Abstract: A control method of a drive system for a mobile vehicle, and a control system and a domain control unit of a mobile vehicle are provided. The control method is applied to the mobile vehicle, and includes: (A) calculating a target yaw rate of the mobile vehicle; (B) calculating a difference between an actual yaw rate of the mobile vehicle and the target yaw rate to obtain a yaw error; and (C) controlling, in response to the yaw error being greater than a third reference value, at least one of a torque output by a first drive unit and a torque output by a second drive unit, such that the yaw error is decreased or eliminated. Accordingly, the control method of the drive system and the control system of the mobile vehicle are capable of eliminating occurrence of an inner wheel difference during turning of the mobile vehicle.

Abstract: A method for performing an in-memory computation includes: storing data in memory cells of a memory array, the data including weights for computation; determining whether an update command to change at least one of the weights is received; in response to receiving the update command, performing a write operation on the memory array to update the at least one weight; and disabling the write operation on the memory array until receiving a next update command to change the at least one weight.

Abstract: Vertically stacked semiconductor devices and methods of fabrication thereof that include a first device structure bonded to a second device structure via bonding layers having compressible metal bonding structures. The compressible metal bonding structures may be fabricated using an electroless deposition (ED) process, and may be less dense with a greater degree of compressibility than equivalent materials deposited by related processes. Accordingly, mating pairs of metal bonding structures may have a degree of compliance that enables effective metal-to-metal contact during a subsequent bonding process. Recrystallization of the metal material during an annealing process may produce shrinkage of the metal material and the formation of void areas between the metal bonds and the surrounding dielectric layers, thereby reducing stress on the surrounding dielectric-to-dielectric interface.

Abstract: A semiconductor device includes a device layer, an interlayer dielectric layer disposed above the device layer, a first interconnection structure, a second interconnection structure, and a first dielectric layer. The interlayer dielectric layer includes a first portion and a second portion disposed above a first device region and a second device region, respectively. A top surface of the first portion is lower than a top surface of the second portion in a vertical direction. The first interconnection structure includes first conductive lines partly located in the first portion. The second interconnection structure includes second conductive lines located in the second portion. The first dielectric layer is disposed on the first portion, a part of the first dielectric layer is sandwiched between two adjacent first conductive lines, and a bottom surface of the first dielectric layer is lower than the top surface of the second portion in the vertical direction.

Abstract: A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, a vibration panel, and a face attachment component. The housing component includes a core housing and a core cover plate covering an open end of the core housing. The core cover plate and the core housing cooperate to form a first cavity. The face attachment component and the housing component cooperate to form a second cavity. The transducer device is at least partially located in the first cavity. The vibration panel is at least partially located in the second cavity. The core cover plate is provided with a first avoidance hole allowing the vibration panel to be connected with the transducer device. The core module is provided with a channel connecting the second cavity with the outside of the core module.

Abstract: A low-jitter random clock generation circuit includes: a clock division and pulse generation module connected to an input clock, performing frequency division processing to obtain frequency division clocks, and then detecting some frequency division clocks one by one to obtain frequency division pulses in a one-to-one correspondence; a pseudorandom number generation module connected to one frequency division clock, and generating a pseudorandom number; a status control module connected to all the frequency division clocks and the pseudorandom number to generate status control signals; and a random clock output module connected to the input clock, all the frequency division clocks, all the frequency division pulses, and all the status control signals, randomly sampling the frequency division clocks by using the frequency division pulses under control of the status control signals, and synchronously outputting the randomly sampled frequency division clocks by using the input clock, to obtain random clocks.

Abstract: A light string includes a housing, a light cap, and a light assembly. The light cap has a cap body, an upper tip at an upper end of the cap body, and a peripheral visibility ring extending outwardly from the cap body opposite the upper tip. The light cap is coupled to and extends from the housing such that the peripheral visibility ring seats adjacent to an end of the housing proximate the light aperture. The light assembly includes a light emitting source that is positioned such that when energized, light is emitted that is visible from outside the light cap. Moreover, the peripheral visibility ring reflects light in a direction different from the light emitted by the light emitting source such that the light emitted by the light emitting source is visible when an observer is looking at a side view of the cap body.

Abstract: An oscillation frequency control method and system and a display device are provided. The oscillation frequency control system (3) is for a display device including a communication component (2) and a display driver component (1). The display driver component (3) includes at least one oscillator. The oscillation frequency control system (3) includes: an acquisition component (31) configured to acquire current operating information of the communication component (2); a determination component (32) configured to determine an oscillation operating frequency corresponding to each oscillator according to the current operating information; and a control component (33) configured to control each oscillator to operate at a corresponding oscillation operating frequency, wherein a frequency of a harmonic wave generated when each oscillator operates at the corresponding oscillation operating frequency falls outside a communication operating frequency band in which the communication component (2) currently operates.

Abstract: An image processing device includes a memory, an image generator and a motion detection circuit. The image generator generates first data based on input image data and stores the first data to the memory. The motion detection circuit detects whether there is a presence of a motion detection event in the input image data.

Abstract: A method by a wireless (110) device includes receiving, from a network node (160), one or more bandwidth pieces. The data scheduled in one of the one or more bandwidth pieces includes at least one complete transport block and control information corresponding to the at least one complete transport block. The method further includes transmitting the data based on the scheduling or control information.

