Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.

Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.

Abstract: A focus ring for a plasma-based semiconductor processing tool is designed to provide and/or ensure etch rate uniformity across a wafer during a plasma etch process. The focus ring may include an angled inner wall that is angled away from a center of the focus ring to direct a plasma toward the wafer. The angle of the angled inner wall may be greater than approximately 130 degrees relative to the top surface of the wafer and/or may be less than approximately 50 degrees relative to an adjacent lower surface of the focus ring to reduce and/or eliminate areas of overlapping plasma on the wafer (which would otherwise cause non-uniform etch rates). Moreover, an inner diameter may be configured to be in a range of approximately 209 millimeters to 214 millimeters to further reduce and/or eliminate areas of overlapping plasma on the wafer.

Abstract: A magnetically attracted fan set comprises N+1 fans, the N?1, and each of the N+1 fans has a fan frame and an airflow generating component disposed on the fan frame. Any two adjacent fans of the N+1 fans respectively have a joint surface, each of the joint surfaces has at least one fixing member capable of forming magnetic attraction, when the joint surface is close to the other joint surface at a distance sufficient for the two fixing members on the two joint surfaces to form magnetic attraction, two of the N+1 fans are joined together. Accordingly, the invention is capable of directly and quickly joining the N+1 fans without requiring complicated assembly gestures or other external components.

Abstract: Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.

Abstract: The invention provides a photoelectric energy conversion device applied to a power conversion circuit to replace a magnetic component which is widely used in a power conversion circuit. The photoelectric energy conversion device includes a shell, at least one light generator, and at least one photovoltaic generator, wherein the at least one light generator and the at least one photovoltaic generator are packaged in the shell. The at least one photovoltaic generator receives light generated in the shell by the at least one light generator and generates electric energy based on the light, and the at least one photovoltaic generator serves as a power supply source for a back-end circuit of the photoelectric energy conversion device.

Abstract: A focus ring for a plasma-based semiconductor processing tool is designed to provide and/or ensure etch rate uniformity across a wafer during a plasma etch process. The focus ring may include an angled inner wall that is angled away from a center of the focus ring to direct a plasma toward the wafer. The angle of the angled inner wall may be greater than approximately 130 degrees relative to the top surface of the wafer and/or may be less than approximately 50 degrees relative to an adjacent lower surface of the focus ring to reduce and/or eliminate areas of overlapping plasma on the wafer (which would otherwise cause non-uniform etch rates). Moreover, an inner diameter may be configured to be in a range of approximately 209 millimeters to 214 millimeters to further reduce and/or eliminate areas of overlapping plasma on the wafer.

Abstract: A magnetically attracted fan set comprises N+1 fans, the N?1, and each of the N+1 fans has a fan frame and an airflow generating component disposed on the fan frame. Any two adjacent fans of the N+1 fans respectively have a joint surface, each of the joint surfaces has at least one fixing member capable of forming magnetic attraction, when the joint surface is close to the other joint surface at a distance sufficient for the two fixing members on the two joint surfaces to form magnetic attraction, two of the N+1 fans are joined together. Accordingly, the invention is capable of directly and quickly joining the N+1 fans without requiring complicated assembly gestures or other external components.

Abstract: The present invention provides a fan speed control method for avoiding inaccurate control caused by sudden changes in a power supply output state, including the steps of: acquiring an output current value of a power supply device; and then, determining a change of the output current value in a sampling timeframe, if a slope representing the change is positive, controlling the control signal generating unit to gradually replace the fan control signal currently output to the fan with another fan control signal on the basis of a first latency, and if the slope representing the change is negative, controlling the control signal generating unit to gradually replace the fan control signal currently output to the fan with another fan control signal on the basis of a second latency. The first latency and the second latency are determined by the output current value, respectively.

Abstract: The invention provides a photoelectric energy conversion device applied to a power conversion circuit to replace a magnetic component which is widely used in a power conversion circuit. The photoelectric energy conversion device includes a shell, at least one light generator, and at least one photovoltaic generator, wherein the at least one light generator and the at least one photovoltaic generator are packaged in the shell. The at least one photovoltaic generator receives light generated in the shell by the at least one light generator and generates electric energy based on the light, and the at least one photovoltaic generator serves as a power supply source for a back-end circuit of the photoelectric energy conversion device.

