Patents by Inventor An Hung Chung
An Hung Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12007194Abstract: A pneumatic valve mechanism disposed in a toy gun includes a trigger with an action bar, a driving assembly and a firing assembly. The driving assembly is disposed pivotally on the toy gun and linked with a shaft to pivot by the action bar. The firing assembly has a pushing portion and a triggering portion disposed oppositely to the pushing portion. The triggering portion makes the firing assembly reciprocate by an elastic member. The shaft is disposed with a pushing surface. The pushing surface pushes the triggering portion of the firing assembly when the shaft rotates pivotally.Type: GrantFiled: October 20, 2022Date of Patent: June 11, 2024Assignee: VEGA FORCE INTERNATIONAL CORP.Inventors: Shih-Che Kung, Wei-Hung Chung
-
Patent number: 12007280Abstract: Systems, apparatuses, and methods for multi-application optical sensing are provided. For example, an optical sensing apparatus can include a photodetector array, a first circuitry, and a second circuitry. The photodetector array includes a plurality of photodetectors, wherein a first subset of the plurality of photodetectors are configured as a first region for detecting a first optical signal, and a second subset of the plurality of photodetectors are configured as a second region for detecting a second optical signal. The first circuitry, coupled to the first region, is configured to perform a first function based on the first optical signal to output a first output result. The second circuitry, coupled to the second region, is configured to perform a second function based on the second optical signal to output a second output result.Type: GrantFiled: March 6, 2023Date of Patent: June 11, 2024Assignee: ARTILUX, INC.Inventors: Chih-Wei Yeh, Hung-Chih Chang, Yun-Chung Na, Tsung-Ting Wu, Shu-Lu Chen
-
Patent number: 12002251Abstract: A method for inputting an image display information is provided, and the method comprises: taking a measurement result image of a measuring device to obtain an output image by a camera of a terminal device; transmitting the output image to a cloud server via a communication interface of the terminal device; and recognizing the output image to obtain a recognized matching result related to a recognized measurement value and a recognized measurement unit; and saving the recognized matching result via the cloud server.Type: GrantFiled: March 9, 2021Date of Patent: June 4, 2024Assignee: MEIYO MEDICAL TECHNOLOGY INCInventors: Hung-Wen Chen, Chien-Chung Liao, Hung-Hsiang Ku
-
Publication number: 20240175649Abstract: A heat exchange tube is used to solve the problem of insufficient heat exchange efficiency of the conventional heat exchange tube. The heat exchange tube includes a tube, a first porous layer, and a second porous layer. The tube includes an inner wall. The first porous layer includes a plurality of holes. The first porous layer is disposed on the inner wall of the tube. The second porous layer includes a plurality of holes. The second porous layer is disposed on an inner surface of the first porous layer. An average diameter of the plurality of holes of the second porous layer is greater than an average diameter of the plurality of holes of the first porous layer. A method for manufacturing a heat exchange tube is also disclosed.Type: ApplicationFiled: November 30, 2022Publication date: May 30, 2024Inventors: Yu-Lin CHUNG, Chia-Hung HUANG, Jiun-Cherng LIU, Chi-Huei CHEN
-
Publication number: 20240175655Abstract: A toy gun having embedded magazine includes: a gun body having a bullet feeding slot; a top magazine cover pivotally connected at a top end of the gun body and having an accommodating slot and a first latching structure disposed on one side facing the gun body, the first latching structure is located at one lateral side of the accommodating slot; and a magazine assembly detachably disposed in the accommodating slot and having a main body, the main body has a bullet discharging funnel and a second latching structure, the second latching structure is correspondingly latched with the first latching structure; when the top magazine cover pivotally rotates from top to down to cover on top of the gun body, the bullet discharging funnel is correspondingly disposed in the bullet feeding slot. Accordingly, the magazine is embedded and hidden in the top magazine cover.Type: ApplicationFiled: January 12, 2023Publication date: May 30, 2024Inventors: SHIH-CHE KUNG, WEI-HUNG CHUNG
-
