Abstract: A method of manufacturing a semiconductor device, includes: supplying precursor gas into process chamber in which plural substrates are accommodated by sequentially performing: supplying inert gas at first inert gas flow rate from first nozzle into the process chamber; supplying the inert gas at second inert gas flow rate higher than the first inert gas flow rate from the first nozzle into the process chamber while supplying precursor gas from the first nozzle into the process chamber; and supplying the inert gas at the first inert gas flow rate from the first nozzle into the process chamber while the process chamber is evacuated from an upstream side of flow of the precursor gas; stopping supply of the precursor gas; removing the precursor gas remaining in the process chamber; supplying reaction gas from a second nozzle into the process chamber; and removing the reaction gas remaining in the process chamber.

Abstract: Progressive addition lens includes a near portion having a power for viewing a near field, a distance portion having a power for viewing a distance field further than the near field, and an intermediate portion connecting the distance portion and the near portion. The progressive addition lens includes an aspherical object-side surface and an aspherical eyeball-side surface and is formed in rotational symmetry with respect to a center of design of the progressive addition lens. The object-side surface includes a first stable region formed in rotational symmetry with respect to the center of design and including the center of design, and an aspherical region arranged outside of the first stable region to contact the first stable region and formed in rotational symmetry with respect to the center of design. A Peak to Valley value of a mean surface refractive power in the first stable region is 0.12 D or less.

Abstract: An insulated wire includes a conductor, a flame-retardant inner layer that is provided around the conductor and includes a metal hydroxide, and a water ingress prevention layer provided around the flame-retardant inner layer. The insulated wire may further include a flame-retardant outer layer provided around the water ingress prevention layer.

Abstract: Described herein is a technique capable of improving the controllability of a thickness of a film formed on a large surface area substrate having a surface area greater than a surface area of a bare substrate and improving the thickness uniformity between films formed on a plurality of large surface area substrates accommodated in a substrate loading region by reducing the influence of the surface area of the large surface area substrate and the number of the large surface area substrates due to a loading effect even when the plurality of large surface area substrates are batch-processed using a batch type processing furnace.

Abstract: A semiconductor light emitting device according to an embodiment includes a stacked body. The stacked body includes a first semiconductor layer of a first conductivity type, a light emitting layer is provided on the first semiconductor layer, and a second semiconductor layer of a second conductivity type provided on the light emitting layer. The stacked body includes a first protrusion on an upper surface of the stacked body. The first protrusion protrudes in a first direction from the first semiconductor layer to the light emitting layer. Length of the first protrusion in a second direction perpendicular to the first direction decreases toward the first direction. The first protrusion includes a first portion and a second portion. The first portion has a first side surface inclined with respect to the first direction. The second portion is provided below the first portion and having a second side surface inclined with respect to the first direction.

Abstract: A method of manufacturing a semiconductor device, includes rotating a substrate support tool accommodated in a process chamber and configured to support a substrate with a rail, and supplying a process gas including a first gas to the substrate from a first gas supply hole positioned at an outer side of the substrate in a horizontal direction while rotating the substrate support tool. In the act of supplying the process gas, the first gas is supplied to the substrate in a first period in which the rail is not positioned between the first gas supply hole and the substrate in the horizontal direction.

Abstract: A resin member including an annular portion that defines a through hole with a circular cross section, and made of a resin containing reinforcing fibers, where the resin member has at least one gate trace; a weld portion is formed in the annular portion; and in a case where a polished surface along a perpendicular-to-axial direction perpendicular to a central axis of the through hole is formed in the annular portion, a sum of valley widths at half-value Txxh in a fiber orientation tensor waveform is 1.20 mm or more.

Abstract: A battery pack includes: a cell group including a plurality of cylindrical cells that are arranged in a manner of log pile in contact with each other; and a metal frame that extends along the periphery of the cell group and surrounds the cell group. The cells located at the corners of the cell group that has a substantially rectangular shape when viewed from an end surface side in the axial direction of the cells, are in contact with the metal frame.

Abstract: A battery case containing an electrode group including an air electrode and a separator includes main walls on which the air electrode is opposingly disposed and a surrounding portion that is disposed at marginal portions of the main walls and that surrounds a side edge portion of the opposingly disposed air electrode. The surrounding portion is covered by an edge portion of the separator disposed opposing the air electrode.

Abstract: A wiring board includes: a ceramic board including a ceramic insulator layer composed mainly of ceramic, and a wiring disposed at the ceramic insulator layer; a first resin board and a second resin board each of which includes a resin insulator layer composed mainly of resin, and a wiring disposed at the resin insulator layer; and a metal member mounted to the second resin board. The first resin board is superposed to a first surface of the ceramic board. The second resin board is superposed to a second surface of the ceramic board opposite to the first surface of the ceramic board. The second resin board includes a joint pad at its first surface opposite to its second surface facing the ceramic board, the joint pad made of metal. The metal member is joined to the joint pad by brazing or soldering.