Abstract: A new type of calibration standards is presented, which has the uncalibrated peer-ports terminated to matching impedances such as 50?. Terminating peer-ports increases calibration accuracy since the calibration process is less affected by the undesired crosstalk in the error-network that is being calibrated or in the calibration standards themselves. Using the disclosed peer-terminated standards were shown to have less calibration errors over using conventional dual standards. This is applicable to any electrical measurement and calibration, where the calibration standards are designed to simultaneously connect multiple ports.

Abstract: A semiconductor image-sensing structure includes a reflective grid and a reflective shield disposed over a substrate. The reflective grid is disposed in a first region, and the reflective shield is disposed in a second region separated from the first region. A thickness of the reflective shield is greater than a thickness of the reflective grid.

Abstract: An optical imaging lens assembly includes nine lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element and a ninth lens element. The first lens element has negative refractive power. The second lens element with negative refractive power has an object-side surface being convex and an image-side surface being concave in a paraxial region thereof. The fourth lens element has an image-side surface being convex in a paraxial region thereof. The fifth lens element has positive refractive power. The sixth lens element has an image-side surface being concave in a paraxial region thereof. The eighth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof.

Abstract: A multi-channel visible light communication system includes a carrier board and a plurality of light-emitting device stacks. The light-emitting device stacks are arranged over the carrier board. Each of the light-emitting device stacks includes a first light-emitting device, a second light-emitting device and a first adhesive layer. The second light-emitting device is disposed over the first light-emitting device. The first adhesive layer is disposed between the first light-emitting device and the second light-emitting device. The first adhesive layer includes a first metasurface. The first metasurface is configured to pass a first color light emitted from the first light-emitting device and reflect a second color light emitted from the second light-emitting device.

Abstract: An embodiment semiconductor structure may include a first component having first electrical bonding structures formed within a first dielectric layer, a second component having second electrical bonding structures formed with a second dielectric layer, and an organic base layer formed between the first dielectric layer and the second dielectric layer. The organic base layer may include carbon chain structures such that the first dielectric layer is bonded to the second dielectric layer with bonds formed between the first dielectric layer, the organic base layer, and the second dielectric layer. The carbon chain structures may be characterized by a carbon number that is between 10 and 1000 and a hydrogen to carbon ratio H/C that is greater than 2 such that the organic base layer has a thickness that is 0.5 nm to 30 nm. The carbon chain structures may include functional groups that form bonds between the carbon chain structures.

Abstract: A method for forming fluorite from a F?-containing aqueous fluid, the method comprising: contacting a bioactive glass comprising calcium with the F?-containing aqueous fluid; and forming the fluorite. A filter media, and filter containing the filter media, for forming fluorite from a F?-containing aqueous fluid, the filter media comprising: a bioactive glass comprising calcium; and at least one of sand, gravel, charcoal, polymer particles, and ceramic particles.

Abstract: A memory device and a programming method thereof are provided. The memory device has multiple word lines and a dummy word line set. A word line is selected from the word lines and is applied with a program voltage, and unselected word lines and the dummy word line set are applied with a pass voltage. After programming the selected word line, a program verification is performed on the selected word line. When the selected word line passes the program verification, a high bound and/or low bound check for the threshold voltage distribution of at least one of the dummy word lines is performed. When at least one of the dummy word lines fails in the high bound and/or low bound check, the status of the selected word line is shown as fail or a flag is set thereto.

Abstract: A cross-shape transfer blade is configured to, in operation, be mounted or coupled to an end of a transfer robot arm (TRA). The cross-shape robot or transfer blade includes a plurality of raised regions to contact a backside of a workpiece or thin workpiece such that the cross-shape transfer blade supports and transports the respective workpeice between various locations within a semiconductor manufacturing plant (FAB). The cross-shape transfer blade includes a first prong structure, a second prong structure, a first wing structure, and a second wing structure. Respective ones of the plurality of raised regions are at corresponding ones of the first prong structure, the second prong structure, the first wing structure, and the second wing structure minimizing contact between the backside of the workpiece or thin workpiece and the cross-shape transfer blade when the workpiece or thin workpiece is being transferred, transported, and supported by the cross-shape transfer blade.

Abstract: Methods and systems for improving the efficiency of an automated material handling system (AMHS) include providing an apparatus operatively coupled to a load port of a processing apparatus, where the apparatus is configured to remove a first work-in-process from the load port and to move the first work-in-process along a first direction to displace the first work-in-progress from the load port while a second work-in-progress is transferred to the load port from an AMHS vehicle along a second direction that is perpendicular to the first direction, and transferring the first work-in-progress to an AMHS vehicle along the second direction. The methods and systems may be used for loading and unloading wafer storage containers, such as front opening unified pods (FOUPs), in a semiconductor fabrication facility.

Abstract: Provided is a method for saving energy, which is applicable to a terminal. The method includes performing an operation associated with network energy saving. Provided further is a terminal. The terminal includes: a processor, a transceiver connected to the processor, and a memory configured to store one or more runnable programs of the processor, where the processor, when loading and running the one or more runnable programs, is caused to perform an operation associated with network energy saving.