Abstract: An integrated circuit includes a semiconductor substrate and a plurality of circuit elements in or on the substrate. The circuit elements are defined by standard layout cells selected from a cell library. The circuit elements including a plurality of flip-flops. Each flip-flop has a data input terminal, a data output terminal, a clock input terminal, and a clock output terminal. A first one of the flip-flops directly abuts a second flip-flop such that the clock output terminal of the first flip-flop electrically connects with the clock input terminal of the second flip-flop.

Abstract: The present disclosure provides a structure and a method to reduce electro-migration. An interconnect structure according to the present disclosure includes a conductive feature embedded in a dielectric layer, a capping barrier layer disposed over the conductive feature and the dielectric layer, and an adhesion layer sandwiched between the capping barrier layer and the dielectric layer. The adhesion layer includes a degree of crystallinity between about 40% and about 70%.

Abstract: A method for manufacturing a semiconductor device includes forming one or more fins extending in a first direction over a substrate. The one or more fins include a first region along the first direction and second regions on both sides of the first region along the first direction. A dopant is implanted in the first region of the fins but not in the second regions. A gate structure overlies the first region of the fins and source/drains are formed on the second regions of the fins.

Abstract: A pushing lever structure of a ratchet wrench is provided. The ratchet wrench has a head portion. A ratchet gear, a toothed element, and a pushing lever are mounted in a receiving space of the head portion. A rear peripheral surface portion of the toothed element is provided with a recess. A pushing block extending forward from the pushing lever extends into the recess of the toothed element. When rotated, the pushing lever can move the toothed element effectively because it is the pushing block of the pushing lever that drives the toothed element into displacement. The bottom side of the head portion is mounted with a cover plate, and the bottom end of the pushing lever is pivotally provided on the cover plate to enhance the rotation stability of the pushing lever.

Abstract: A manufacturing method of a semiconductor package is provided. The method includes: providing an initial rigid-flexible substrate, wherein the initial rigid-flexible substrate includes rigid structures and a flexible core laterally penetrating through the rigid structures, and further includes a supporting frame connected to the rigid structures; bonding a package structure onto the initial rigid-flexible substrate, wherein the package structure includes semiconductor dies and an encapsulant laterally surrounding the semiconductor dies; and removing the supporting frame.

Abstract: An integrated circuit (IC) device includes a substrate having opposite first and second sides, an active region over the first side of the substrate, a first conductive pattern over the active region, and a second conductive pattern under the second side of the substrate. The active region includes a first portion and a second portion. The first conductive pattern is electrically coupled to the first portion and the second portion of the active region. The second conductive pattern is electrically coupled to the first portion and the second portion of the active region.

Abstract: In a method of manufacturing a semiconductor device, a layout is prepared. The layout includes active region patterns, each of the active region patterns corresponding to one or two fin structures, first fin cut patterns and second fin cut patterns. At least one pattern selected from the group consisting of the first fin cut patterns and the second fin cut patterns has a non-rectangular shape. The layout is modified by adding one or more dummy active region patterns and by changing the at least one pattern to be a rectangular pattern. Base fin structures are formed according to a modified layout including the active region patterns and the dummy active region patterns. Part of the base fin structures is removed according to one of a modified layout of the first fin cut patterns and a modified layout of the second fin cut patterns.

Abstract: The present disclosure provides a method of fabricating a semiconductor device. The method includes: providing a semiconductor substrate comprising a memory region and a logic region; forming a memory gate in or on the memory region; forming a plurality of first poly-silicon gates on the memory region and surrounding the memory gate; and forming a plurality of second poly-silicon gates on the logic region simultaneously with the formation of the first poly-silicon gates.

Abstract: A non-access point (non-AP) station (STA) multi-link device (MLD) receives a transmission from an access point (AP) MLD. In response to receiving the transmission, the non-AP STA MLD communicates with the AP MLD using an increased number of spatial streams with multi-link dynamic antenna switching at the non-AP STA MLD.

Abstract: A lightweight socket structure is composed of a fastening end and a driving end, wherein the driving end has a plurality of side connecting surfaces and at least two first holes. The side connecting surfaces are connected around the driving end. Two of the first holes penetrate the driving end symmetrically with respect to the central axis of the lightweight socket structure. The weight of the lightweight socket structure is decreased by the provision of the first holes. The provision of the side connecting surfaces allows the driving end to be connected with force application tools of different types.

Abstract: A wavelength conversion element includes a substrate and a wavelength conversion layer. The substrate has a bearing surface and a first positioning portion, and the first positioning portion is located on the bearing surface. The wavelength conversion layer is disposed on the bearing surface and has a second positioning portion corresponding to the first positioning portion, and the second positioning portion is adapted to engage with the first positioning portion. A projection apparatus having the wavelength conversion element is also provided. The disclosure is able to improve assemble accuracy and light conversion efficiency of the wavelength conversion element.

Abstract: A wireless input apparatus is provided, applied to a computer host. The wireless input apparatus includes a wireless dongle and an input module. The wireless dongle is physically connected to the computer host to receive an effect command, and includes a data segmentation unit and a first transceiver unit. The data segmentation unit segments the effect command into a plurality of data segments. The first transceiver unit sequentially transmits the plurality of data segments outwards. The input module includes a second transceiver unit, a merging unit, an effect generation unit, and a control unit. The second transceiver unit is coupled to the first transceiver unit to sequentially receive the plurality of data segments. The merging unit merges the plurality of data segments into the effect command. The control unit receives the effect command, and controls the effect generation unit to generate an effect according to the effect command.