Abstract: A technology concerning a pair of spectacle lenses for binocular vision. In each of the pair of spectacle lenses for binocular vision, when an inner horizontal direction of each of the spectacle lenses is a direction toward the nose of a user who wears the spectacle lenses, and an outer horizontal direction of the spectacle lenses is a direction toward an ear of the user, a portion for viewing an object at finite distance is provided in each of the pair of spectacle lenses for binocular vision and a shape of a base in prism is formed in the position such that a line of sight of a user viewing an object through the portion is directed to a direction that is different from a direction from the object.

Abstract: A pair of spectacle lenses for binocular vision. In each of the pair of spectacle lenses for binocular vision, when an inner horizontal direction of each of the spectacle lenses is a direction toward the nose of a user who wears the spectacle lenses, and an outer horizontal direction of each of the spectacle lenses is a direction toward an ear of the user, a portion for viewing an object at finite distance is provided and a shape of a base out prism is formed in the position such that a line of sight of a user viewing an object through the portion is directed to a direction that is different from a direction from the object.

Abstract: A sealing composition for use in unit dose packages is provided, including: 70 to 98 wt % water; 1 to 30 wt % of a hydrogen bonding component; and 1 to 30 wt % of a complex forming component.

Abstract: A cord for reinforcing elastomers excellent in adhesion to elastomers such as rubber is provided. The cord is a cord for reinforcing elastomers (10) that includes metallic filaments (1) and a resin filament (2) twisted together, the resin filament (2) being made from a polymeric material having a melting point or softening point of 80 to 160° C.

Abstract: A semiconductor light emitting device according to an embodiment includes a stacked body. The stacked body includes a first semiconductor layer of a first conductivity type, a light emitting layer is provided on the first semiconductor layer, and a second semiconductor layer of a second conductivity type provided on the light emitting layer. The stacked body includes a first protrusion on an upper surface of the stacked body. The first protrusion protrudes in a first direction from the first semiconductor layer to the light emitting layer. Length of the first protrusion in a second direction perpendicular to the first direction decreases toward the first direction. The first protrusion includes a first portion and a second portion. The first portion has a first side surface inclined with respect to the first direction. The second portion is provided below the first portion and having a second side surface inclined with respect to the first direction.

Abstract: Described herein is a technique capable of improving the controllability of a thickness of a film formed on a large surface area substrate having a surface area greater than a surface area of a bare substrate and improving the thickness uniformity between films formed on a plurality of large surface area substrates accommodated in a substrate loading region by reducing the influence of the surface area of the large surface area substrate and the number of the large surface area substrates due to a loading effect even when the plurality of large surface area substrates are batch-processed using a batch type processing furnace.

Abstract: Disclosed is an operating device of a game machine which is installed in the game machine including a display portion which displays the progress of a game in accordance with a control of a body controller and a result of the game and operates the progress of the game in conjunction with a display on the display portion. This operating device includes a rotation operation portion capable of being rotated by a player, a rotation operation detecting portion which detects a state of rotation operation of the rotation operation portion, a decoration display portion which displays any one of a pattern, a symbol and a letter, or a combination thereof, and a connection portion which outputs a signal of the rotation operation detecting portion to the body controller and inputs a signal for controlling a display of the decoration display portion from the body controller.

Abstract: To provide a saddle type vehicle with a water cooled engine allowing simplification of the mounting structure for a thermostat and a check valve. A saddle type vehicle having a water cooled engine, includes: a thermostat provided in a cooling water path of the water cooled engine; and a check valve provided in a secondary air path supplying secondary air to an exhaust path of the water cooled engine, wherein a case of the thermostat and a case of the check valve are formed integrally. The case of the thermostat is formed in a cylindrical configuration, and the case of the check valve is integrally connected to the cylindrical side wall thereof.

Abstract: An imaging apparatus includes an exterior component; an image sensor disposed inside the exterior component, the image sensor including a board; a sheet body attached to the image sensor to dissipate heat generated by the image sensors; an elastic body configured to support the sheet body; and a holder configured to hold the elastic body. The sheet body includes a heat receiver attached to the board of the image sensor; and a heat dissipating section attached to the elastic body. The elastic body is compressively deformable between the exterior component and the holder to compress the heat dissipating section against an inner surface of the exterior component.

Abstract: A treatment instrument includes a first treatment portion including a first member with a first contact surface and a second member with a second contact surface; a movement mechanism to switch between a closed position where the first and second contact surfaces are close to each other and an open position where the first and second contact surfaces are separated each other; and a second treatment portion juxtaposed to the first treatment portion. A distal end of the second treatment portion is located at a distal side in the longitudinal axis than a distal end of the first treatment portion on the closed position.