Publication number: 20240170896Abstract: A composite mounting type electrical connector includes an insulating shell, a plurality of terminals and a plurality of shielding members. The plurality of terminals are arranged in two rows parallel to each other, and a plurality of shielding members are arranged between the two rows of terminals and separated from each other by a predetermined distance to form insulation. The two rows of terminals are soldered to a circuit board by surface mounting technology and dual in line package process respectively. The ground terminals in the two columns of terminals are commonly connected to a shield spacer to form a common ground structure. The power terminals in the two columns of terminals are commonly connected to another shielding member to form a parallel connecting structure. The shielding members produce a shielding effect between two rows of terminals, which can prevent crosstalk therebetween.Type: ApplicationFiled: May 27, 2023Publication date: May 23, 2024Inventors: MING LUO, YUNG- CHANG LIN, YU-HUNG LIN, HUNG-TIEN CHANG, HSUAN HO CHUNG
-
Publication number: 20240162169Abstract: An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.Type: ApplicationFiled: December 12, 2023Publication date: May 16, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Yu-Lung Huang, Chee-Key Chung, Yuan-Hung Hsu, Chi-Jen Chen
-
Publication number: 20240162109Abstract: In an embodiment, a package includes an integrated circuit device attached to a substrate; an encapsulant disposed over the substrate and laterally around the integrated circuit device, wherein a top surface of the encapsulant is coplanar with the top surface of the integrated circuit device; and a heat dissipation structure disposed over the integrated circuit device and the encapsulant, wherein the heat dissipation structure includes a spreading layer disposed over the encapsulant and the integrated circuit device, wherein the spreading layer includes a plurality of islands, wherein at least a portion of the islands are arranged as lines extending in a first direction in a plan view; a plurality of pillars disposed over the islands of the spreading layer; and nanostructures disposed over the pillars.Type: ApplicationFiled: January 10, 2023Publication date: May 16, 2024Inventors: Hung-Yi Kuo, Chen-Hua Yu, Kuo-Chung Yee, Yu-Jen Lien, Ke-Han Shen, Wei-Kong Sheng, Chung-Shi Liu, Szu-Wei Lu, Tsung-Fu Tsai, Chung-Ju Lee, Chih-Ming Ke
-
Publication number: 20240155927Abstract: A display device includes a display panel, a window disposed on the display panel, and a window protection layer disposed on the window, wherein at least one of the display panel or the window protection layer selectively absorbs light in a yellow-green hue, a green-blue hue, or a blue-red hue.Type: ApplicationFiled: November 2, 2023Publication date: May 9, 2024Inventors: SEUNGHWAN CHUNG, HUNG KUN AHN, MINSU KIM
-
Publication number: 20240145378Abstract: An interconnect structure on a semiconductor die includes: a lower conductive layer; an upper conductive layer disposed above the lower conductive layer; and a VIA disposed between the lower conductive layer and the upper conductive layer. The VIA includes: a primary interconnect structure and a sacrificial stress barrier ring disposed around the primary interconnect structure and separated a distance from the primary interconnect structure. A fabrication method for the interconnect structure includes: forming a dielectric layer over a lower conductive layer; patterning photoresist (PR) layer over the dielectric layer to define a location for a plurality of VIA trenches, wherein the patterning includes patterning the PR layer to provide a center opening for the VIA trenches that is surrounded by a ring opening for the VIA trenches, wherein the center opening and the ring opening are spaced apart.Type: ApplicationFiled: February 7, 2023Publication date: May 2, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tzu-Ting Liu, Chen-Chiu Huang, Dian-Hau Chen, Hung-Chao Kao, Hsiang-Ku Shen, Wen-Chiung Tu, Li Chung Yu, Yu-Chung Lai
-
Publication number: 20240128122Abstract: Semiconductor package includes substrate, first barrier layer, second barrier layer, routing via, first routing pattern, second routing pattern, semiconductor die. Substrate has through hole with tapered profile, wider at frontside surface than at backside surface of substrate. First barrier layer extends on backside surface. Second barrier layer extends along sidewalls of through hole and on frontside surface. Routing via fills through hole and is separated from sidewalls of through hole by at least second barrier layer. First routing pattern extends over first barrier layer on backside surface and over routing via. First routing pattern is electrically connected to end of routing via and has protrusion protruding towards end of routing via in correspondence of through hole. Second routing pattern extends over second barrier layer on frontside surface. Second routing pattern directly contacts another end of routing via. Semiconductor die is electrically connected to routing via by first routing pattern.Type: ApplicationFiled: December 25, 2023Publication date: April 18, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chung Chang, Ming-Che Ho, Hung-Jui Kuo
-
Patent number: 11955507Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.Type: GrantFiled: September 9, 2021Date of Patent: April 9, 2024Assignee: AU OPTRONICS CORPORATIONInventors: Hsin-Hung Li, Wei-Syun Wang, Chih-Chiang Chen, Yu-Cheng Shih, Cheng-Chan Wang, Chia-Hsin Chung, Ming-Jui Wang, Sheng-Ming Huang