Abstract: A method of manufacturing a semiconductor device based on a dual-architecture-compatible design includes: forming transistor components of in a transistor (TR) layer; and performing one of fabricating additional components according to (A) a buried power rail (BPR) type of architecture or (B) a non-buried power rail (non-BPR) type of architecture. The step (A) includes, in corresponding sub-TR layers, forming various non-dummy sub-TR structures, and, in corresponding supra-TR layers, forming various dummy supra-TR structures which are corresponding first artifacts. The step (B) includes, in corresponding supra-TR layers, forming various non-dummy supra-TR structures and forming various dummy supra-TR structures which are corresponding second artifacts, the first and second artifacts resulting from the dual-architecture-compatible design being suitable to adaptation into the BPR type of architecture.

Abstract: A reflective mask includes a substrate, a reflective multilayer disposed on the substrate, a capping layer disposed on the reflective multilayer, and an absorber layer disposed on the capping layer. The absorber layer includes a base material made of one or more of a Cr based material, an Ir based material, a Pt based material, or Co based material, and further contains one or more additional elements selected from the group consisting of Si, B, Ge, Al, As, Sb, Te, Se and Bi.

Abstract: A wavelength conversion element includes a substrate, an adhesion layer and a wavelength conversion material. The substrate has a bearing surface having an adhesion zone. The adhesion zone has a central portion and two edge portions respectively on two sides of the central portion. The adhesion layer is disposed on the adhesion zone and includes a first adhesive and a second adhesive. The first adhesive is disposed at the edge portions. The second adhesive is disposed at the central portion. Operating temperature of the first adhesive is lower than operating temperature of the second adhesive. Viscosity of the first adhesive is larger than viscosity of the second adhesive. The wavelength conversion material is fixed on the bearing surface by the first adhesive and the second adhesive. A projection apparatus having the wavelength conversion element is provided, and the durability of the wavelength conversion element and the projection apparatus is improved.

Abstract: The disclosure provides a multi-voltage chip, including a regulator circuit, a high-voltage domain controller, a low-voltage domain controller, and a digital logic circuit. The regulator circuit receives and responds to a feedback signal, a regulating start signal, and a reference voltage to convert a system high voltage into a regulated voltage. The high-voltage domain controller receives a power signal and the system high voltage to provide the reference voltage and the regulating start signal. The low-voltage domain controller is coupled to the high-voltage domain controller and receives the regulated voltage to provide a system start signal in response to the regulating start signal. The digital logic circuit is coupled to the regulator circuit to receive the regulated voltage and provide the feedback signal, and is coupled to the low-voltage domain controller to operate in response to the system start signal.

Abstract: A pneumatic tool contains: a body, a drive unit, a piston element, at least one buffer, and a movable air tube. The body includes an intake head, a limiting sleeve, a switch, an air conduit, and a connection portion. The connection portion has a first guide element, a first guiding orifice, and the limiting sleeve has a shoulder. The drive unit includes a moving tube, a first segment, and a second segment. The moving tube has a protrusion, the second segment has a second guide element and a second guiding orifice. The moving tube has a coupling orifice and a cavity, and an air valve is defined between the cavity and the second guide element. One buffer is defined between the first guide element and the second guide element and includes a first through hole. The movable air tube includes an air inlet segment and an air outlet segment.

Abstract: An automatic capping machine for containers includes a main frame body with a workbench having a bottom conveyor belt disposed thereon, and a lining plate provided below the conveying side of the bottom conveyor belt. A fixed track and a rolling mechanism are disposed on the workbench, and there is a gap between the rolling surface of the rolling mechanism and the fixed track. At least one rolling gap is relatively defined and formed by the space between the rolling surface and the fixed track. The lateral state maintaining structure of a container is disposed above the conveying side of the bottom conveyor belt, so that the convex frame edge of the box body of the container is maintained and limited above the fixed track. A through air collision avoidance section is formed in the rolling section defined on the setting path of the lining plate.

Abstract: An antenna structure includes a radiating portion and a coupling portion. The radiating portion is electrically connected to a feed point for feeding current. The coupling portion is electrically connected to a ground point to be grounded. The coupling portion is spaced apart from the radiating portion. The radiating portion excites a first resonant mode for generating radiation signals in a first frequency band. The current flowing through the radiating portion is coupled to the coupling portion, and the coupling portion excites a second resonant mode and a third resonant mode for generating radiation signals in a second frequency band and a third frequency band. Frequencies of the first frequency band are higher than frequencies of the second frequency band. Frequencies of the third frequency band are higher than frequencies of the first frequency band.

Abstract: An embodiment of present invention discloses a light-emitting device which includes a first light-emitting area, a second light-emitting area, and a third light-emitting area. The first light-emitting area emits a red light and includes a first light-emitting unit. The second light-emitting area emits a blue light and includes a second light-emitting unit. The third light-emitting area emits a green light and includes a third light-emitting unit. The first light-emitting area is larger than the second light-emitting area and larger than the third light-emitting area. Each of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit has a width of less than 100 ?m and a length of less than 100 ?m.