Type: Application
    Filed: May 21, 2021
    Publication date: May 11, 2023
    Inventors: Dingyuan TU, Bing FU