-
Patent number: 11953282Abstract: A simulated shaking bullet chain type toy gun equipped with a bullet chain is provided. The toy gun includes a gun body, an actuated member, and a bolt assembly and a reciprocating assembly both reciprocatingly disposed in the gun body. The reciprocating assembly is linked to the bolt assembly and has a trigger portion reciprocating with the reciprocating assembly to produce a moving path. The actuated member is installed in the gun body and located on the moving path, and connected to the bullet chain. The reciprocating assembly reciprocates to trigger the actuated member by the trigger portion, and the actuated member links the bullet chain to shake, so as to achieve a high degree of simulation of the shaking effect of the bullet chain.Type: GrantFiled: March 29, 2022Date of Patent: April 9, 2024Assignee: VEGA FORCE INTERNATIONAL CORP.Inventors: Shih-Che Kung, Wei-Hung Chung
-
Publication number: 20240113345Abstract: A battery module and a short protection method thereof are provided. The battery module has a battery cell pack and a control circuit. The method includes: detecting a temperature of the battery cell pack as a battery cell temperature through the control circuit; determining whether the battery cell temperature shows a downward trend when the battery cell temperature is higher than a first predetermined temperature value; and deactivating the battery module when the battery cell temperature does not show the downward trend.Type: ApplicationFiled: May 23, 2023Publication date: April 4, 2024Applicant: ASUSTeK COMPUTER INC.Inventors: Chunyen Lai, Yu-Cheng Shen, Chun Tsao, Chaochan Tan, Huichuan Lo, Wen-Che Chung, Ming Hung Yao
-
Publication number: 20240101527Abstract: A compound of Formula (I) below, or a pharmaceutically acceptable salt, stereoisomer, solvate, or prodrug thereof: in which R1, R2, R3, R5, R6, and R7 are defined as in the SUMMARY section. Further disclosed are a method of using the above-described compound, salt, stereoisomer, solvate, or prodrug for treating microbial infections and a pharmaceutical composition containing the same.Type: ApplicationFiled: October 23, 2020Publication date: March 28, 2024Applicant: TAIGEN BIOTECHNOLOGY CO., LTD.Inventors: Chu-Chung Lin, Hung-Chuan Chen, Chiayn Chiang, Chih-Ming Chen
-
Publication number: 20240103199Abstract: A window includes a base layer, a high refractive layer disposed on the base layer, and a low refractive layer disposed on the high refractive layer. The high refractive layer includes inorganic particles and a base resin, and the low refractive layer includes a fluorine-containing silsesquioxane-based resin.Type: ApplicationFiled: September 7, 2023Publication date: March 28, 2024Inventors: HUNG KUN AHN, Seunghwan CHUNG, Sang-il PARK, Minseong BYEON
-
Patent number: 11940737Abstract: A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.Type: GrantFiled: May 7, 2021Date of Patent: March 26, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Hsueh-Yi Chung, Yung-Cheng Chen, Fei-Gwo Tsai, Chi-Hung Liao, Shih-Chi Fu, Wei-Ti Hsu, Jui-Ping Chuang, Tzong-Sheng Chang, Kuei-Shun Chen, Meng-Wei Chen
-
Publication number: 20240096757Abstract: An integrated circuit (IC) die includes first through third adjacent rows of through-silicon vias (TSVs), and first and second adjacent rows of memory macros. TSVs of the first row of TSVs extend through and are electrically isolated from memory macros of the first row of memory macros. TSVs of the third row of TSVs extend through and are electrically isolated from memory macros of the second row of memory macros.Type: ApplicationFiled: November 30, 2023Publication date: March 21, 2024Inventors: Hidehiro FUJIWARA, Tze-Chiang HUANG, Hong-Chen CHENG, Yen-Huei CHEN, Hung-Jen LIAO, Jonathan Tsung-Yung CHANG, Yun-Han LEE, Lee-Chung LU
-
Publication number: 20240096849Abstract: A semiconductor structure includes a semiconductor die, a redistribution circuit structure, and a terminal. The redistribution circuit structure is disposed on and electrically coupled to the semiconductor die. The terminal is disposed on and electrically coupled to the redistribution circuit structure, where the redistribution circuit structure is disposed between the semiconductor die and the terminal, and the terminal includes an under-bump metallization (UBM) and a capping layer. The UBM is disposed on and electrically coupled to the redistribution circuit structure, where the UBM includes a recess. The capping layer is disposed on and electrically coupled to the UBM, where the UBM is between the capping layer and the redistribution circuit structure, and the capping layer fills the recess of the UBM.Type: ApplicationFiled: January 9, 2023Publication date: March 21, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chung Chang, Ming-Che Ho, Hung-Jui Kuo
-
Patent number: D1024932Type: GrantFiled: March 10, 2022Date of Patent: April 30, 2024Assignee: WALSIN LIHWA CORPORATIONInventors: Ko-Ming Chen, Shih-Hsiang Wang, An-Hung Lin, Min-Chuan Wu, Shao-Pei Lin, Chien-Chung Ni, Chun-Ying Lin