Abstract: The present invention provides a fan speed control method for avoiding inaccurate control caused by sudden changes in a power supply output state, including the steps of: acquiring an output current value of a power supply device; and then, determining a change of the output current value in a sampling timeframe, if a slope representing the change is positive, controlling the control signal generating unit to gradually replace the fan control signal currently output to the fan with another fan control signal on the basis of a first latency, and if the slope representing the change is negative, controlling the control signal generating unit to gradually replace the fan control signal currently output to the fan with another fan control signal on the basis of a second latency. The first latency and the second latency are determined by the output current value, respectively.

Abstract: The invention provides a power supply structure of a desktop computer, a mainboard to which the desktop computer belongs comprises a mainboard power input port. The power supply structure comprises a cabinet, a power supply device, a power adapting device and a mainboard power supply line. The cabinet comprises a cabinet inner space and a bearing plate. The cabinet inner space is divided into a mainboard mounting side provided for the mainboard to be disposed thereon and a back side. The bearing plate comprises a first through hole. The power adapting device is disposed in the cabinet and located at the back side. The power adapting device comprises a power source input port and a mainboard power supply port penetrating through the first through hole. The mainboard power supply line is connected with the mainboard power supply port and the mainboard power input port.

Abstract: The invention provides a power supply structure of a desktop computer, a mainboard to which the desktop computer belongs comprises a mainboard power input port. The power supply structure comprises a cabinet, a power supply device, a power adapting device and a mainboard power supply line. The cabinet comprises a cabinet inner space and a bearing plate. The cabinet inner space is divided into a mainboard mounting side provided for the mainboard to be disposed thereon and a back side. The bearing plate comprises a first through hole. The power adapting device is disposed in the cabinet and located at the back side. The power adapting device comprises a power source input port and a mainboard power supply port penetrating through the first through hole. The mainboard power supply line is connected with the mainboard power supply port and the mainboard power input port.

Abstract: A method for processing a semiconductor wafer is provided. The method includes placing a semiconductor wafer on a wafer chuck. The method further includes performing a process over the wafer. The method also includes supplying a cooling gas to the backside of the semiconductor wafer via a groove and a number of ventilation apertures located in the groove. Two of the neighboring ventilation apertures are separated in a circumferential direction relative to the center of the wafer chuck by a predetermined angle that is less than 90 degrees.

Abstract: A transparent film is used with a projector which emits a projected light. The transparent film includes a transparent substrate; a light-scattering layer disposed at an upstream position of the transparent substrate with respect to the projected light, and including a plurality of microstructures configured to scatter the projected light; and a light-blocking layer disposed at an upstream position of the light-scattering layer with respect to the projected light, and including a plurality of separate light-blocking units, which are configured to partially block the projected light and partially allow the projected light to reach the light-scattering layer.

Abstract: A projection apparatus includes a light source, a light reflective member, a light valve, and a light beam adjusting member. The light source is configured to provide an illumination beam. The light reflective member is configured to reflect the illumination beam. The light valve is configured to convert the illumination beam reflected by the light reflective member into an image beam. The light beam adjusting member is optically coupled between the light source and the light reflective member and includes a collimating lens module. The collimating lens module has a light entering surface and a light leaving surface respectively at opposite sides thereof. The light entering surface and the light leaving surface respectively have a first optical axis and a second optical axis extending along different directions.

Abstract: A transparent film is used with a projector which emits a projected light. The transparent film includes a transparent substrate; a light-scattering layer disposed at an upstream position of the transparent substrate with respect to the projected light, and including a plurality of microstructures configured to scatter the projected light; and a light-blocking layer disposed at an upstream position of the light-scattering layer with respect to the projected light, and including a plurality of separate light-blocking units, which are configured to partially block the projected light and partially allow the projected light to reach the light-scattering layer.